Embedded Computing Design E-letter - July 2014

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Connecting Silicon, Software, and Strategies for Intelligent Systems
E-letter July 2014
High-Speed, Real-Time Recording Systems: Second Edition
By Pentek, Inc.
Real-time recording has become a challenging task that requires specialized hardware and intelligent application software.
Developing embedded systems with discrete high-performance graphics processors
By Mitch Furman, AMD
Designing a discrete graphics-processor-based system for embedded applications presents very different types of challenges when compared to more mainstream discrete graphics. Embedded systems such as these often must withstand extreme temperatures, and meet additional shock and vibration, cooling, and lifecycle requirements.
Embedded IDEs shaped by Internet of Things, DIY, virtualization, multicore
By Curt Schwaderer, Editorial Director
Embedded systems are becoming smaller, more consolidated, and contain a mix of real-time processing with network connectivity and graphics capabilities. This trend in embedded development is facilitated by multicore processors and virtualization capabilities that enable real-time OS environments to run beside application software on a single embedded system.
Rise of the machines: The future of M2M in healthcare
By Matthew Britt, Numerex
From electronic patient records to a changing insurance industry, physicians, caregivers, and administrators have navigated and embraced a tidal wave of changes. Today, one of the core drivers of healthcare industry transformation is Machine-to-Machine (M2M) technology. Put simply, a tiny sensor is revolutionizing everything.
Embedding intelligence in medicine and sports
By Rory Dear, Technical Contributor
Embedded systems for medical and sports wearable (and ingestible) devices are adding intelligence to how we track our health and wellness.
Sensor ICs, SWaP-C, and the IoT
By Brandon Lewis, Assistant Managing Editor
Choosing the right sensor technology for SWaP-C constrained Internet of Things (IoT) applications can require sacrifices in power, performance, or cost. Developments in Anisotropic Magnetoresistive (AMR) sensor ICs, however, are lessening these tradeoff burdens.
Analyzing building data for predictive energy management
By Monique DeVoe, Managing Editor
As homes, buildings, and cities get smarter with increased sensor use and connectivity with the Internet of Things (IoT), improved strategies for making sensor data useful for building automation planning and energy management are in development.
SECTION: Sister Publication Article
DSP capabilities of SoC FPGAs address emerging small cell requirements
By Nilam Ruparelia, Microsemi
Constraints on power, cost, and footprint are driving the use of efficient DSP implementations with some implementations using both a DSP processor and a companion SoC FPGA.
Altia Design 11.1: New Release Offers Better GUIs, Faster.
KW-Software's PROFINET Industrial Ethernet solution
ARM® Cortex®-M based microcontroller Keil™ MDK software development environment
Elma Electronic
Sturdy Small Enclosures Offer Affordable Flexibility in a Variety of Sizes
MEN Micro, Inc.
MEN Micro’s CB70C is a high performance, Intel Core i7-based Rugged COM Express module for robust, mission-critical operations
PCI Express I/O Card Provides 24 Isolated Digital Inputs with Change of State Detection and 24 Solid State FET Relay Outputs
Innovative Integration
Prepare for Glory with FMC-500 2x500 MSPS 16-bit A/D 2x1230 MSPS 16-bit D/A
Annapolis Micro Systems
Dual Twelve Bit 2.3 or 1.5 GSps DAC I/O Card
SECTION: Upcoming E-Casts.  An E-cast is a live webcast that may have a single or multiple vendors. E-cast events are used to educate audiences about a problem/solution, from the vendor's perspective. The presentation is typically 45 minutes in duration with a 15-minute moderated Q&A session.
SYNOPSIS: A one-hour, live, moderated problem/solution technical webcast.

E-cast Schedule:

Managing SWaP in ISR Systems

December 4th 2:00 PM EST
Presented by: Advanced Cooling Technologies, Curtiss-Wright, GE Intelligent Platforms, TE Connectivity

26 Ways to Recover: Who's Afraid of Losing a VM?

Presented by: Veeam

Reducing SWaP in Embedded Systems with Small Form Factor Designs

Presented by: Curtiss-Wright, Ecrin Systems, GE Intelligent Platforms, TE Connectivity
For additional E-casts, check out the Broadcast Archive.

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