embedded world 2017: VIA launches new IoT acceleration platform for self-service systems
Taipei, Taiwan. VIA Technologies, Inc., has announced the launch of the new VIA SOM-6X50 IoT Acceleration Platform, a system-on-module (SOM) for the development of automated ticketing, signage, and kiosk devices. The VIA SOM-6X50 measures 6.76 cm x 4.3 cm and is powered by a 1.0 GHz VIA Cortex-A9 SoC. The new SOM will be on display at embedded world 2017 alongside a broad spectrum of commercial-grade systems, HMI starter kits, and other IoT acceleration platforms.
The VIA SOM-6X50 features a Linux BSP which includes the kernel (3.4.5), bootloader source codes, and a variety of I/O and display expansion options. Other features include a Tool Chain to help adjust the kernel and to support the VIA SOMDB1 carrier board I/O and other hardware features. A custom baseboard can be also be developed meet specific requirements.