With the ever increasing clinical need for implantable devices comes the continuous flow of technical challenges. As with commercial portable products, implantable devices share the same need to reduce size, weight and power (SWaP). Integrated circuits are only one component of an implantable medical device. Thus, the need for device integration becomes imperative. There are many challenges when creating an implantable medical device.


Advanced packaging technologies will also help reduce overall size and improve performance. Battery technology is another key component. Mechanical aspects of the design present similar challenges in size.


While this white paper focuses on the key electronic features of implantable circuits and the integration of these features into silicon, it will cover how Freescale and Cactus Semiconductor together can provide solutions that meet different aspects of the design. Freescale drives innovation and enables medical devices with their latest technology for microcontrollers, sensors, analog and wireless products.

The white paper will also explore the different ways a design can be partitioned as well as the trade-offs associated with those design choices. Finally, the white paper will briefly cover the key attributes required in the silicon technology used for implementing implantable integrated circuit (IC) designs.