The physical dimensions of embedded applications are continuing to shrink as users attempt to compress as many functions as possible into a given space. Selecting thermal-management products for these power-hungry miniaturized embedded applications has become a highly complex process. Because embedded applications are placed in a wide array of systems and applications, the thermal-management specification process must be based on a worst-case scenario, both in terms of the magnitude of available airspeeds and the direction from which airflows originate. Designers can choose from a handful of
heat-sink options to cool devices efficiently in a low-airspeed environment.
