 |  - Similar to the latest generation of Pocket PC’s and smartphones
- Allows easy embedded application development through PC-Compatible tools and methods, while ensuring in-field reliability and ruggedness for end-user systems
- Runs without fans or heat sinks in the temperature range of -20 °C to +70 °C
- Other chip-level features include 4 UARTs, SPI, I2C, a real-time clock with a separate power domain, and NAND Flash and DDR memory controllers
- These features make the devices particularly suitable for automotive and industrial control applications as well as medical systems. In addition to Windows Embedded CE 6.0 and Linux2.6 support,ready-to-run Android and Ubuntu are available from Boardcon
- Rugged Single Board Computer (120 mm x 58 mm) achieved through modern SMD technology
- Improved interference safety achieved through multi-layer PCB technology and dedicated ground pins
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