ANN ARBOR, Mich., Jan. 3 – Solidica today announced the award of a 12-month project from the National Science Foundation to explore the use of their unique embedded sensor technology for building safety applications. Driven by NSF's security technologies thrust area, the STTR Phase I project will seek to validate the applicability of Solidica's technology to monitor the health status of a wide variety of physical structures, including buildings and bridges.

Ken Johnson, Solidica vice president of strategic development and the principal investigator on the project said, "The basic premise of this effort is to provide the real-time health status information of a structure, which can either predict a potential failure or provide data to first responders if a catastrophic event were to occur. Imagine the value of being able to remotely monitor the progression of a fire throughout a large complex, or map its structural integrity, knowing exactly which areas are safe and which are impassable."

A key enabler for this program rests in the company's ability to embed wireless smart sensors directly within the structural components themselves using their Ultrasonic Consolidation technology. In addition to this, their proprietary, self-powering electronics design has the ability to communicate between the sensor points, providing a meshed view of the entire environment.

The announcement is the third in a string of recent awards for Solidica in the emerging embedded electronics field illustrating their continued expansion beyond their traditional rapid prototyping and tooling markets.

Two other key aspects of this program include the receipt of additional financial support from the Michigan Economic Development Corporation's Technology Tri-Corridor matching grant program, and the participation of the Michigan Technological University (MTU) as a strategic research partner.

Professors Steve Hackney and Pete Moran of the Department of Materials Science and Engineering at MTU are co-principal investigators on the program and will assist in the development and testing of the new embedded sensor technology. According to Hackney, "These robust embedded sensors could have wide application in structural stability monitoring in adverse environments, from the new levee system in New Orleans to large construction equipment."

Jim Baker, director of technology partnerships at MTU noted, "We are truly looking forward to our collaboration with Solidica on this exciting program as it will allow us to combine our extensive capabilities in the field of structural analysis and contact mechanisms with Solidica's world-leading expertise in ultrasonics and electronics embedding."

Dawn White, Solidica CEO, reciprocated the sentiment by adding, "It's always great to be able to leverage the resources that are right in your back yard, and we couldn't ask for a better partner on this project than MTU."

About Solidica

Headquartered in Ann Arbor, Mich., Solidica is a rapidly growing technology company that provides advanced materials, electronics, and solid-state fabrication solutions. Their proprietary Ultrasonic Consolidation technology combines the ability to quickly "grow" dense metal parts, novel material, and injection tools with the option of embedding fibers and advanced wireless electronics. The company leverages its expanding internal research and product development resources to provide customers with innovative solutions in industries such as aerospace, automotive, medical, rapid prototyping/tooling, electronics, and military. Visit their website at www.solidica.com for more information or contact Ken Johnson at 734-222-4680 x114.