Increasing demand and continued growth puts EnSilica on recruitment path for engineers; Makes senior level appointments
|: Ian Lankshear (centre), EnSilica’s CEO, with David Doyle (left), Sales Director, and Mark Hodgkins (right), Executive Chairman.|
Wokingham, UK – 5th April 2016. EnSilica, a leading independent provider of semiconductor solutions and IP, has announced that it is planning an immediate recruitment drive for additional engineering staff following a further year of increasing demand and continued growth. In addition, in a further commitment to its ongoing growth strategy, EnSilica has also appointed Mark Hodgkins as Executive Chairman to its Board of Directors and David Doyle as its new Sales Director.
“We are seeing high demand for ASIC developments with increased activity in the industrial, mobile and IoT markets,” said Ian Lankshear, CEO of EnSilica. “In order to meet the increasing demand we are experiencing and our continued growth objectives for 2016 and beyond, we need to invest significantly in more people. We are consequently looking for a variety of engineers to expand the workforces at our facilities both in the UK and India, as well as making key new appointments of Executive Chairman and Sales Director.”
EnSilica plans to recruit in excess of 12 additional engineering staff in the UK and 20 in India to support the continued increasing demand for ASIC and FPGA development. EnSilica is particularly looking for analog design and layout engineers to expand its Bristol centre of excellence for analog and mixed-signal IC design, established in October 2015. EnSilica is also looking for design and verification, and physical implementation engineers for its headquarters design facility based in Wokingham. In addition, EnSilica is seeking to further expand its Indian design centre, based in Bangalore, with design and verification engineers, embedded software and compiler development specialists.
To further reinforce the company’s ongoing growth plans with experienced executive guidance and additional ideas, EnSilica has appointed Mark Hodgkins to the position of Executive Chairman. Mark has extensive experience of assisting technology based private companies in the achievement of their growth strategies which has included executive execution, strategic advice, and fund-raising for development objectives.
In addition, EnSilica has appointed David Doyle as Sales Director, whose focus is on driving forward the company’s IC design and supply business. David has extensive worldwide experience in senior sales and executive positions at a variety of semiconductor companies, most recently Baolab Microsystems where he was CEO and, prior to that, ARC International plc, where he was VP Worldwide Field Operations.
“Mark and David have been appointed to crucial new roles within the company,” continued Ian Lankshear. “The depth and breadth of their expertise and the ideas that they bring will be vital in helping to take EnSilica to new levels of success.”
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EnSilica was founded in 2001 and has a strong track record of success in delivering ASIC and FPGA based solutions to semiconductor companies and OEMs worldwide. The company is headquartered in the UK and has subsidiaries in India and the USA. The company is a specialist in low-power ASIC design and complex FPGA-based embedded systems. In addition to supplying IP and turnkey ASIC/FPGA development and supply, EnSilica also provides point services to companies with in-house ASIC design teams. These services include system engineering, analog and mixed signal design, and advanced verification using UVM, DFT and physical implementation. For further information about EnSilica, visit www.ensilica.com.