News ID

New range of thermoelectric sub-assemblies on TO-3 standard header

TEC Microsystems GmbH
HD technology thermoelectric cooler on TO-3 header
HD technology thermoelectric cooler on TO-3 header
Ultra-thin 2mm height 2-stage TEC on TO-3 header
Ultra-thin 2mm height 2-stage TEC on TO-3 header

TO-3 header with 8pins is a very common header type for powerful laser diode applications (for example, DFB and DBR lasers). Attached to a proper heatsink TO-3 header is suitable to spread several watts of heat.

LD applications require precise temperature stabilisation, which is provided by thermoelectric cooler. TO-3 has about 8x8m2 open space for mounting, which is enough to provide a a wide range of thermoelectric coolers to install. The material of header is usually CRS (cold-Rolled-Steel) for base and pins.

TEC Microsystems offers thermoelectric sub-assemblies (TEC + header) on universal 8pin TO-3 type with nailheaded pins. Common single-stage coolers for LD application on TO-3 headers have max 5-6W cooling capacity. TEC Microsystems provides high cooling capacity TECs from RMT Ltd HD type rage. The available solutions for laser applications allow to pump up to 10W of heat from laser source, having the same size as standard TECs. This is about 50-60% more than any typical thermoelectric cooler suitable to install on TO-3 header. Higher cooling capacity reserve allows to use more powerful LD without any changes in form factor. Also HD technology thermoelectric coolers may consume less electrical power under the same conditions as common types.

Thermoelectric coolers are mounted by high-temperature flux-free soldering in vacuum environment. The final product is a standard TO-3 8pin header with integrated thermoelectric cooler, RoHS compliant with 100% quality control by multiple criteria. Such sub-assembly simplifies and speeds us the final assembling process at Customer side and reduces the risks of mounting failures. High-quality precise soldering process provides the best performance of thermoelectric cooler under operating conditions.

TO-3 header is also common for photodetector applications, because of good thermal conductivity and simple mounting.

TEC Microsystems GmbH and RMT Ltd introduce a full range of single- and multistage thermoelectric coolers pre-installed on standard TO-3 8pin headers.