 | | Mezza-pede® low profile 1mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. |
| BGA Socket is designed for test, debug, and validation of 0.50 mm pitch BGA devices |
| Reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards |
| The new Mod5 Series Flip-Top(tm) BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. The new Mod5 Series design provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. |
| Designed for development, test and validation of 1.00mm pitch BGA and LGA devices at speeds up to 2.6GHz (single-ended), the compact design requires no soldering of the IC and needs no external hold-downs or tooling holes in the PC board. |
| 1 mm pitch low profile SMT connector for board to board and flex cable to board applications |
| At only 2.00mm larger than the device package, with no external hold-downs required, this patent pending design is perfect for development and validation of BGA and LGA devices, while offering superior electrical performance with very low signal attenuation up to 2.5GHz. |
| Mezza-pede SMT Connectors from Advanced Interconnections Corp. are now available with 36 positions |
| The B2B High Density SMT Connector 19.05 mm (.750 inch) mated height |
| Surface-mount PGA connector technology, which enables development of custom board-to-board connector system |
| New socket adapter system for 0.50mm pitch BGA or LGA device socketing (validation or production applications) or SMT board-to-board connector applications. |
| West Warwick, R.I., November 12 2009 – For applications that require low profile and customizable PCB configurations, Peel-A-Way(r) Removable Terminal Carriers are the perfect solution for device socketing and board-to-board interconnect. Compared to traditional molded insulators, the ultra-thin, .005" (0.13mm) polyimide film carrier, employing near flush solder tail terminals (Type -210), reduces component height above the PC board by as much as 80%, down to .015" (0.38mm). For board-to-board applications, standard spacing options range from .045" (1.14mm) to .250" (6.35mm) with custom options available to suit virtually any application. |
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