 | | An interactive HDTV set-top box device, with an embedded DOCSIS cable modem capable of providing DOCSIS set-top gateway (DSG), interactive multimedia and internet access for the digital cable market. STiH225 device can be used as a mini gateway for the home network. |
| The M24LR16E-R device is a dual-interface, electrically erasable programmable memory (EEPROM). It features an I2C interface and can be operated from a VCC power supply. It is also a contactless memory powered by the received carrier electromagnetic wave. The M24LR16E-R is organized as 2048 ó 8 bits in the I2C mode and as 512 ó 32 bits in the ISO 15693 and ISO 18000-3 mode 1 RF mode. |
| Dual-interface memory family adds 16-Kbit device capable of powering small systems entirely from harvested RF power with no battery required |
| Advanced system-on-chip integration supported by pre-certified reference design cuts costs and time to market for next-generation HD interactive PVR cable set-top boxes |
| ST's LCP12 IC protects against high-voltage surges on the tip and ring connections of Subscriber Line Interface Cards (SLICs), which connect telecom local loops to the access network. These voltage surges can be caused by lightning strikes or by electromagnetic coupling or direct contact with AC power lines. |
| New thyristor array is first to meet future standards in China for SLIC tip and ring protection |
| Integrated Cable Modem and MPEG decoder to enable delivery of value-added programming via an interactive service |
| Innovative device combines convenient chip layout with superior acoustic performance |
| ST unveils the latest semiconductor innovations in photovoltaics at Solar Power International 2011, Booth 6001 |
| The CPL-WB-00D3 and DCPL-WB-00D3 are single- and dual-path antenna couplers intended for single- and dual-antenna systems. |
| Industry’s most popular Cortex processor-based MCU platform now offers more than 250 compatible devices for easy end-product extensions and upgrades. Discovery Kits to be distributed at Embedded Systems Conference in Boston. |
| Based on the ARM Cortex-M3 and combines 90 nm process technology with an adaptive memory accelerator and a multilayer bus matrix |
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