Annual Innovation Awards

Embedded Computing Design’s Annual Top Embedded Innovator and Innovative Product Awards highlight the most influential people and products from the Embedded and Internet of Things industries over the past year.

[1] 2017 Top Embedded Innovators (People)

Embedded Computing Design invites members of the embedded and Internet of Things communities to nominate exceptional individuals for their contributions to technology, industry/market evangelism, philanthropic contribution, and business acumen. Nominees are judged by Embedded Computing Design’s esteemed Advisory Board, as well as its experienced content team comprised of Rich Nass, Curt Schwaderer, Brandon Lewis, and Jamie Leland. Judging is based on a 14-point rubric. Three entrants will be chosen as 2017’s Top Embedded Innovators based on the judges’ cumulative scores, with the winners receiving a plaque denoting their achievement and the opportunity to participate in an in-person video interview with members of the Embedded Computing Design content team.

Submission Form: http://opsy.st/2017InnovativePeople

Nomination Deadline: 3/31

Download Top Embedded Innovators Submission Guidelines, Criteria, and Rubric.



[Click to view 2016 Top Embedded Innovator Award Winners.]

Please contact Rich Nass, Executive Vice President, OpenSystems Media with questions: rnass@opensystemsmedia.com

[2] 2017 Most Innovative Products

The Most Innovative Products section allows vendors from the embedded and Internet of Things industries to submit their market-leading technology solutions released between April 1, 2016 and March 31, 2017 for consideration as one of the past year’s Most Innovative Products. Product submissions are graded by the Embedded Computing Design Content Team consisting of Rich Nass, Curt Schwaderer, Brandon Lewis, and Jamie Leland based on a 16-point rubric. All submissions are highlighted on the Embedded Commuting Design website and in the May/June 2017 Innovation Issue. Three finalists will be selected in each of the categories of Silicon, Software, and Systems based on the judges’ cumulative scores. All nine finalists will be featured on the cover of the ensuing 2017 Embedded Computing Design Resource Guide in July/August, with the company of the most highly graded product (1) from each category also receiving a plaque commemorating the accomplishment, as well as the opportunity to participate in a video interview with Embedded Computing Design’s content team.

Note: A $650 fee is associated with Innovative Product submissions to support printing and production costs.

Submission Form: http://opsy.st/2017InnovativeProducts

Nomination Deadline: 4/14

Download Most Innovative Products Submission Guidelines, Criteria, and Rubric.



[Click to view 2016 Most Innovative Product Award winners. | Click to view 2016 Most Innovative Product nominees.]

Please contact Patrick Hopper, Publisher, OpenSystems Media with questions: phopper@opensystemsmedia.com