Embedded World 2017: GE presents modular Industrial PCs marking a new era of customized computing platforms
Augsburg, Germany – March 9, 2017 — At Embedded World 2017 in Nuremberg, Germany (March 14-16), GE’s Automation & Controls (Hall 3, Booth 543) presents the first two models of a new line of Industrial PCs (IPCs). They mark the end of the era of maximizing the degree of standardization in IPCs and introduce a new concept of modular design, allowing a higher level of customizing IPCs to specific client needs.
One of the new Industrial PCs is the RXi2-EP. Optimized for heavy usage in harsh industrial environments, it delivers mid-to-high performance computing capabilities to run e.g. data analytics applications right at the machine, enabling improved control of operations in real time.
“Our new, customized IPCs deliver on the promise of lower total cost of ownership. When compared to standardized products, they require less maintenance and have longer life-cycles. They allow for operating periods of 7 to 10 years throughout which the computers can continuously be deployed, hardly requiring reconfiguration. Expenses for software modifications are lower, and there is less regression testing“, says Rudolf Krumenacker, Head of Engineering and Site Leader at GE in Augsburg, Germany.
All aspects of the new IPCs have been designed to further advance the Industrial Internet, as they provide more computing power at the heart of GE’s Field Agents which are the critical link and gateway of machine controllers to data analytics in the cloud. Furthermore they are preconfigured for secure data transmission via secure networks.
The new RXi2-EP IPC is the perfect platform for running industrial apps right at the machine, even in the harshest environments. The core of the RXi2-EP IPC architecture is GE’s COM Express modular CPU platform. It allows users to flexibly combine the IPC’s carrier with a range of COM Express modules for maximum customization to specific application needs. GE’s COM Express platform architecture separates the processor module and carrier card, allowing the life of the subsystem to be extended by offering a simple, cost-effective upgrade of the processor alone.
One of the new COM Express modules presented at Embedded World is the bCOM6-L1800, based on the capabilities of Intel® core processors. It has been designed specifically for industrial control applications in rugged environments which require the highest reliability and protection against shock, vibration, moisture, dust, chemicals as well as heat. Thanks to a unique cooling technology, the processors deliver full performance with no throttling over the entire temperature range of -20°C to +80°C.
All new products will be presented at GE‘s Automation & Controls Press Briefing on Tuesday, March 14, 2017, at 3.30pm at the GE booth 543 in Hall 3 . Our experts will be glad to discuss the latest trends and products with you in person.