Diamond Systems announces Altair, a rugged EMX Basic single board computer (SBC) based on the Intel Atom E680T CPU running at 1.6GHz, featuring dual Gigabit Ethernet ports, 4 serial ports, and 4 USB 2.0 ports. Altair is also the first SBC to implement the new EmbeddedXpressTM (EMX) stackable I/O standard, the next step in I/O connectivity for small form factor embedded computing.

Diamond Systems announces Altair, a rugged EMX Basic single board computer (SBC) based on the Intel Atom E680T CPU running at 1.6GHz, featuring dual Gigabit Ethernet ports, 4 serial ports, and 4 USB 2.0 ports. Altair is also the first SBC to implement the new EmbeddedXpressTM (EMX) stackable I/O standard, the next step in I/O connectivity for small form factor embedded computing.

Diamond Systems unveils EmbeddedXpress (EMXTM), a new industry standard form factor for embedded computers that combines COM Express CPU modules with stackable I/O expansion in an SBC format. EMX boards offer increased flexibility, scalability, and longevity in the final product by providing interchangeable processor modules along with stackable I/O expansion. This combination yields the best of both SBCs and COMs: Off the shelf embedded computing solutions with easy I/O expansion, plus performance scalability and increased product lifetime.

Diamond Systems launched today at the Intel Developer Forum (IDF) the Aurora single board computer (SBC) as a much-needed technological breakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz AtomTM Z530 processor from Intel, Aurora combines US-based rugged design know-how with advanced manufacturing process techniques to achieve a rich feature set in the tiny 3.6×3.8" PC/104 form factor. Best of all, Aurora uses a simple yet unprecedented thermal design among stackable SBCs to reduce size, weight and power and cost (SWaPaC) compared to legacy VME and PC/104 SBCs.

The FeaturePak initiative, unveiled last month at Embedded World in Nuremberg, Germany, today announced new members and FeaturePak-related products, and revealed that it is formally organizing as the nonprofit "FeaturePak Trade Association." The initiative’s newest members are VIA Technologies Inc. and MSC Vertriebs GmbH, which join the eight charter members that jointly launched the nascent embedded I/O standard last month.

Diamond Systems unveils an adapter board that allows the use of FeaturePak I/O expansion modules in systems that provide SUMIT-ISM expansion stack locations. The SUMIT/FP Adapter provides a pair of 50-pin I/O header connectors for convenient access to all FeaturePak I/O and consumes a single PCI Express x1 lane from the SUMIT-A bus connector. In addition, it includes pass-through connectors for the SUMIT-ISM stack’s SUMIT-B bus and PC/104 (ISA) bus. An extended operation temperature range of -40oC to +85oC is supported.

Diamond Systems Corporation today launched the industry’s first digital I/O module compatible with the recently-introduced FeaturePak embedded I/O expansion standard. The FP-GPIO96 integrates 96 buffered, programmable digital I/O lines, eight 32-bit counter/timers, four 24-bit pulse-width modulation circuits, and a watchdog timer. It interfaces to host systems via the FeaturePak host interface’s high-speed PCI Express bus interface.

COM Express-sized Magellan boardset offers the advantages of both COMs and SBCs, and provides "triple-play expansion" via PCI-104, SUMIT, and FeaturePak modules

Leading embedded solution provider debuts wide-temperature COM Express Modules based on low-power Intel(r) Atom and Core 2 Duo CPUs

Tiny, high-accuracy data acquisition module provides snap-in A/D, D/A, and DIO functions for COM baseboards, SBCs, and full-custom electronic designs