Avnet Memec and Connect One Ink Americas Distribution Agreement

Avnet Memec, a division of Avnet Electronics Marketing – an operating group of Avnet, Inc. (NYSE: AVT) – and device networking semiconductor provider Connect One Ltd., today announced that they have signed a distribution agreement.

April 29th, 2009

Avnet Memec, a division of Avnet Electronics Marketing – an operating group of Avnet, Inc. (NYSE: AVT) – and device networking semiconductor provider Connect One Ltd., today announced that they have signed a distribution agreement. Connect One’s industry-leading iChip™ and embedded device servers are now available from Avnet in the Americas. Concurrently, an agreement with Avnet Memec for distribution of Connect One products in Europe was also announced today.

Connect One is a leader in the development of the Internet Controller concept, which enables Internet protocol connections of virtually any kind of device. Connect One offers chips and embedded modules for high performance machine-to-machine (M2M) applications – enabling the immediate implementation of local area network (LAN) id WiFi IP connectivity to devices. Designers can use fully certified modules for LAN or WiFi and move to chip-based solutions, resulting in reduced production costs as manufactured quantities increase.

“In addition to providing a quick and cost-effective way for customers to add LAN or WiFi IP connectivity to new and existing devices, the Connect One products are a great addition to Avnet Memec’s current offerings because their modules work in conjunction with components that are already available from other manufacturers on our existing line card,” said Phil Sansone, senior vice president of Avnet Memec.

“Avnet’s world class design chain and supply chain expertise will expose and deliver Connect One’s products to a whole new set of customers,” said Ariel Shulman, vice president sales for Connect One. “We are extremely excited about the opportunity to engage with Avnet and the value they will bring to our customer base.”

Topics covered in this article

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