MILPITAS, Calif.,  CORWIL Technology Corporation announces the addition of new services for its SIP (System in Package) and MCP (Multi-Component Packaging) Module customers. CORWIL, a leading semiconductor assembly and test services provider has teamed with substrate design and fabrication sources to provide customers with complete turnkey SIP Module design, substrate fabrication and packaging services. These additions complete the list of services necessary for CORWIL to provide full-service SIP and Module production. CORWIL’s other SIP Module services include wafer thinning and dicing, inspection, wirebonding, flip chip and SMT assembly and encapsulation.

The renewed interest in modules has occurred due to assembly advances, such as wafer thinning, and die yield improvements, such as automated die inspection.

According to Phil Marcoux, CORWIL’s SIP Module Business Development Manager, “the use of SIP Modules allows customers to bring complex new products to market rapidly and inexpensively so they can help validate the designs and functionality of their products.”

Modules have been produced for many years. New technologies, such as, the ability to stack multiple die, to interconnect them with advanced wire bond shapes, smaller SMT components, and wafer level package techniques have increased the density and created higher value products.

For more information contact Phil Marcoux, Rosie Medina, or CORWIL’s website, www.corwil.com.

About CORWIL – Founded in 1990, CORWIL’s services include wafer probe and IC electrical test, state-of-the-art wafer thinning/polishing and dicing, and IC assembly in plastic and ceramic packages, SIP and MCP packages including SMT, Flip Chip, and wirebond mixed assemblies. CORWIL occupies a custom designed facility in Milpitas, CA, in the heart of Silicon Valley, to serve the most demanding production and prototyping needs of its 1100 customers in the semiconductor, mil/aero and medical markets.