ATCA7365 SystemPak

High performance, multiprocessing system platform designed to address compute-intensive requirements in command and control data center applications

Elma Electronic – Systems
July 19th, 2011
  • ATCA7365 SystemPak (from Elma Electronic ñ Systems)Combines the multiprocessing of an integrated platform with a ruggedized design capable of withstanding the high shock and vibration found in rugged mobile transport applications
  • Successfully tested to withstand a 36" drop shock test per MIL-STD-810G
  • Three AdvancedTCA processor blades, each with two six-core Intel processors as standard
  • High processing power for rugged Comms On The Move (COTM) applications such as and network-centric environments
  • switching for high speed data links
  • 96 GB of DDR memory per blade
  • 1.2 TB of storage
  • Delivered tested and verified with , and the processors are VMware certified
  • Mounted in a lightweight transit case
  • Can withstand a 36" drop test on two axes
  • Can endure random vibration up to 25 Gs per MIL-STD-810G
  • Operating temperature is 3 ºC to 37 ºC in 5 percent to 95 percent non-condensing humidity
  • Standard configuration includes an Elma Type 11A, 6U six-slot , a fully replicated mesh and a single system management card with a provision for dual management as well as redundant and power supplies
  • Four 300 GB SAS (serial-attached SCSI) drives and a 10 Gigabit Ethernet fabric switch blade with RTM (real-time monitoring) are also part of the ready-to-run unit
  • Optional customization includes 2U to 6U horizontal configurations and other designs to meet MIL-STD environmental requirements
  • Blades are available with a wide range of Intel processor options and offer sites for system I/O and storage expansion
  • The SystemPak can accommodate solid state and rotating drives as well as SATA drives in multi-TB configurations to fit most application requirements

Topics covered in this article

Home > Products > Elma Electronic – Systems

More from this issue:

What's popular:

Comments:

Silicon, software, and strategies for embedded devices
Embedded Computing Design magazine is the resource for engineers, architects, and decision makers involved with embedded devices. Topics explored span silicon, software, and strategies for designing and connecting with small devices in mobile, automotive, home, industrial, and medical applications. Departments include Deep Green discussing the latest in energy efficient, low power designs and applications. Content is available in print, E-letter, E-cast, white papers, video, RSS, social networks, and more. Subscriptions are free of charge.
©MMXIIEmbedded Computing Design.
An OpenSystems Media publication.