COMMELL releases COM Express with Intel Core 2 Duo Mobile and GME965
CES-471 Supports Intel® Core™ 2 Duo mobile processor Merom in Socket P @533/800MHz FSB,1 x DDR2 SO-DIMM support up to 2.0 GB. GME965 & ICH8-M Chipset. built-in GMA X3100 VGA, LVDS, SATA, USB 2.0, Giga LAN.
Taiwan Commate Computer Inc.(COMMELL), a leading provider of embedded computing and surveillance solution, has released its latest addition to the family of COM Express CPU Module ---- CES-471.
The CES-471 incorporates an Intel Socket P pin-out compatible with Intel Core 2 Duo Mobile Merom processors @ FSB 533/800MHz and Intel`s latest Mobile GME965/ICH8-M Express chipset, that is easily handle multitasking and suitable for embedded applications ranging from gaming, medical equipment, mobile data acquisition, industrial automation control and other multi-display applications.
The CES-471 offers the Graphics Accelerator X3100, Intel Clear Video Technology, and graphics core speeds up to 500MHz provide enhanced graphics and 3D rendering performance to meet the raquirements of embedded applications that require advanced video capabilities that provides CRT, Dual channel 24-bit LVDS and HDTV. Onboard DDR2 533/667MHz SODIMM socket has a maximum memory capacity of 2GB, Additionally, CES-471 is equipped with all required interfaces including PCIe x 16, four PCIe x 1 and four PCI interface, PCIe Gigabit LAN, ATA, three SATA2 up to 300MB/s, Audio, USB2.0.