 | | conga-TM77 offers increased computing performance with improved energy efficiency |
| With this solution it becomes possible to cool next generation high-performance processors with a power dissipation of well over 35W TDP. |
| The conga-QMX6 runs on Freescale’s new i.MX6 ARM Cortex A9 processors; it’s trump cards include broad scalability, long-term availability, an extended temperature range and, above all, low power dissipation of less than 5W |
| Computer modules from congatec with AMD Fusion technology provide OpenCL support for ETX, XTX, COM Express and Qseven standards |
| The new conga-TM67 is based on the Type 6 pin-out and supports the Intel(r) i7-2710QE quad-core processor (2.1 GHz, 45W, PGA) and others |
| The easy-to-integrate mini carrier board is packed with a wide range of state-of-the-art interfaces and is designed to accelerate the evaluation process in the design-in phase, thereby facilitating faster time-to-market. |
| The conga-QAF Qseven module, which is based on the AMD Embedded G-Series, is the first module to combine high performance graphics, dual core processing power and low power consumption in such a small form factor. It is therefore a perfect solution for cost-sensitive low-power control and visualization applications. |
| Choice of seven AMD G-Series processors |
| COM Express Basic Module with ECC Support |
| Combines Connect Techís PCI/104-Express SBC with congatecís Qseven module |
| The conga-CA6 module with the Intel® Atomô processor series E6xx is available as a 600 MHz, 1.0 GHz, 1.3 GHz and 1.6 GHz option with 512KB L2 cache and can access up to 2GB of rugged DDR2-RAM, which has been soldered directly onto the PCB |
| The easily integrated mini carrier board is only 145 x 95 mm with various interfaces based on the latest standards and can accelerate the evaluation phase of the design-in to ensure a rapid market introduction |
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