Availability of CEVA’s Dolby MS11 and Dolby Volume solutions provides significant cost and time-to-market advantages for customers’ next-generation home entertainment SoC designs

New DSP libraries for CEVA-XC significantly shorten time to market for multimode HSPA/HSPA+/LTE/LTE-A modem designs

New DSP libraries for CEVA-XC significantly shorten time to market for multimode HSPA/HSPA+/LTE/LTE-A modem designs

CEVA, Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Carbon Design Systems(tm), the leading supplier of solutions for architectural analysis, performance optimization and pre-silicon firmware debug, today announced the availability of fast simulation models for CEVA’s industry-leading CEVA-X and CEVA-XC DSP families, dramatically reducing customers’ hardware and software development time for next-generation System-on-Chip designs.

Full TD-LTE PHY functionality implemented on Mindspeed SoC

Xincomm adopts high-performance CEVA-X DSP core for 4G TDD/FDD-LTE terminal processors

Mindspeed Incorporates CEVA-XC323 Communication Processor into its Next-Generation Transcede(tm) eNodeB Solutions for Wireless Base Stations

LTE reference architectures lower overall cost and accelerate time-to-market for semiconductor vendors and OEMs

CEVA-X1643(tm)builds on highly successful CEVA-X architecture; Incorporates native cached memory system, innovative power scaling unit and configurable ARM AXI bus interface