 | | Extreme Engineering Solutions, Inc. (X-ES) introduces XPedite7450, a rugged COM Express(r) module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES XPand6000 Small Form Factor (SFF) rugged system. Based on the 3rd generation Intel(r) Core(tm) i7 quad-core processor, the XPedite7450 operates at up to 2.2 GHz to deliver enhanced performance and efficiency, making it an excellent processor mezzanine for commercial, industrial, and military applications. |
| Extreme Engineering Solutions (X-ES) is shipping the XPedite5600, an air-cooled PrPMC/XMC module based on Freescale Semiconductor’s quad-core QorIQ(tm) P2041 processor. The XPedite5600 is an optimal solution for industrial and communications applications that require a high-performance PowerPC processor on an industry standard mezzanine module. |
| Extreme Engineering Solutions (X-ES) is shipping the XPort3301, a dual 10GBASE-T 10 Gigabit Ethernet XMC module. The XPort3301 is well suited to applications requiring cost-effective, high-bandwidth communications such as remote sensor interfacing, traffic aggregation, storage, and data center networks. |
| Extreme Engineering Solutions, Inc. (X-ES) has introduced the company’s first ruggedized COM Express(r) module, the XPedite5550, which complies with the PICMG COM Express Compact form factor (95mm x 95mm) and supports an enhanced Type-5 pinout. The XPedite5550 can be hosted on a standard COM Express carrier card, hosted on a custom carrier card built to include any additional requirements from the end user, or integrated into the X-ES XPand6000 Series of Small Form Factor (SFF) rugged systems. |
| Extreme Engineering Solutions, Inc. (X-ES) introduces the XCalibur4401, a 6U CompactPCI Single Board Computer (SBC) based on the 2nd generation Intel(r) Core(tm) i7 processor (formerly codenamed "Sandy Bridge"). Available in either conduction- or air-cooled versions, the XCalibur4401 utilizes the processor’s dual- or quad-core technology operating at up to 2.5 GHz, making it an excellent COTS solution for military, communications, and industrial applications. |
| The XPedite7332 is a 3U conduction- or air-cooled CompactPCI (cPCI) single-board computer based on the Intel® CoreâÑ¢i7 processor and Intel QM57 chipset. With dual cores operating at 2.53, 2.0, or 1.06 GHz, the Intel® CoreâÑ¢i7 delivers enhanced performance and efficiency for today's network information processing and other embedded computing applications. |
| The XPort1005 is an intelligent communications controller targeting high-performance, serial applications. The XPort1005 combines a wide array of supported serial protocols and a configurable I/O routing structure to pack maximum flexibility into an industry standard PMC module. |
| The XPedite5502 is an air-cooled PrPMC/XMC single-board computer targeting the Freescale QorIQ P2020. With dual PowerPC e500 cores running at up to 1.2 GHz, the P2020 delivers enhanced performance and efficiency for today's network information processing and other embedded computing applications. |
| The XPand1030 system is a low-cost debug, development, and display platform for 3U conduction-cooled cards. It supports one X-ES CompactPCI SBC and the Cisco® 5940 with direct Ethernet and serial I/O access to each board. The XPand1030 backplane provides CompactPCI bus between the two slots. Ethernet, RS-232 serial I/O, and DVI are routed to RJ-45, micro DB-9, and HDMI connectors for easy access. |
| The XPort6172 has been designed to meet the storage requirements of the most demanding applications. By utilizing solid-state NAND flash technology the XPort6172 provides a high-performance, high-density, reliable memory solution. The XPort6172 is capable of operating within the demanding environments of MIL-STD-810F including harsh temperatures from -40°C to 85°C as well as rigorous shock and vibration conditions. |
| The XPort6191 has been designed from the ground up to meet today's ruggedized storage requirements. By utilizing solid-state NAND flash technology, the XPort6191 provides a high-performance, high-density, reliable removable memory solution. The XPort6191 is capable of operating within the demanding environments of MIL-STD-810F, including harsh temperatures from -40 °C to 85 °C as well as rigorous shock and vibration conditions. |
| The XPort6103 XMC module has been designed to meet the storage requirements of the most demanding applications. By utilizing solid-state NAND flash technology, the XPort6103 provides a high-performance, high-density, reliable memory solution. The XPort6103 is capable of operating within the demanding environments of MIL-STD-810F as well as severe shock and vibration conditions. |
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