congatec develops low-profile motherboards for industrial connected devices

congatec’s conga-IC175 is a thin -grade motherboard family that’s designed with Intel’s 7th Generation Core U (Kaby Lake) processor, aimed at connected applications, including those that are space-constrained, high-performance, and/or low-power. Besides all the enhancements of the new processor generation, they also offer comprehensive support including a SIM card socket for 3G/4G or Narrow Band connectivity and first versions of congatec’s -API.

The low profile Mini-ITX motherboards ship with four different dual-core processor variants and have a configurable cTDP from 7.5 W to 25 W. Two SO-DIMM sockets support up to 32 Gbytes of DDR4-2133 memory. For non-volatile memory, the boards offer one M.2 slot supporting Intel’s Optane memory. Two SATA 3.0 interfaces allow additional HDDs or SSDs to be connected. The industrial-grade I/O set includes two Gigabit Ethernet, one PCIe x4, one mPCIe for generic expansions, four USB 3.0, six USB 2.0, eight GPIO, and two serial COM ports.

The boards support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common operating systems.

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