KINGMAX participated in the 2012 ESEC(Embedded System Expo) during May 9th to 11th at the Tokyo Big Sight venue to exhibit a full range of industrial storage solutions for tough industrial applications: industrial SSD, eMMC, eMCP, Flash (SD/ CF) cards and DRAM modules. Being the first RAM/memory card module manufacturer to own its own IC package and testing facilities, KINGMAX leverages its manufacturing capability and RD expertise to develop a full range of industrial solutions which is targeted at mobile devices, industrial automation, POS system, medical equipment, and digital signage and more.

The highlight of KINGMAX industrial storage solutions for ESEC is the Embedded Memory Solution (eMMC and eMCP). Aiming at fast growing market of mobile device, KINGMAX eMMC/ eMCP is highly integrated memory, in which it can provide a full, customized design-in process according to customers’ specific demands. KINGMAX Group Turn-Key Manufacturing Process allows to master key technologies in packaging: MCP(Multi-Chip Package), die-stacking and wire-bonding, and thus facilitates high stability and reliability of final products. A tremendous joint effort between KINGMAX R&D and controller firmware team is devoted to provide most suitable solution to meet requirements of design-in process. Most importantly, KINGMAX professional teams provide outstanding customer support to tackle technical issue whenever customers need.

Currently, the samples of the KINGMAX new full range industrial storage solutions are now available for customers to run test. For more details, please feel free to contact local KINGMAX sales managers (sales@kingmaxdigi.com.tw).

About KINGMAX

KINGMAX Group is the world’s first RAM/memory card module manufacturer that features vertical industrial integration capabilities, solid R&D capability and innovative cutting-edge patented technology. KINGMAX believes that “Quality Comes from Perfection in Technology”, and its mission is to offer innovation and perfection in all products. All KINGMAX products therefore undergo rigorous tests before launching to the market to ensure the highest quality, and with the product lifetime warranty, people can be completely assured that KINGMAX products are the best choice. For more information, please visit the KINGMAX official website at: www.kingmax.com

Korenix offers JetCard series Universal PCI add-on cards, JetCard 2205 and JetCard 2215 models that are designed with Ethernet & Power over Ethernet ports, as well as easy to install drivers to allow IPC providers design an extensible data communication system in industrial applications. Up to 4 JetCard switch boards can be stacked together allowing IPC providers increase port and connection numbers to fit their specific applications.

The JetCard 2205 model is designed with 5 Fast Ethernet copper ports and thus can enable users to connect up to 4 devices for data communication and use the last port for internal connection purposes, while JetCard 2215 is designed with 1 internal Fast Ethernet copper port and 4 IEEE 802.3af PoE ports that can deliver 15.4W power per port along with data for driving PoE cameras. All of the 4 PoE ports of JetCard 2215 support 12~24V Booster PoE: by enabling the PoE booster, the card can receive 12~24V power and automatically convert it to 48VDC – a perfect solution for applications which lack standard 48V PoE, such as buses, subways, solar power etc…

Without the driver the JetCard UPCI switch boards work as unmanaged switches and can communicate together, but not with the IPC, whereas with the driver the boards work as Network interface cards on your PC, allowing users to configure one more IP address and communicate the devices with the IPC.

The JetCard 2205 and 2215 series work on Windows as well as Linux drivers for ensuring higher compatibility and broader use. With -25~70°C wide operating temperature, the devices perform as reliable and cost-effective embedded networking solutions – perfect for deploying in compact front-end systems, POS systems, building automation and many other surveillance environments.

Korenix Technology

A Beijer Electronics Group Company

www.korenixembedded.com

+886-2-8911-1000

sales@korenixembedded.com

C# use using Statement to define its scope outside of which an object or objects are disposed. But there is no equivalent syntax statement in Java. CodePorting C#2Java engine intelligently translates the C# code and handle this situation by producing try/catch block in java code. This Technique converts C# code to java code with same formatting ready to be complied.

Following example shows migration of C# using statement in java:

C# Code:

using System.IO;

namespace CsPorter.Tests.Convert.LanguageConstructs.UsingStatement

{

public class Test2

{

void Method()

{

//some comments (vertical indent)

using (Stream stream = new FileStream(“nowhere”, FileMode.Open))

{

stream.ReadByte();

}

//horisontal indent

using (Stream stream = new FileStream(“nowhere”, FileMode.Open))

{

stream.ReadByte();

}

}

}

}

Java code generated by CodePorting:

package CsPorter.Tests.Convert.LanguageConstructs.UsingStatement;

// ********* This File Is Auto Ported Form C# Using Codeporting.com *********

import com.codeporting.csharp2java.System.IO.Stream;

import com.codeporting.csharp2java.System.IO.FileStream;

import com.codeporting.csharp2java.System.IO.FileMode;

public class Test2

{

private void method() throws Exception

{

//some comments (vertical indent)

Stream stream = new FileStream(“nowhere”, FileMode.OPEN);

try /*JAVA: was using*/

{

stream.readByte();

}

finally { if (stream != null) stream.close(); }

//horisontal indent

Stream stream1 = new FileStream(“nowhere”, FileMode.OPEN);

try /*JAVA: was using*/

{

stream1.readByte();

}

finally { if (stream1 != null) stream1.close(); }

}

}

It is clear from above example that CodePorting C#2Java engine automatically generated the try/catch code to handle the using statement.

Newly added articles and documentation pages

- Use CodePorting Engine To Convert C# Using Statement To Java online:

codeporting.com/blog/csharp-to-java-conversion/[...]

- Convert C# Proprties to Java Online using CodePortingC#2Java App:

codeporting.com/blog/csharp-to-java-conversion/[...]

- Automatically Convert C# Unsigned Integer Types to java using CodePorting Engine:

codeporting.com/blog/csharp-to-java-conversion/[...]

- Download CodePorting C#2Java API Samples for Ruby & C# on GitHub & CodePlex:

codeporting.com/blog/csharp-to-java-conversion/[...]

Overview: CodePorting C#2Java App

CodePorting helps you make your .NET applications cross platform compatible and allows migrating your .NET solutions, projects and files into Java in the cloud. Other than speed and accuracy of conversion; port your C# code directly either by uploading .cs files contained in a .zip file or import directly from popular version control repositories like GIT, Mercurial HG and SubVersion. You can also download a Microsoft Visual Studio plugin and convert C# code in the real time without leaving the development environment. You may also build your own customized code conversion applications using CodePorting APIs.

Read more about CodePorting

- Start converting C# Apps and source code to Java: https://apps.codeporting.com/

- CodePorting Homepage: codeporting.com/

- CodePorting C#2Java Homepage: codeporting.com/apps/csharp-2-java

- CodePorting Documentation: codeporting.com/wiki/dashboard.action

- Watch out CodePorting introductory video: www.youtube.com/watch?v=aVO2WfVj4Og

Contact Us

Suite 163, 79 Longueville Road

Lane Cove, NSW 2066, Australia

Web: codeporting.com/

Phone: +61 2 8901 3609

Email: support [@] codeporting [dot] com

Acrosser, the leading industrial computer designer and manufacturer is pleased to announce the release of its fanless in-vehicle computer AR-V6100FL features Intel Core i7 technology. AR-V6100FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

AR-V6100FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, over current protection, reverse voltage protection and automotive fuse. These designs enable AR-V6100FL to pass the strict ISO-7637-2 test which is specifically defined for equipments installed in various vehicles.

The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in vehicle applications. Driver of vehicle can trigger the power on and off sequences by either ignition switch or a remote switch.

The AR-V6100FL fanless thermal design provides the high reliability in vehicle applications. The AR-V6100FL utilize advanced heat pipe, heat sink, thermal pad to solve the problem of heat generated by CPU, Chipset, DRAM and power devices. This is a big challenge for designing a fanless computer which supports 45 Watts Quad Core Core i7 processor. All components used in AR-V6100FL are industrial proven and only solid state capacitors are utilized for high MTBF.

Acrosser also integrated two new useful features to the AR-V6100FL. The one-wire (i-Button) interface provides system integrators a low cost solution for driver ID, temperature and humidity sensors. The combo connector combines VGA, audio, USB and DC 12V power output all in one connector so significantly simplify the harness between the computer and Accrosser’s in vehicle touch monitors.

AR-V6100FL Features

‧Support Intel Core i7/i5 and Celeron processors

‧HDMI/DVI/VGA video outputs

‧CAN bus 2.0 A/B

‧Wi-Fi, Bluetooth, 3.5G, GPS

‧One-wire (i-Button) interface

‧9-32 VDC power input

‧-20 to 60 degree C operating temperature

Welcome to Explore Acrosser’s Best Embedded Solutions at Computex 2012

Acrosser will demonstrate our full range In-vehicle solution, Gaming Computers(ACE series), Networking Platform and Embedded computer (ARES series) which are designed for various applications at 201 Computex trade fair.

We also arrange live demo of our out-standing In-vehicle computers in our booth.

Please come to Acrosser booth to explore our innovative next generation products.

Welcome to visit Acrosser at TWTC Nangang 1F/Booth NO. K0723a.

Event information:

Venue: Taipei, Taiwan

Date: June 5-9, 2012

Exhibition Hall: Taipei World Trade Center / Nangang Exhibition Hall

Booth NO: K0723a

Eching, Germany, May 24, 2012 – Today, Kontron introduced the high-performance 3U CompactPCI® processor board CP3003, based on the 3rd generation Intel® Core™ processor technology, delivering a new level of performance and at the same time highly improved power efficiency. Kontron’s first Quad-Core 3U CompactPCI® processor board provides customers with up to twice the processing performance and up to four times better 3D graphics performance compared to predecessor boards working at the same power dissipation envelope. This makes the Kontron CP3003 an ideal fit for applications that require high-end computing performance in space-constrained environments. Target applications can be found in markets such as industrial, transportation, test and measurement, medical and military.

The Kontron CP3003 comes with latest dual and quad-core CPU performance that is scalable up to the 2.1 GHz Intel® Core™ i7-3612QE processor. For applications requiring lower performance and heat dissipation further low voltage and ultra-low voltage processors are available.

Compared to its predecessors, the integrated DirectX® 11, OpenGL 3.1 and OpenCL 1.1 capable Intel® HD4000 graphics provides an extensive performance boost and supports three independent displays. On two SODIMM sockets, the Kontron 3U CompactPCI® processor board CP3003 features up to 16 GB DDR3 1600 MHz ECC-protected memory for increased data integrity and system stability. Additionally, up to 32 GB of SLC NAND Flash can be integrated to hold complete operating systems or application code which substantially increases overall system speed and availability. The Kontron CP3003 is available as single slot (4HP) version or as double slot version (8HP). The base board offers 1x VGA, 2x USB 2.0 and 2x Gigabit Ethernet ports on the front panel and further USB 2.0, COM (RS-232), and SATA 3Gb/s and 6Gb/s interfaces onboard or via the rear I/O connector. The Kontron CP3003-HDD extension module adds 2x DisplayPorts, 1x USB 3.0, 1x Gigabit Ethernet and a Serial port available on the front plus the option to hold a CFast module or up to 2x 2.5”HDD/SSD. As a second extension, an XMC carrier is available.

To guarantee the highest data and system security, the optional Trusted Platform Module (TPM) offers the required encryption, verification and storage capabilities for security-sensitive applications. The implemented Wake on LAN (WoL) functionality allows the board to save energy when not in operation and to be woken up from suspense state via remote connection. The Kontron CP3003 also provides a PCI 32-bit, 33 MHz (66 MHz on request) CompactPCI® interface supporting the PCI passive mode feature. When installed in a system master slot, the CompactPCI® interface is enabled, whereas the interface will be isolated when installed in a peripheral slot.

The Kontron CP3003 runs with Linux, Microsoft Windows 7, Windows Embedded Standard 7, Windows XP, Windows Server 2003, Windows Server 2008 and VxWorks.

Highly integrated board support packages support all onboard hardware devices.

Full production of the Kontron 3U CompactPCI® processor board CP3003 is scheduled for Q3 2012. For sample availability, please contact Kontron for more details.

Further information about the Kontron 3U CompactPCI® processor board CP3003 is available at:

www.kontron.com/products/boards+and+mezzanines/[...]

More about CompactPCI®: www.kontron.com/cpci

About Kontron

Kontron is a global leader in embedded computing technology. With more than 40% of its employees in Research and Development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.

MONROVIA, California – May 24, 2012 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs) and MEMS devices, announces the availability of Tanner Analog FastSPICE (T-AFS), offering the Berkeley Design Automation Analog FastSPICE™ Platform as an add-on to Tanner EDA’s full-flow HiPer Silicon design suite. HiPer Silicon gives designers a complete analog design flow from schematic capture and waveform probing to physical layout and physical verification.

Analog, mixed-signal, and RF designers have increasing requirements for circuit simulation performance and capacity with nanometer SPICE accuracy. The Berkeley Design Automation Analog FastSPICE (AFS) Platform is the world’s fastest nanometer circuit verification platform for analog, RF, mixed-signal, and custom digital circuits. With Tanner Analog FastSPICE, Tanner EDA customers have access to foundry-certified nanometer SPICE accuracy 5x-10x faster than any other simulator on a single core and an additional 2x-4x performance uptick with multithreading. Tanner EDA users will be able to verify the most challenging analog/ RF circuits even as they have access to the latest foundry nanometer CMOS technology. For circuit characterization, the T-AFS Platform includes the industry’s only comprehensive silicon-accurate device noise analysis and delivers near-linear performance scaling with the number of cores.

“The availability of Analog FastSPICE as an add-on to Tanner EDA’s analog and mixed-signal design tools brings great benefit to Tanner EDA’s customers,” said Ravi Subramanian, president and CEO of Berkeley Design Automation. “Analog/ RF designers can realize the benefits of Tanner EDA’s full-flow analog design suite that is now bolstered by Analog FastSPICE, allowing verification of very complex analog/ RF circuits with nanometer SPICE-accurate results.”

“Tanner EDA is dedicated to providing our analog, custom, and mixed-signal design customers with the best possible price for performance and productivity,” said Greg Lebsack, Tanner EDA’s president. “Offering Analog FastSPICE as a complement to our T-SPICE simulator enables our customers to tackle complex analog/ RF circuit verification and delivers on our continued commitment to offer the widest possible choice of leading-edge technology.”

Availability and Pricing

The T-AFS add-ons can be purchased and added to existing HiPer tools. Each T-AFS token license will enable 50K element capacity, with users having the option to linearly scale tokens for larger designs. Multi-core is also supported and is scaled linearly (add one T-AFS token for every core). List pricing for token licenses: $30K per token/ year, 5 packs of tokens are $100K/ year, and 10 packs of tokens are $150K/ year. Transient noise tokens also can be added to any T-AFS package at a cost of $25K / token/ year.

Tanner EDA will be demonstrating the integrated flow in Booth # 1126 at DAC 2012 in the Moscone Center in San Francisco, California, from June 4th to 6th.

About Berkeley Design Automation

Berkeley Design Automation, Inc. is the recognized leader in nanometer circuit verification. The company combines the world’s fastest nanometer circuit verification platform, Analog FastSPICE, with exceptional application expertise to uniquely address nanometer circuit design challenges. More than 100 companies rely on Berkeley Design Automation to verify their nanometer-scale circuits. Berkeley Design Automation has received numerous industry awards and is widely recognized for its technology leadership and contributions to the electronics industry. The company is privately held and backed by Woodside Fund, Bessemer Venture Partners, Panasonic Corp., NTT Corp., IT-Farm, and MUFJ Capital.

About Tanner EDA

Tanner EDA provides a complete line of software solutions that drive innovation for the design, layout and verification of analog and mixed-signal (A/MS) integrated circuits (ICs) and MEMS. Customers are creating breakthrough applications in areas such as power management, displays and imaging, automotive, consumer electronics, life sciences, and RF devices. A low learning curve, high interoperability, and a powerful user interface improve design team productivity and enable a low total cost of ownership (TCO). Capability and performance are matched by low support requirements and high support capability as well as an ecosystem of partners that bring advanced capabilities to A/MS designs.

Founded in 1988, Tanner EDA solutions deliver just the right mixture of features, functionality and usability. The company has shipped over 33,000 licenses of its software to more than 5,000 customers in 67 countries.

TEMPE, Ariz., May 23, 2012 – Phoenix Display International (PDI), Inc., has introduced a new line of custom and standard transflective TFT LCDs ideally suited for demanding outdoor applications. Phoenix Display transflective color LCD screen modules are available in 320×240 (QVGA) resolution in 2.2”, 2.8”, 3.2”, and 3.5” sizes as well as 800×480 (WVGA) in 5.0” size, and can be integrated into any number of applications. Designed with an internal transflector, PDI’s TFT LCD modules are 100% sunlight readable, operating in a reflective mode when in direct sunlight conditions, giving the user a clear image without becoming washed out.

Phoenix Display’s custom and standard transflective TFT LCDs are designed to meet the ever-growing need to display full-color graphical content with high brightness, high contrast, and full-speed video capability. Standard brightness ranges from 80 to 160 nits, depending on size.

If customization is required, Phoenix Display’s US-based, local engineering team can design the LCD module around the standard transflective glass platform to integrate both electrically and mechanically into an existing project. PDI can also incorporate any additional options needed, including standard or custom resistive and projected capacitive touch panels, light guide features, and flex modifications.

The new transflective TFT LCD modules from Phoenix Display include:

• 2.2” 320×240 (QVGA) PDI0220BMG

• 2.8” 320×240 (QVGA) PDI0283BUG

• 3.2” 320×240 (QVGA) PDI0320DUG-T (with resistive touch panel)

• 3.2” 320×240 (QVGA) PDI0320DUG

• 3.5” 320×240 (QVGA) PDI0350BMG-1

• 3.5” 320×240 (QVGA) PDI0350BMG-T (with resistive touch panel)

• 5.0” 800×480 (WVGA) PDI0500JVG-T (with resistive touch panel)

Pricing for a 2.2-in. transflective LCD ranges from $16.20 to $23.00 each, depending on quantities. For additional details on pricing and delivery, contact Joe Sidoryk at Phoenix Display International, Inc., Tel: (630) 359-5700; E-mail: sales@phoenixdisplay.com; Web: www.phoenixdisplay.com.

Phoenix Display’s custom and standard transflective TFT LCDs are designed to meet the ever-growing need to display full-color graphical content with high brightness, high contrast, and full-speed video capability. Photo: Phoenix Display

About Phoenix Display

Phoenix Display International Inc. (PDI) is a full service provider of standard, semi-custom and full-custom LCD modules, specializing in small format character display, graphic display, color display, and custom display formats. PDI brings together extensive LCD industry experience and technical expertise, as well as low cost and vertically and horizontally integrated manufacturing operations, to deliver competitively priced, high-quality LCD displays.

DALLAS (May 24, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the TMS320C6748 DSP development kit for real-time analytics applications such as fingerprint recognition and face detection, enabling systems to sense and analyze biometric information for enhanced access control. The C6748 DSP development kit is also ideal for other digital signal processing applications, such as audio and communications. In addition, the C6748 DSP development kit comes pre-loaded with TI’s new C6748 SYS/BIOS Software Development Kit (SDK). This scalable development kit, available for the low price of $195, enables fast and easy development on the C6748 floating- and fixed-point DSP.

Easy to write and optimize DSP code

TI’s new C6748 SYS/BIOS SDK includes several demonstrations for biometric analytics applications, such as fingerprint recognition and face detection, offering a starting point for developing and demonstrating the real-time intelligence of TI’s C674x DSPs. The SDK also includes the latest SYS/BIOS real-time kernel; the C6748 StarterWare software package, which provides lightweight, operating-system-independent software libraries and utilities; Code Generation Tools; as well as DSP core performance benchmarks that show the real-time processing power of TI’s C674x DSPs. The C6748 SYS/BIOS SDK enables developers to run demos in less than 10 minutes and begin creating DSP applications in less than one hour. In addition to the SDK, the C6748 DSP development kit includes Code Composer Studio™ integrated development environment (IDE) v5.1

Simple hardware development and expansion

TI’s C6748 DSP development kit also speeds and eases hardware development of real-time DSP applications. The board reduces design work with freely downloadable and duplicable board schematics and design files. With a wide variety of standard interfaces for connectivity and storage, developers can easily bring audio, video and other signals onto the board. In addition, expansion headers allow developers to add display and user interface technology, such as the camera board from Leopard Imaging and LCD screens, extending functionality of the development kit.

Software compatibility enables easy portfolio expansion

TI’s scalable platform provides a variety of performance, power, peripheral and price options, which gives developers the opportunity to use the platform to create a varied product portfolio of their own. TI’s C6748 DSP development kit is software and pin-to-pin compatible across TI’s C6748, C6746 and C6742 DSPs and software compatible with other TMS320C6000™ DSPs. In addition, developers can scale to the software and pin-for-pin compatible OMAP-L138 and OMAP-L132 DSP + ARM9™ processors to add high-level operating systems such as Linux as well as control and networking functionality for applications such as industrial control, medical diagnostics, and communications.

Pricing and availability

TI’s C6748 DSP development kit is currently available for the low cost of $195. The C6748 SYS/BIOS SDK is pre-loaded with the C6748 StarterWare software package. Developers can obtain the SDK with a single download at TI.com, or download the StarterWare software package separately. The floating- and fixed-point C674x DSP generation is available today for a new low starting price of less than $5 in quantities of 10,000 units.

Additionally, an OMAP-L138 DSP + ARM9 development kit is available today for $195. This kit is supported by a new Linux SDK, which includes the OMAP-L138 StarterWare software package, as well as the GCC 4.5 tool chain, all available at no cost. The SDK enables developers to begin writing code in less than one hour.

Code Composer Studio IDE v5.1 is pre-loaded on both kits or can be licensed starting at $495.

TI also offers the OMAP-L138/C6748 evaluation module (EVM) for full-featured development. The EVM is available for $1,050.

Get smart with TI

TI’s embedded analytics technology unites the power of embedded systems with the intelligence of the human senses to enable systems to analyze information and make intelligent decisions. TI offers a robust portfolio of real-time embedded processing system solutions integrated with smart embedded analytics. With these solutions, TI’s customers are developing automotive vision, video security, biometric analytics and intelligent industrial applications that make the world smarter, safer and more fun.

For more information

• Check out TI’s Power Solutions for TI’s C6748 DSP

• Join the TI E2E™ community

• Follow TI on Twitter

• Like TI on Facebook

# # #

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

Providence, RI – 05/24/2012 – Vector Software, the leading provider of dynamic software testing solutions for safety-critical embedded applications, has integrated its VectorCAST embedded testing platform with the RL78/L12 Group of next-generation ultimate-low-power microcontrollers (MCUs) from Renesas Electronics Corporation.

The 16-bit RL78 MCUs combine advanced features from both the Renesas Electronics 78K and R8C families to deliver low power consumption and high performance. The RL78 family of MCUs are designed for products equipped with small LCD panels, including medical devices, automotive systems, and industrial applications that require improved user interfaces and ultimate low power.

The integrated solution brings compliance to safety standards such as ISO 26262, FDA/IEC 62304, and IEC 61508 to Renesas Electronics Corporation’s RL78 microcontroller family.

“With embedded systems becoming increasingly critical, in automotive, medical, and industrial applications, the need for comprehensive software testing is imperative”, said Bill McCaffrey, Chief Operating Officer of Vector Software. “This latest integration will assist developers in maintaining superior code quality while achieving certification and compliance.”

About Vector Software, Inc.

Vector Software is the world’s leading provider of software testing solutions for safety and mission critical embedded applications. Companies worldwide in automotive, aerospace, medical devices, industrial controls, rail, and other industries, rely on Vector Software’s VectorCAST. By automating and managing the complex tasks associated with unit, integration, and system level testing, VectorCAST helps organizations accelerate the development and ensure the reliability of their embedded software applications. Founded in 1989 by embedded software engineers, Vector Software is headquartered in East Greenwich, Rhode Island USA; with offices worldwide and a world-class team of support and technology partners. To learn more, visit Vector Software at www.vectorcast.com

Uniquify (www.uniquify.com) today launched ideas2silicon™, a new and comprehensive design services platform that spans chip specification and design through volume delivery of packaged and tested parts.

ideas2silicon turns the model upside down by offering faster turnaround, lower costs and a transparent business model that gives project teams complete visibility into the cost structure. “The traditional ‘turnkey’ model is not working and we’re doing something about it,” says Josh Lee, chief executive officer and founder of Uniquify, provider of ASIC/SoC design and manufacturing services and patented low-power double data rate (DDR) subsystem IP developer. “Projects teams have been frustrated with the classic model, as it effectively locks them into an expensive business relationship that is hard to change.”

Perseus™, a proven proprietary design framework for fast, repeatable and consistent turnaround on complex designs, forms the foundation of ideas2silicon. It provides a disciplined methodology for managing the design and closure of complex system-on-chip (SoC) and Super SoC (SSoC) designs with multiple processors, special-purpose processing engines, on-chip networks, memories and different peripheral and I/O functions.

Additionally, Uniquify’s design services expertise comes from serving as the design arm for more than 120 fabless semiconductor companies, electronic system manufacturers, semiconductor foundries, IDMs, ASIC companies and EDA vendors.

Introducing ideas2silicon Design Services Platform

ideas2silicon delivers predictable and efficient execution of the most complex ASIC, SoC and SSoC designs. A key component is an automated capability for rapidly selecting, qualifying and integrating IP blocks that form the backbone of a new design.

Availability of this IP affords project teams earlier testing and verification of their own differentiating design blocks and IP. Services range from specification and architectural design, field programmable gate array (FPGA) prototyping, register transfer level (RTL) design and verification through complete physical design and verification.

Uniquify’s highly qualified design team has expertise in advanced 65-, 40- and 28-nanometer process technologies from foundries including TSMC, Samsung, GLOBALFOUNDRIES and SMIC. These design experts have experience meeting the stringent performance, low power, OCV-aware, IP integration and verification, design for manufacturing and requirements of a project team’s most challenging SoC designs.

Uniquify partners with EDA suppliers, including Cadence, Mentor and Synopsys, for the automation software needed to support these complex designs within Perseus.

Expertise in High-Performance IP Development, Implementation

With SoCs containing an IP content of 50-60% or more, Uniquify has developed a portfolio of patented, high-performance DDR memory subsystems that can be applied for rapid implementation to address the need for tested and pre-qualified IP.

Uniquify is driving a new IP paradigm that recognizes that delivering IP functionality alone is not sufficient, but must be “variation aware” as well. It developed variation-aware, high-performance and silicon-proven Self-Calibrating Logic and Dynamic Self-Calibrating Logic (DSCL) IP for DDR memory subsystems to solve both static and dynamic variation problems during system operation. This patented technology includes controllers, PHY and I/O for use on a variety of applications.

About Uniquify

Uniquify is a privately held, rapidly growing application specific integrated circuit (ASIC)/system-on-chip (SoC) design and Super SoC (SSoC) integration and manufacturing services provider and an innovative developer and provider of patented, low-power DDR memory sub-system semiconductor IP. The company has design centers in Santa Clara, Calif., Pune, India, and Seoul, Korea. It maintains sales offices in Santa Clara and Seoul, along with Taipei, Taiwan, and Tel Aviv, Israel. With more than 100 employees, Uniquify offers 65-, 40- and 28-nanometer ASIC and SoC design expertise, SSoC integration and manufacturing services and high-performance IP to leading semiconductor and system companies worldwide. Additional information can be found at: www.uniquify.com.

WHO:

Forte Design Systems, a leading provider of software products that enable design at a higher level of abstraction and improve design results

What:

Will offer continuous demonstrations of Cynthesizer™ SystemC high-level synthesis (HLS) during the 49th Design Automation Conference (DAC) in Booth #1430

When:

Monday-Wednesday, June 4-6, from 9 a.m.-6 p.m.

WHERE:

Moscone Center, South Hall, San Francisco

The demonstration will highlight Cynthesizer’s advanced hierarchy support, custom transaction-level modeling (TLM) interfaces and other advanced features on an ARM-based image processing system with control- and datapath-type blocks.

Phil Tharp, principal engineer at HighIP Design Company, will host a discussion on using Cynthesizer for the design of the HighIP USB models with a demonstration of the live hardware at 11 a.m. Wednesday, June 6, in Booth #1430.

A caricature artist will be in the Forte booth Monday and Tuesday drawing caricatures of DAC attendees and beer will be served in the Forte booth Tuesday from 4-6 p.m. And, Forte will sponsor once again DAC’s closing with a bagpiper’s performance Wednesday, June 6, at 5:50 p.m. in Booth #1430.

More details about Forte are available at: www.ForteDS.com.

Information about DAC can be found at: www.dac.com.

About Forte Design Systems

Forte Design Systems is a leading provider of software products that enable design at a higher level of abstraction and improve design results. Its innovative synthesis technologies and intellectual property offerings allow design teams creating complex electronic chips and systems to reduce their overall design and verification time. More than half of the top 20 worldwide semiconductor companies use Forte’s products in production today for ASIC, SoC and FPGA design. Forte is headquartered in San Jose, Calif., with additional offices in England, Japan, Korea and the United States. For more information, visit www.ForteDS.com.

Marina del Rey, California, 24th May 2012. Cortus, a technology leader in ultra low power, silicon efficient 32-bit processor IP and MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, announced the signing of a sales representative agreement. Under the agreement, MOSIS will offer the Cortus APS3R and associated peripherals to their customers. The deal will support the licensing of Cortus IP from design through prototyping to volume production with MOSIS.

Today’s embedded SoC applications such as short range wireless communication, video processing, touchscreen displays, automotive sensors and SIM cards all require minimising both power dissipation and silicon area. The Cortus APS3R offers the smallest silicon footprint and lowest power dissipation available on the market for 32 bit processor IP cores.

The MOSIS MPW service allows multiple products to be fabricated on a shared mask set and silicon wafer; cost sharing is based on the area used by each design. Both integrated device manufacturers (IDMs) and fabless semiconductor companies use MPW services to dramatically reduce chip development costs when they need a few tens of samples for evaluation. The service is equally cost-effective for low volume production, typically up to 1,000 pieces of each device. When device evaluation is complete, migration to a dedicated wafer run for high volume production is easily realized.

“By matching the licensing of Cortus IP to the MOSIS silicon fabrication service model, commercial IC developers will be able to optimise their costs from concept to prototype”, says Wes Hansford, Director at MOSIS. He adds, “We welcome the opportunity to offer Cortus’ low power processor cores to our SoC customers”.

“Our agreement will enable technology companies to develop integrated circuits for new applications with low commercial and technical risk”, said Michael Chapman, CEO and President of Cortus. He adds, “The business model available through MOSIS will enable APS3R licensees to scale their costs in line with their silicon volumes”.

The agreement covers the APS3R 32-bit modern RISC microcontroller and Cortus peripherals. The peripherals include commonly used standard peripherals such as timers, counters, UARTs, GPIO, I2C and SPI as well as an Ethernet MAC, USB 2.0 device and USB 2.0 OTG module.

The APS3R offers the best performance in the industry in terms of DMIPS/mW and DMIPS/mm2 and has been licensed for low power applications such as Bluetooth LE, security, automotive sensors, touchscreen controllers and SIM cards.

The ecosystem around the Cortus APS3R microcontroller core is rich and well developed, and it includes peripherals commonly used in embedded systems, bus bridges to ensure easy interfacing to other IP and system support and functions. A full development environment (for C and C++) is available, which can be customised and branded for final customer use.

Cortus is exhibiting at the Design Automation Conference (DAC) 2012 in San Francisco, California from 4th-6th June at Booth #304.

www2.dac.com/ebooth/exhibitor.aspx?confid=24&mp[...]

MOSIS is exhibiting at the Design Automation Conference (DAC) 2012 in San Francisco, California from 4th-6th June at Booth #1119.

www2.dac.com/ebooth/exhibitor.aspx?confid=24&mp[...]

About Cortus S.A.:

Cortus S.A. is the cost/performance leader for 32 bit processor IP for embedded systems. Cortus cores are used in applications where one or more of small silicon footprint, low power consumption, good code density/small code memory size and high performance are important.

Cortus is the world leader in terms of DMIPS per square micrometre and DMIPS per microwatt.

www.cortus.com

About MOSIS

MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for commercial firms, government agencies, and research and educational institutions around the world.

www.mosis.com

TEWS TECHNOLOGIES today announced the release of the TAMC220, a standard Mid-Size/Full-Size AMC.1 (PCI-Express) and MTCA.4 compliant carrier for up to three single-size IndustryPack (IP) modules for up to 150 I/O lines.

The TAMC220 can be used to upgrade well known and well proven IndustryPack I/O solutions to a high performance form factor, and to provide AMC users a large selection of over 200 off-the-shelf IndustryPack modules for analog, digital, communications, motion control, CAN, and other various functions.

Two AirMaxVS” connectors provide access to all 150 IP I/O lines via a compatible µRTM, such as the Transition Module TAMC002-TM.

According to AMC.0, the TAMC220 provides an IPMI compliant Module Management Controller (MMC) with temperature monitoring and hot-swap support.

TCLKA and TCLKB are connected to the µRTM via M-LVDS transceivers. Both signals can be used as bi-directional single-ended signals.

The IP power lines are fuse protected by self healing fuses and RF filtered. Designed for demanding environments, the TAMC220 operates from -40° to +85°C and has a five year warranty.

About TEWS TECHNOLOGIES

TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as PMC, XMC, IndustryPack® (IP), CompactPCI, standard PCI, PCIe, AMC, FMC, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers needs. Using this customer first approach, TEWS has developed a large number of standard and custom products for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications. TEWS line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.

IQD has launched a newly designed high-temperature clock oscillator. The new LHAT series is housed in a 7x5mm dual hermetically sealed ceramic package with gold plated kovar leads attached using a robust eutectic brazing process. The oscillators are capable of operating at temperatures from +25 to +200 degrees C.

The LHAT series is available with a frequency range of 320kHz to 50MHz, a frequency stability of ±100ppm over +25 to +150 degrees C, and also ±175ppm over +25 to +200 degrees C for applications which need a higher temperature range. Operating at 3.3V this CMOS output clock oscillator can withstand a shock of 30,000g, 0.3ms. ½ sine and a vibration of 20g, 10-2,000Hz swept sine as per MIL-STD-202G Method 204D condition D.

The unique method used to connect the leads to the package reduces the mechanical and thermal mounting stresses, making the LHAT series ideal for applications which are used in demanding mechanical and high thermal situations including: downhole instrumentation, rotary shaft sensors, underground mining tools and avionics applications.

Eurocom Corporation (www.eurocom.com), a developer of long lifespan, fully upgradable notebooks, Mobile Workstations and Mobile Servers is offering a full line of Ivy Bridge based notebooks with support for professional graphics from NVIDIA Quadro 5010M, 4000M and 3000M. Eurocom offers a complete line of NVIDIA Quadro powered Mobile Workstations from 15.6” to 17.3” that are specifically designed for professionals of all kinds.

Eurocom Mobile Workstations are built to offer unmatched performance, long lifespan and full upgradeability of the processor, memory, storage, operating system and GPU technology, and are designed with the most innovative technology and components available. In the line of Eurocom Mobile Workstations with 3rd generation Intel Core i7 processors, Eurocom offers customer choices between displays from 15.6” to 17.3” matte or glossy and graphics options from NVIDIA Quadro 5010M, 4000M to 3000M with up 4GB of DDR5 ECC (Error-correcting code) video memory . Eurocom offers the newest Intel processors from Intel i7-3920XM, i7-3820QM, i7- 3720QM to the i7-3610QM with up to 4 cores, 8 threads and 8 MB L3 cache. In terms of storage, Eurocom offers customers choices of Hard Drives, Solid State, Hybrid and mSATA drives; support for up to 3.08 TB of RAIDable storage offers customers the perfect mix between performance and redundancy. Large amounts of high quality, performance memory is a key aspect of a professional Mobile Workstation, Eurocom offers up to 32 GB of DDR3-1600 RAM via four sockets.

Processor

With an entirely new 22nm micro architecture, new Intel® Core™ processors pack a number of business-productivity-enhancing features onto the processor die to open up limitless potential. With new features that make working with media faster than ever, new 3rd generation Intel® Core™ processors help multimedia enthusiasts create, enjoy and share videos—how they want and where they want on their Eurocom notebook. Intel 3rd Generation Mobile Core Processors offer increase power efficiency, performance and security.

“In certain processor testing suites, Eurocom technicians have noticed upwards of a 14% increase in performance from Sandy Bridge processors to Ivy Bridge processors in the same EUROCOM Racer 2.0 platform. We are very excited about the performance offered by the new 3rd Generation Intel Core processors in our Racer 2.0 and Neptune 2.0 platforms. It is abundantly clear that Intel’s new 22nm and Tri-gate technologies have helped raise the performance ceiling in Eurocom systems” said Mark Bialic, Eurocom President.

Memory

Large amounts of high quality, performance memory is a key aspect of a professional Mobile Workstation, Eurocom offers up to 32 GB of DDR3-1600 RAM via four sockets in both the Neptune 2.0 and Racer 2.0. With four memory sockets customers can also choose to combine four smaller capacity memory modules for low cost memory configurations. Eurocom currently supports DDR3 1866, 1600 and 1333 RAM.

Display Technology

In Eurocom’s line of Mobile Workstations, there are choices between Full HD 1920×1080 15.6” and 17.3” displays. Eurocom offers customers choices between Matte and Glossy displays. This line of products also support Quad Buffering 3D support on external monitors for professional grade 3D support while on the go. Eurocom gives customers the option of professional display calibration to ensure the colour representation on your system is as accurate as possible.

Storage

In the EUROCOM Neptune 2.0, up to 3 storage drives are offered as well as an mSATA drive. In the EUROCOM Racer 2.0, two storages drives are offered, and an mSATA drive as well. With these storage configurations, Intel Smart Response Technology is supported, it is designed to give users enhanced system performance and responsiveness. Smart Response Technology is an intelligent caching setup that monitors data reads and writes to your storage drive and caches the most used or frequently accessed data. One of the main advantages of the mSATA drive is that it can b utilized to house the computers operating system and frequently used applications to ensure fast responsiveness and system performance. The Neptune 2.0 and Racer 2.0 support RAID 0/1/5 for increased storage performance or redundancy.

Graphics

Eurocom integrates NVIDIA Quadro professional graphics into their professional class notebooks because they adhere to higher quality and reliability standards than consumer level graphics cards. NVIDIA Quadro GPUs are designed and built to provide leading performance, reliability, compatibility and stability with applications like Adobe Creative Suite 5.5, Autodesk 3DS Max, Autodesk Autocad 2011, Autodesk Inventor 2012, Avid Media Composer, Dassault Catia, Dassault Solidworks, Siemens X, ANSYS, MATLAB, Dassault Simulia, ERDAS Stereo Analyst for ArcGIS and Landmark GeoProbe among many others.

Like NVIDIA, Eurocom believes NVIDIA Quadro professional graphics cards are the right choice for these types of applications because they provide the dependability that professionals require. NVIDIA and its ISV partners invest a great deal of engineering hours to provide optimized professional application solutions, resulting in a lower likelihood of a driver related software bug interrupting a professional’s work. Eurocom and NVIDIA recommend that if your livelihood depends on using professional applications, then Quadro professional graphics solutions are the best choice

Eurocom offers Quad buffered stereo support in quad buffered stereo applications with 3D stereoscopic glasses in all Eurocom Mobile Workstations, 3D displays and NVIDIA Quadro high end solutions. The 120Hz 3D signal is outputted to an external monitor via DVI-DL (DVI Dual Link) port

Eurocom has been testing new Intel Ivy Bridge technology with NVIDIA Quadro 5010M, 4000M, 3000M graphics as well as NVIDIA GeForce GTX 580M graphics with an Intel Core i7-3720XM Ivy Bridge processor. This is done to show customers the added benefits of NVIDIA Quadro graphics technology for professional applications. The results are below: (Red denotes the leader in that testing suite)

WHO: Verific Design Automation, supplier of industry-standard, IEEE-compliant SystemVerilog and VHDL parsers and elaborators

WHAT: Will exhibit at the 49th Design Automation Conference in booth #1807 and host the DAC Tuesday Night Reception

WHEN: Exhibits will be open Monday-Wednesday, June 4-6, from 9 a.m.-6 p.m. The Tuesday Night Reception will be held from 6-7 p.m.

WHERE: Moscone Center, South Hall, San Francisco. The Tuesday Night Reception will be held in Room 303/Outside Terrace.

WHY: Verific’s DAC theme, “Build Your Own Register Transfer Level (RTL) Tools,” invites computer-aided design (CAD) managers and system-on-chip (SoC) designers to find out how they can build their own internal RTL-based electronic design automation (EDA) tools with Verific’s Perl application program interface (API).

Verific’s software is also to be found in 32 other DAC exhibitor booths, serving as the front end to EDA and FPGA analysis, simulation, verification, synthesis, emulation and test tools. The Verific Parser Platform includes support for SystemVerilog, Verilog, VHDL and UPF.

For more details about Verific, visit www.verific.com.

Information on DAC can be found at www.dac.com.

About Verific Design Automation

Verific Design Automation, with offices in Alameda, Calif., and Kolkata, India, provides de facto standard front-end solutions supporting SystemVerilog, Verilog and VHDL design. Verific’s software is used worldwide by the EDA and semiconductor community in synthesis, simulation, formal verification, emulation, debugging, virtual prototyping, and design-for-test applications, which combined have shipped more than 40,000 copies. Corporate headquarters is located at: 1516 Oak Street, Suite 115, Alameda, Calif. 94501. Telephone: (510) 522-1555. Facsimile number: (510) 522-1553. Email: info@verific.com. Website: www.verific.com.

WHO: Breker Verification Systems, the System-on-Chip (SoC) Verification Company

WHAT: Will showcase TrekSoC™, software to solve complex verification challenges for SoC designs containing embedded processors, automatic generation of self-verifying C tests, and present talks by industry verification experts at the 49th Design Automation Conference in Booth #2501

WHEN: Monday-Wednesday, June 4-6, from 9 a.m.-6 p.m.

WHERE: Moscone Center, South Hall, San Francisco

To learn more about Breker Verification Systems and TrekSoC, go to: www.brekersystems.com.

For information about DAC, visit www.dac.com.

About Breker Verification Systems

Breker Verification Systems is an Electronic Design Automation (EDA) software company that provides innovative solutions to solve the challenge of complex system-on-chip (SoC) functional verification. Its TrekSoC™ software and unique SoC scenario-modeling™ approach are used in production at leading semiconductor companies in the U.S., Europe and India. More information about Breker can be found at www.brekersystems.com or at https://www.facebook.com/pages/Breker-Verificat[...]. Daily updates on company activities are available at twitter.com/BrekerSystems and additional information can be found at www.linkedin.com/company/1010418. Founded in 2003, it is privately held and funded. Breker Verification Systems corporate headquarters is located at 800 West El Camino Real, Suite 180, Mountain View, Calif. 94040. Telephone: (650) 336-8872. Email: info@brekersystems.com.

WHO:

EVE, the leader in hardware/software co-verification

WHAT:

Will showcase its ZeBu system-on-chip (SoC) hardware-assisted verification platform at the 49th Design Automation Conference in Booth #1926

When:

Monday-Wednesday, June 4-6, from 9 a.m.-6 p.m.

WHERE:

Moscone Center, South Hall, San Francisco.

Continuous demonstrations will highlight new software to expand ZeBu’s capabilities, including power-aware verification, post-run debugging, low-power and Flash memory models, and electronic system level (ESL) tool interfaces.

Also being demonstrated is a new e-zTest Ethernet validation platform, a transaction-based environment for high-speed validation of Ethernet functions in network routers, switches and controllers, and SoC application specific integrated circuits (ASICs) containing Ethernet ports.

To register for a demonstration or for more information about EVE and its hardware/software co-verification platforms, go to: www.eve-team.com. Details on EVE’s DAC events can be found at: www.eve-team.com/documents/DAC2012/events.html.

DAC’s website location is www.dac.com.

About EVE

EVE is the worldwide leader in hardware/software co-verification solutions, offering fast transaction-based co-emulation and in-circuit emulation, with installations at five of the top six semiconductor companies. EVE products shorten the overall verification cycle of complex integrated circuits and electronic systems designs, and can be integrated with transaction-level ESL tools and software debuggers, target hardware systems, as well as Verilog, SystemVerilog and VHDL simulators. EVE is a member of OCP-IP, the MIPI Alliance and Si2, along with ARM, Mentor Graphics, Real Intent, Springsoft and Synopsys Partner programs. Its United States headquarters is located in San Jose, Calif. Corporate headquarters is in Wissous, France. Other offices are located in India, Japan, Korea, Taiwan and Tunisia. Visit EVE online at: www.eve-team.com.

SANTA CLARA, CALIF. – May 23, 2012 – AccelOps, Inc., the leader in integrated Security Information and Event Management (SIEM), performance and availability monitoring for on-premise and cloud-based data centers, today announced that its software is now available through a United States General Services Administration (GSA) General Purpose Information Technology Equipment, Software, and Services Schedule 70 Contract. Under Contract Number GS35F0259J federal, state, and local government agencies now have a simplified channel through which to purchase AccelOps’ award-winning software for monitoring the security, performance and availability of their datacenter operations in real-time.

“Government agencies need real-time 360 degree infrastructure visibility and cross-domain correlation of events,” said Robert Yusin, vice president of sales at AccelOps. “They need full context monitoring in order to counteract cyber threats, comply with regulations such as FISMA, and ensure uninterrupted access to vital IT resources. AccelOps delivers next generation SIEM and unmatched full infrastructure monitoring so that security, compliance and data center professionals can work together to maintain a secure and responsive infrastructure that scales and performs to government requirements.”

The GSA contract enables government agencies to easily purchase the AccelOps software, support, and any custom engineering resources they may need at pre-negotiated prices, using a streamlined process. Over 150 customers, including various government and public agencies, have already deployed a single AccelOps tool as a replacement for multiple traditional single function solutions such as SIEM, application performance management, and network monitoring tools.

More information about AccelOps is available online at www.accelops.com.

About AccelOps

AccelOps provides a new generation of integrated security, network, and data center monitoring and management software for dynamic and virtualized data centers. Based on big data scale-out architecture and patent-pending distributed real-time analytics technology, AccelOps automatically analyzes and makes sense of behavior patterns spanning server, storage, network, virtualization and applications to rapidly detect and resolve problems. AccelOps works across traditional data centers as well as private and hybrid clouds. Its unmatched delivery of real-time and proactive security and operational intelligence allows organizations be more responsive and competitive as they expand the IT capabilities that underpin their business. For more information, visit www.accelops.com. Follow AccelOps on Twitter: @accelops and blog: www.accelops.com/blog/

Plymouth, ENGLAND – Plessey Semiconductors’ award winning EPIC™ sensor technology has been creating considerable interest with car manufacturers as it can be used to provide low cost, reliable detection systems for several automotive applications. Plessey will be launching a version, the PS25203, which is specifically aimed at this market at the Chicago Sensor Expo 2012. This has a lower gain and higher input impedance making it ideal for certain types of contactless ECG measurement such as driver fatigue monitoring or seat occupancy. The EPIC sensor is a completely new area of sensor technology and works by measuring tiny changes in an electric field in a similar way to a magnetometer detecting changes in a magnetic field even at a distance and through clothing.

There are several applications where EPIC can be used in cars. For example, driver monitoring for health and alertness by detecting heart rate and respiration or determining the occupancy of the car to adjust the ride, handling and air bag deployment depending on the size and location of occupants. The EPIC sensor electrodes can be easily and discretely incorporated inside the seat backs to acquire the necessary biometric data.

“Regulations and economics are meaning that car designs are all becoming very similar so that manufacturers have to differentiate their products by the user features and comfort inside the car,” explained Derek Rye, Plessey Semiconductors’ Marketing Manager. “We are only just starting to explore the new and exciting ways that these innovative sensors can be used to enhance and improve safety.”

EPIC sensors are already in commercial production by Plessey Semiconductors. By adjusting the DSP and amplification circuitry, the sensors can be tuned for detection at a distance as required for these automotive applications. Volume production pricing for the PS25203 is in the region of $1-2. The PS25203 is supplied in a custom 4-pin PCB hybrid package measuring 10.5mm x 10.5mm x 3.45mm.

Plessey will be demonstrating automotive and Sports and Fitness reference designs on their booth 627 at the Chicago Sensors Expo Show in June 6-7, 2012 (www.sensorsmag.com/sensors-expo). Application notes are available on the Plessey website at www.plesseysemiconductors.com/products/epic/app[...]

Plessey’ EPIC Sensor technology

The EPIC sensor, which requires no physical or resistive contact to make measurements, will enable innovative new products to be made such as medical scanners that are simply held close to a patient’s chest to obtain a detailed ECG reading or safety and security devices that can ‘see’ through walls. The sensor can be integrated on a chip with other features such as data converters, digital signal processing and wireless communications capability.

The technology works at normal room temperatures and functions as an ultra-high, input impedance sensor that acts as a highly stable, extremely sensitive, contactless digital voltmeter to measure tiny changes in the electric field down to milliVolts. Most places on Earth have a vertical electric field of about 100 Volts per metre. The human body is mostly water and this interacts with the electric field. EPIC technology is so sensitive that it can detect these changes at a distance and even through a solid wall.

Video demos at www.plesseysemiconductors.com/media_video.html

About Plessey Semiconductors Limited

Plessey Semiconductors are the leading experts in the development and manufacture of semiconductor products used in sensing, measurement and controls applications. Plessey’s products are found in a wide range of markets including communications, manufacturing, medical, defence, aerospace and automotive. Plessey designs their products specifically for high performance applications and its range of integrated sensing products includes electric potential sensors, CMOS image sensors and Hall Effect devices. These products all benefit from Plessey’s high precision, high temperature and radiation tolerant technologies.

23 May 2012: The ‘Cambridge Debate’ at this year’s Future of Wireless International Conference, will present the motion that the future of innovation in the wireless industry is in the virtual rather than the physical world. At the debate, which is hosted by BBC News correspondent Peter Day, Ray Anderson, CEO at Bango will speak for the motion while David Wood, Chief Technology Architect from Accenture Mobility will argue against, before the question is opened up to conference delegates culminating in a vote.

“The centre of gravity of innovation in the mobile industry has moved to the internet and the cloud,” says Ray Anderson. “With the phenomenal success of mobile apps and online stores vending all-digital content, the device is becoming commoditised, simply providing a platform for internet-speed start-ups and leading web brands such as Facebook, Google and Twitter to innovate. The future is all about apps, content and services, accessed whenever and wherever they are needed.”

But Accenture’s David Wood believes that industry growth and value is cultivated and realised because of innovation in actual physical materials, hardware components, advanced chipsets, manufacturing expertise, and elegant product design. “Interacting with the physical world through sensors opens up significant new innovation fronts in areas such as wireless healthcare and the Internet of Things,” says Wood. “Inherent, long-lasting value results from design, engineering and manufacturing expertise; the management of scarcity in areas such as radio spectrum and energy; and the expertise to manage complex network infrastructure. Players in the physical world will always have a fundamental role in innovation.”

The 2012 Future of Wireless International Conference will take place at The Møller Centre and Churchill College Cambridge on Wednesday 27 June 2012 and will reflect every part of the wireless value chain. Other speakers at the conference include Rory O’Neill, Vice President of Software and Services EMEA, RIM; Andy Hudson, Head of Spectrum Policy, Vodafone; Jim Maynard, President, Wavefront, Canada; Vincent Korstanje, VP Segment Marketing, ARM; Brian Robertson, Associate Director, Broadcom; Dr Jo Butler, Director of Spectrum Technology, Ofcom; Rupert Cezalet, Head of Public Affairs, Airwave Solutions; Ray Anderson, CEO, Bango and many more. The ‘Cambridge Debate’ at the end of the conference will be chaired by Peter Day, Business Correspondent, BBCNews, BBC.

The conference will also include exhibition zones along with hands-on workshops, facilitated brainstorms and plenary sessions. Next generation wireless start-ups will be showcasing their innovative ideas in the Start-Up Zone and the five winners from the Cambridge Wireless Discovering Start-Ups 2011 competition will pitch to the full conference at the Innovation Hothouse.

For more information and booking go to: www.cambridgewireless.co.uk/futureofwireless

Cambridge Wireless is grateful for the support from conference partners; UK Trade and Investment and ICTKTN, and its sponsors; Qualcomm, Anite, PWC, Rohde & Schwarz, Cambridge Consultants, Freescale, The Technology Partnership (TTP), , IC-Group, Telindus, Broadcom, Aeroflex, Arkessa, Jaltek Group, Agilent Technologies, Otaniemi Marketing (Finland), Olswang and the Canadian High Commission (which includes representatives from British Columbia, Ontario International Marketing Centre, Alberta and Invest Quebec)

About Cambridge Wireless

Cambridge Wireless is a leading industry forum and vibrant community with a rapidly expanding network of companies actively involved in the development and application of wireless technologies. In addition to high level networking dinners and events, a strong educational programme and business development activities, Cambridge Wireless runs the annual Future of Wireless International Conference along with the prestigious Discovering Start-Ups programme and competition to support emerging, innovative wireless companies.

Over 15 Special Interest Groups focused on specific technologies and market sectors, also provide opportunities for members to meet, form partnerships to exploit new commercial opportunities, and share knowledge and information about the latest industry trends and hot topics. Cambridge Wireless has partnerships with other leading industry clusters and organisations around the world to extend its international reach and to keep members up to date with the latest global developments and business opportunities. For more information, please visit www.cambridgewireless.co.uk

The CMX971 is a high performance quadrature modulator featuring a wide operating frequency range, excellent modulation accuracy and low power consumption. The device can be programmed via a simple serial bus or working in ‘direct control’ mode, which does not require connection to a serial controller. In both modes programmable features include a local oscillator divider ratio (divide by 2 or 4) and linearity vs. noise optimisation. The device can operate over the RF output range of 20MHz – 1GHz with a power supply voltage of 3.0V – 3.6V.

The CMX971′s quadrature architecture supports a wide range of modulation formats and standards. The device provides translation from baseband I/Q signals to a modulated RF signal. The differential inputs are ideal for direct connection to standard modems and interface ICs such as CML’s CMX7163, CMX7164, CMX910, CMX981 and CMX7861.

The CMX971 is available now, comes in a very small, RF-optimised 16-lead VQFN package, measuring only 4mm x 4mm x 1mm. The device has minimal external components, making it ideal for space-constrained applications. The CMX971 offers the designer excellent performance, flexibility and fast time-to-market.

Logic Supply, a leading provider of specialized computers for industrial and embedded applications, introduces the LGX ML200 Fanless Case. Engineered around the Intel DN2800MT “Marshalltown” Thin Mini-ITX motherboard, the ML200 capitalizes on the board’s low-profile design, offering a height of less than 1.5 inches. Mountable and durable, the ML200 is a robust, industrial enclosure perfect for appliance computing, remote deployments, data/image acquisition, and factory automation.

“Our engineering team saw the need to take advantage of the Marshalltown’s small footprint and pair it with a high-quality ruggedized case,” Kristina Bond, Product Marketing at Logic Supply, explained. “Based on feedback from Intel’s Small Form Factor/All-in-One group, LGX has created an industrial case specifically built around the advantages of the Marshalltown.”

The DN2800MT (“Marshalltown”) is Intel’s follow-up to the popular D945GSEJT (“Johnstown”) board that launched the Thin Mini-ITX platform. Improvements include a dual core CPU and lower TDP (from 11.8 W to just 8 W). Updated I/O includes support for mSATA storage, HDMI, and high-current USB 2.0 ports for fast charging of other devices. The ML200 leverages the versatile feature set of the DN2800MT, allowing support for two storage devices (mSATA and SATA HDD) as well as touting slimmed down dimensions and fanless design.

The ML200 has a clean and simple look and feel, with an extruded aluminum top and plenty of surface area for heat dissipation. Forgoing a fan, the enclosure’s heat pipe provides effective cooling while protecting the internal system from exposure to dust and grime.

In addition to the standard back panel I/O of the DN2800MT, the ML200 has expansion options for two wireless antennas, as well as space for a four-pin power connector for use in automotive applications. The front panel offers two additional USB ports, COM port punch-outs, and a power button. The ML200 comes standard with mounting brackets for quick installation to a variety of surfaces, including DIN mounting rails.

The ML200 was showcased at the Intel Solution Summit in New Orleans. See YouTube for the short product video: youtu.be/So5lgSfuGPU

The LGX ML200 is available from Logic Supply: www.logicsupply.com/ml200 Engineering services and hardware customization is available for project customers.

About Logic Supply

Logic Supply is a specialized computer systems provider serving the embedded and industrial computing market with custom engineered solutions. With locations in USA, Europe, and Asia, Logic Supply provides pre-configured small form factor systems, the most comprehensive selection of compatible components, and unique computer hardware. Logic Supply is an Intel® Intelligent Systems Alliance member and offers engineering services and turnkey assembly for OEM customers and custom OS development for Windows Embedded Standard and Linux platforms. Visit the Logic Supply USA website at www.logicsupply.com or EU site at www.logicsupply.eu.

London, 22 May 2012 – For the first time in almost two years, quarterly global optical networking (ON) revenues were down year-over-year (YoY), according to Ovum. Sales in China and Europe also fell sequentially more than is typical, leading Huawei and Alcatel-Lucent to post their worst global quarterly revenues since 3Q07 and 2005, respectively.

In a new market share analysis*, the global analysts found revenues declined 9% from the year-ago quarter, while annualized spending retreated by $300m, or 2% sequentially, wiping out a third of the gains of 2011. Sales also underperformed versus this period last year across all regions, with North America the “least bad” (down 8%, the smallest percentage in the last three quarters) and EMEA performing the worst (down 15%, the largest percentage in nearly two years). Yet, Ovum is still forecasting modest 4% growth this year to $16.2bn.

“Preliminary results for 1Q12 indicate more a cause for concern than a cause for panic,” says Dana Cooperson, practice leader of Ovum’s Network Infrastructure practice. “While 1Q sales are typically lower than 4Q sales, actual spending last year overshot our $14.9bn forecast when results in Asia-Pacific and Europe were less negative than we predicted.”

One explanation Ovum is giving for the poor 1Q12 result is that the weakness expected in late 2011 is happening now, predominantly due to continued macroeconomic and political challenges in Europe. “Also 4Q/1Q market seasonality is becoming more pronounced as spending and spending growth shifts to Asia-Pacific and South & Central America (SCA), in which case sales should rebound more than is typical in 2Q12,” comments Cooperson.

In terms of vendor performance, NEC benefited in 1Q12 from strong sales in its home market, rising 0.4 share points; its quarterly WDM sales were the strongest ever seen. Cisco pointed to strong year-over-year revenue growth in North America, Asia-Pacific (specifically Japan), and SCA. And while Huawei’s revenues may have tumbled sequentially, its YoY results beat the quarterly market average globally and in EMEA, and thus it picked up share.

In the network core, more vendors than in the past included data center interconnect as a key driver of growth for their business and for use of 100G, control plane, and encryption features. “However, mobile backhaul remains a ubiquitous growth driver at the network edge, with vendors noting the increasing speed of evolution from SONET/SDH to Ethernet/MPLS for aggregation and transport. As 100G deployments grow, 40G deployments are holding steady,” concludes Cooperson.

About Ovum

Ovum provides clients with independent and objective analysis that enables them to make better business and technology decisions. Our research draws upon over 400,000 interviews a year with business and technology, telecoms and sourcing decision-makers, giving Ovum and our clients unparalleled insight not only into business requirements but also the technology that organizations must support. Ovum is an Informa business.

SANTA CLARA, Calif., May 22, 2012 — Alcatel-Lucent (Euronext Paris and NYSE: ALU), is to enter the $4bn-a-year market for Internet core routers, with breakthrough technologies that promise enhanced capacity and connectivity, improved energy consumption and dramatically lower costs for the world’s communication networks. To learn more read Alcatel-Lucent’s new product press release.

The international telecommunications group today unveiled products that modernize the global backbone of the Internet to deal with the new era of video and cloud-based services. In a similar way to telephone exchanges controlling the flow of voice traffic and communications, Internet Protocol (IP) core routers control the flow of data and video traffic in metropolitan areas and cities, across national network backbones and in the global Internet.

Rapidly rising demand for online video and data is being driven by smartphones, tablets, connected TVs and other devices, and enabled by faster copper, fiber and wireless broadband access. These dynamics are forcing network operators to accelerate capacity upgrades in the core of their networks. At the same time, the emergence of cloud-based services and personalized content is driving the need for more flexibility in these networks to quickly adapt to the requirements of consumers and businesses.

Ben Verwaayen, Chief Executive of Alcatel-Lucent, said: “The new digital economy demands constant and rapid evolution of the networks that manage and deliver data traffic, connecting the hand of consumers with their content and applications in the cloud. Our market entry is the data equivalent of revolutionizing telephone exchanges. It will enable our customers to optimize the delivery of Internet video, gaming, photo sharing and data-hungry business applications.”

Speaking at Alcatel-Lucent’s annual technology symposium, Mr. Verwaayen said the new technologies had been pioneered by the company’s fast-growing IP division, which has already secured more than 25 percent of the market for service provider ‘edge routers’ – the systems that network operators deploy to manage broadband connections and service quality for residential and business users.

Alcatel-Lucent estimates its new products, which have taken more than three years to develop, will deliver a five-fold improvement in capacity and performance as well as energy savings of 66 percent compared with today’s typical IP core routers. Network operators currently spend an estimated $4bn a year* on IP core routers and the combined global energy consumption of core routers has been estimated by Bell Labs to exceed 1.8 Terawatts by 2016, the equivalent of 128,000 homes.

“For over a decade we have invested in advanced silicon and software technology, most recently demonstrated by our breakthrough network processor chipset, FP3, announced in June 2011. Now we are applying this technology to the largest nodes in the Internet, core routers,” said Basil Alwan, president of the company’s Internet Protocol division. “Our 7950 XRS core router systems sit at the massive intersections of the Internet, where billions of individual messages are directed to the correct destinations every second. Our technology will provide more capacity and more flexible traffic management with reduced energy consumption, helping to ensure better performance from global broadband networks.”

Operators welcome Alcatel-Lucent’s announcement

Major telecom operators, including BT, NTT Communications and Verizon today welcomed Alcatel-Lucent’s announcement and its potential to enhance the global Internet.

Karl Penaluna, President, BT Global Networks and Systems, said: “BT is constantly improving our network to deliver new and better broadband services to our consumer and business customers. We’ve been using Alcatel-Lucent’s 7750 Service Router for many years as part of the rollout of the 21CN program across the UK. As we deal with increasing traffic volumes and deliver the growth in cloud services from our data centers, we’ll need platforms for our national and metro core networks that scale to 100G links and beyond. We’re also constantly seeking to reduce our physical footprint and power per bit, so we’re very encouraged to see Alcatel-Lucent meeting these challenges with the 7950 XRS.”

Fumio Ito, Vice President Network Services Technology of NTT Communications, said: “The success of our broadband services worldwide is resulting in rapid traffic growth in our IP network. As we carry more traffic, we have to improve the power and space efficiency of our network infrastructure. We are pleased to see innovation from Alcatel-Lucent that brings enhancements to the IP network in terms that might be able to address our operational challenges and costs.”

Ihab Tarazi, Vice President of Global IP and Transport Planning and Technology at Verizon, said: “Verizon is experiencing tremendous growth in metro Ethernet services. Platforms such as the Alcatel-Lucent 7950 XRS will help us efficiently scale to support higher speeds and new capabilities while offering efficiency and flexibility. We applaud Alcatel-Lucent for its bold approach to router value and performance.”

To learn more:

Join the live webcast on May 22 at 9:15 AM PT/12:15 PM ET/6:15 PM CET: www.media-server.com/m/p/794x623o. To view the webcast replay visit: www.media-server.com/m/p/794x623o.

Read the newest Alcatel-Lucent TechZine feature: Building a Core Router for the Next Decade

Watch the 7950 XRS video on YouTube: www.youtube.com/watch?v=_l5A3sLbLBM

Press kits are also available at www.alcatel-lucent.com/events/2012/annual-techn[...].

Product and executive photos can be downloaded at www.flickr.com/photos/alcatel-lucent/

Tweet about us on Twitter! #rethinkthecore

*Source: Dell Oro group, Feb 2012

About Alcatel-Lucent (Euronext Paris and NYSE: ALU)

The long-trusted partner of service providers, enterprises and governments around the world, Alcatel-Lucent is a leading innovator in the field of networking and communications technology, products and services. The company is home to Bell Labs, one of the world’s foremost research centers, responsible for breakthroughs that have shaped the networking and communications industry. Alcatel-Lucent was named one of MIT Technology Review’s 2012 Top 50 list of the “World’s Most Innovative Companies” for breakthroughs such as lightRadio™, which cuts power consumption and operating costs on wireless networks while delivering lightning fast Internet access. Through such innovations, Alcatel-Lucent is making communications more sustainable, more affordable and more accessible as we pursue our mission – Realizing the Potential of a Connected World.

With operations in more than 130 countries and one of the most experienced global services organizations in the industry, Alcatel-Lucent is a local partner with global reach. The Company achieved revenues of Euro 15.3 billion in 2011 and is incorporated in France and headquartered in Paris.

For more information, visit Alcatel-Lucent on: www.alcatel-lucent.com, read the latest posts on the Alcatel-Lucent blog www.alcatel-lucent.com/blog and follow the Company on Twitter: twitter.com/Alcatel_Lucent.

FOUNTAIN HILLS, Ariz., May 22, 2012 — OpenSystems Media (OSM), LLC today launched a new monthly e-Newsletter for DSP-FPGA.com. OSM also enhances web content with new app and consolidated coverage of feature topics including DSP, FPGA, and EDA. These feature topics have their own corresponding TechChannel for even more rich content for DSP-FPGA.com readership. More than 35,000 engineers will receive the monthly e-Newsletter.

The announcement comes before the leading show on Design Automation Conference (DAC 2012) which will be held at the Moscone Center in San Francisco, California, from June 3-7, 2012. Live coverage of the show will be included in OSM’s first issue with video, photos, and social media coverage. You can visit OpenSystems Media and get a hard copy of the DSP-FPGA Resource Guide at booth #1104. For registration information click here www.dac.com/dac+2012+registration.aspx.

DSPs and FPGAs are complementary solutions for a vast array of high-performance signal processing applications. Because of their programmability and performance, together or separately, designers employ DSPs and FPGAs in systems ranging from wireless base stations and Gigabit Ethernet, to radar and embedded vision applications, industrial controls, and consumer electronics. At DSP-FPGA.com, OSM covers these technologies from the details of the latest IC designs, to the associated EDA and development tools, application kits and software, to provide engineers with the information they need to know to develop advanced signal processing systems.

“OSM is introducing a new app along with the DSP-FPGA.com newsletter. The first version will include the recently compiled 2012 Resource Guide with future releases synchronized to the monthly newsletter,” said Rosemary Kristoff, President, OpenSystems Media.

“It makes logical sense to cover EDA as it relates to FPGA design, and the use of FPGA prototyping in SoC/ASIC design,” said Mike Demler, Editorial Director, DSP-FPGA.com. “Additionally, the Twitter following of DSP-FPGA.com is a loyal following with exceptionally high open rates for DSP-FPGA.com e-mails.”

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media is also the leader in driving leads and awareness through social media and is the largest producer of lead-generation tools such as webcasts, whitepapers, product directories, Tech E-Briefs, TechChannels, and Techcasts. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. OpenSystems Media also offers the Embedded Computing Design iPhone and iPad app for the embedded industry. Current publications include: Embedded Computing Design; Military Embedded Systems; CompactPCI, AdvancedTCA, & MicroTCA Systems; DSP-FPGA.com; PC/104 and Small Form Factors; and VITA Technologies. For more information, visit www.opensystemsmedia.com.

For More Information Contact:

Rosemary Kristoff

OpenSystems Media

480-967-5581

rkristoff@opensystemsmedia.com

DALLAS (May 22, 2012) – Today, Texas Instruments Incorporated (TI) (NASDAQ: TXN) announced another ultra-low-power industry first with the ULP Advisor software code analysis tool, teaching developers how to create the most energy-efficient, ultra-low-power applications with TI’s MSP430 microcontrollers – and helping make the world greener one design at a time. Created by MSP430 microcontroller experts, the ULP Advisor tool is the first, true software-based, power-optimization teaching tool for microcontrollers that brings together decades of MSP430 microcontroller and ultra-low-power development experience. The ULP Advisor tool provides a static code analyzer that flags software code and offers ultra-low-power tips and tricks to help developers understand where to improve code, line by line, resulting in milliamps and nanoamps saved in designs for ultimate low-power performance. This hands-on teaching tool not only helps developers optimize current application code to achieve longer battery life, it also helps them avoid the same types of ultra-low-power pitfalls when designing future applications, making it an essential development tool for any MSP430-based project. For more information, visit www.ti.com/ulpadvisor-pr-lp.

“Developing the industry’s lowest power microcontroller with the ‘Wolverine’ MSP430 microcontroller platform wasn’t enough for us,” said Emmanuel Sambuis, general manager, MSP430 microcontrollers, TI. “It’s important to us to help guide those using our devices through ultra-low-power development and ensure they are equipped to develop the most power-efficient designs. Our robust software offering, including the ULP Advisor code analysis tool, is a very important piece of development. ‘Those who can’t do, teach,’ is a popular, yet outdated adage. Today, TI is proving that those who can do, also teach and create a new generation of experts around them.”

Features and benefits of ULP Advisor software code analysis tool:

• Checks code against a thorough specification list of “ultra-low-power best practices,” flagging and itemizing each “ultra-low-power rule violation” via a graphical user interface.

• Highlights areas of improvement and provides comprehensive resources on how to optimize applications for ultra-low power.

• Interactive, community-focused wiki offers information specific to each ultra-low-power rule, code examples, videos, tutorials, links to relevant technical documentation and promotes collaboration between experts and beginners where anyone can contribute ultra-low-power insight.

• Free software tool that supports all MSP430 devices and applications – integrated into TI’s Eclipse-based Code Composer Studio™ integrated development environment (IDE) v5 and included in the latest version of IAR Embedded Workbench.

Pricing and availability

ULP Advisor software is available today and is included in the latest install of Code Composer Studio IDE version 5.2. Download it here for free. The ULP Advisor tool joins the other helpful MSP430 microcontroller software tools, including Grace™ graphical peripheral configuration software and MSP430Ware, which can also be accessed through TI’s Code Composer Studio IDE v5. Also available in the latest version of IAR Embedded Workbench for third party IDE support at www.ti.com/ulpadvisor-msp430ware-pr-sw. A standalone version is coming soon to support other compilers or IDEs such as open-source MSPGCC.

For more information:

• ULP Advisor wiki: www.ti.com/ulpadvisor-pr-lp

• ULP Advsior tool folder: www.ti.com/ulpadvisor-pr-sw

• MSP430Ware: www.ti.com/ulpadvisor-msp430ware-pr-sw

• Grace software platform: www.ti.com/ulpadvisor-grace-pr-lp

• MSP430 microcontrollers: www.ti.com/ulpadvisor-msp430-pr-lp

• “Wolverine” MSP430 microcontroller platform: www.ti.com/ulpadvisor-wolverine-pr-lp

• Code Composer Studio IDE: www.ti.com/ulpadvisor-ccstudio-pr-sw

• Make the Switch to TI microcontrollers: www.ti.com/make-the-switch

TI’s broad portfolio of microcontrollers (MCUs) and software

From general purpose, ultra-low power MSP430™ MCUs, to Stellaris® Cortex™-M MCUs to real-time control C2000™ MCUs, and Hercules™ safety MCUs, TI offers the broadest range of microcontroller solutions. Designers can accelerate time to market by tapping into TI’s complete software and hardware tools, extensive third-party offerings and technical support.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

Uniquify, a leading semiconductor intellectual property (IP) and application specific integrated circuit (ASIC)/system-on-chip (SoC), integration and manufacturing services provider, today announced it has become a TSMC Design Center Alliance (DCA) partner.

“Uniquify will be a valued DCA Partner, capable of supporting TSMC customers across multiple technology nodes,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “It’s an organization that has successfully taped out to TSMC processes and has an established track record.”

The TSMC DCA program provides service choices from register transfer level (RTL) to chips, including full-chip placement and routing, RTL-to-GDS implementation, as well as offering mixed-signal/analog/RF building blocks. In order to effectively support TSMC’s customers, Uniquify provides SoC integration, high speed interface IP and manufacturing service that includes delivery of finished, tested parts.

“We are proud to work with TSMC,” said Josh Lee, Uniquify’s Founder and Chief Executive Officer. “Our expertise in the latest processes and leadership in low-power design will help us maintain a solid track record with DCA customers.”

About Uniquify

Headquartered in Silicon Valley, Uniquify is a privately held, rapidly growing application specific integrated circuit (ASIC)/system-on-chip (SoC) design and Super SoC (SSoC) integration and manufacturing services provider and an innovative developer and provider of high-performance semiconductor IP. The company has design centers in Santa Clara, Calif., Pune, India, and Seoul, Korea. It maintains sales offices in Santa Clara and Seoul, Austin, Texas, Taipei, Taiwan and Tel Aviv, Israel. With more than 100 employees, Uniquify offers 65-, 40- and 28-nanometer ASIC and SoC design expertise, SSoC integration and manufacturing services and high-performance IP to leading semiconductor and system companies worldwide. Additional information can be found at: www.uniquify.com.

SANTA CLARA, CALIF. – May 22, 2012 – AccelOps, Inc., the leader in integrated Security Information and Event Management (SIEM), and performance and availability monitoring for on-premise and cloud-based data centers, today announced that it has added 150 customers and raised $15 million in new funding. These developments underscore the company’s ability to meet the growing demand for more secure, responsive and adaptive IT infrastructures, regardless of whether the infrastructure is physical, virtual, located on-premise or in the cloud.

Since the company introduced its product two years ago, over 150 customers have deployed AccelOps software to integrate the security, performance and availability monitoring in more than 300 networks. Customers include managed service providers, government agencies and enterprises in all vertical sectors, including financial services, education, healthcare, manufacturing, and retail. AccelOps’ ability to supply comprehensive and actionable operational intelligence empowers IT professionals to deliver more secure, responsive, and adaptive infrastructures than is possible with traditional single function tools.

“With more organizations deploying private and hybrid cloud solutions, and increasingly sophisticated security threats looming, there is a broad and growing need to correlate and analyze events across the entire IT infrastructure in real-time,” said Chris Rust, Partner at US Venture Partners (USVP). “As validated by their large and fast growing global customer base, AccelOps has developed a unique and compelling architectural approach that is the first to address this need with a unified ‘single pane of glass’ application that has proven scalability to large globally distributed multi-tenant environments. We are delighted to join the shareholder base of such an exciting IT infrastructure software company.”

USVP, one of Silicon Valley’s premier venture firms, is leading this round of funding which raised a total of $15 million, which includes the participation of the company’s existing investors. USVP has a long history of investing in lasting companies that define and dominate high growth markets in information technology, clean technology, and healthcare. The new funding in combination with the company’s revenues will drive the expansion of the company’s business.

“Without AccelOps IT organizations would require multiple separate tools to monitor their infrastructure,” said Elie Antoun, CEO of AccelOps. ”The silo approach is expensive, non-scalable and incapable of delivering real-time comprehensive analytics, especially as the move to virtualization and the cloud accelerates. AccelOps was founded on the belief that the highest value to be delivered to IT infrastructure monitoring arises from true real-time cross-domain analytics. We are very happy that Chris and USVP are committed to supporting the successful execution of this goal.”

AccelOps architected a new generation of integrated monitoring and security software from the ground up to deliver real-time, cross-correlated information from almost any source across an organization’s entire IT infrastructure. The AccelOps solution is agnostic to whether the IT infrastructure is physical, virtual, on-premise, or located in the cloud. Uniquely, the AccelOps solution scales more easily than other software because it runs on virtual machines that can be easily added or subtracted as the number of monitored events changes. Its multi-tenant capabilities provide a comprehensive view of the information and can be tailored for individual customers or groups. And, the AccelOps solution comes with over 1000 ready-to-use reports and rules for 200 security threat scenarios that allow users to detect and make sense of complex IT patterns and events in real time.

More information about AccelOps is available online at www.accelops.com.

About AccelOps

AccelOps provides a new generation of integrated security, network, and data center monitoring and management software for dynamic and virtualized data centers. Based on big data scale-out architecture and patent-pending distributed real-time analytics technology, AccelOps automatically analyzes and makes sense of behavior patterns spanning server, storage, network, virtualization and applications to rapidly detect and resolve problems. AccelOps works across traditional data centers as well as private and hybrid clouds. Its unmatched delivery of real-time and proactive security and operational intelligence allows organizations be more responsive and competitive as they expand the IT capabilities that underpin their business. For more information, visit www.accelops.com. Follow AccelOps on Twitter: @accelops and blog: www.accelops.com/blog/

Braunschweig, Germany – 22nd May 2012. Symtavision, the global leader for timing design and timing verification for embedded real-time systems, has announced that it has been appointed as a Contributing Member of the ARTOP (AUTOSAR Tool Platform) User Group.

ARTOP is an Eclipse-based infrastructure platform implementation of common base functionality and core features for development tools that are used to design and configure AUTOSAR-compliant systems and ECUs. The aim of ARTOP is to improve the quality and interoperability of AUTOSAR development tools and help eliminate the time lag between the release of new versions of the AUTOSAR standard and the availability of development tools that support the new specifications. Development is organized by the Design Members of the ARTOP User Group, which includes BMW, Continental and Peugeot/Citroen, and implemented using a transparent, community-based approach by the group of ten Contributing Members including Symtavision. ARTOP, including its source code, is available free of charge to all AUTOSAR members and partners.

“Our appointment as a Contributing Member of the ARTOP User Group recognises both our leading role in the development of AUTOSAR-compliant systems and ECUs and emphasizes our commitment to designers by improving the common base for AUTOSAR development tools,” said Dr. Kai Richter, CTO of Symtavision. “We have benefitted considerably from using ARTOP to minimize our development costs for non-competitive functionality and freeing development resources to concentrate on our competitive advantage. As a consequence, we have developed considerable functionality around ARTOP which we expect, as a Contributing Member, to integrate into future releases for the benefit of other tool developers.”

About Symtavision

Symtavision® is a leader in embedded design software tools and services. The company enables the rapid and cost-effective planning, optimization and timing verification of complex, safety- and performance-critical embedded real-time systems – from early-phase estimation to final verification.

Symtavision’s innovative scheduling analysis tool suite for system-level timing design and timing verification, SymTA/S, helps engineers conquer design challenges for controllers, processors, bus/networks and complete integrated systems. It is used extensively in automotive electronics with support provided for industry standards including AUTOSAR, CAN, FlexRay and OSEK, and in the avionics industry with support provided for ARINC 653 partitioned operating systems and ARINC 664 switched Ethernet, and time-triggered communication. SymTA/S also provides support for a variety of other industry sectors including the automation, multimedia, telecommunications and transportation markets. Symtavision’s associated TraceAnalyzer is a powerful solution for visualizing and analyzing timing data from both measurements and simulations. TraceAnalyzer seamlessly integrates with SymTA/S.

Symtavision is headquartered in Braunschweig (Germany) with subsidiary offices in Munich (Germany) and Cologne (Germany) and is supported by a global network of distributors. Symtavision is also a founding member of the Real-Time Experts Alliance which was formed in 2008 to provide complete solutions for all timing challenges in real-time systems development. For more information visit: www.symtavision.com.

Montpellier, France, 22nd May 2012. Cortus, a technology leader in ultra low power, silicon efficient 32-bit processor IP, announces the release of the latest member of their processor family: the energy efficient APS3R. The APS3R builds on experience with the earlier APS3 core but delivers improved computational performance. For more demanding embedded applications a dual core configuration is possible.

The Cortus APS3R is a 32-bit processor designed specifically for low power embedded systems featuring a 32-bit modern RISC architecture with sixteen 32-bit registers and a 5-7 stage pipeline. It is the second member of the Cortus microcontroller IP core family to be released in 2012 complementing the single precision floating point FPS6 core.

“Our first processor core, the APS3, has been the smallest available native 32-bit IP core since its release in early 2006”, says Michael Chapman, CEO and President of Cortus, “It has been in high volume production for almost four years in a wide range of applications ranging from SIM cards to Bluetooth LE”. He adds, “With the new APS3R we have found new ways to raise computational performance while keeping power consumption and silicon area small”. Chapman explains, “APS3R extends Cortus’ advantage in terms of DMIPS/mW and DMIPS/mm2 over alternative cores”.

The CPU’s dynamic power is 11.6 µW/MHz with a standard 90 nm process and 16.8 µW/MHz for 130 nm (both UMC). The APS3R delivers 1.21 CoreMarks/MHz* and 2.29 DMIPS/MHz computational performance.

The APS3R CPU core can be as small as 8,700 gates which is a size comparable to most 8-bit cores. APS3R is a native 32-bit core, optimised for use with C or C++, resulting in a software development process that is far more straightforward than that for 8- or 16-bit cores. With considerably more computation per clock cycle than with an 8-bit core, far fewer cycles are needed and therefore considerably less power is required. With superior code density, code memory is also smaller than with 8- or 16-bit cores thus reducing the silicon footprint of a subsystem.

The APS3R has been developed for applications requiring good computational performance but very low power. It is well suited to applications such as wireless communication, sensing, smart cards, SIM cards, touchscreen controllers and systems using energy harvesting.

For more computationally demanding applications an optional parallel hardware multiplier can improve the core performance to 1.92 CoreMarks/MHz. Further improvements are possible with a dual core APS3R configuration.

As a member of the Cortus family of processors, APS3R interfaces to all of Cortus’ peripherals including Ethernet 10/100 MAC, USB 2.0 Device and USB 2.0 OTG via the efficient APS bus. It also shares the simple vectored interrupt structure which ensures rapid, real time interrupt response, with low software overhead. Bridges to and from AHB-Lite™ and to APB™ ensure easy interfacing to other IP.

The APS toolchain and IDE (for C and C++) is available to licensees free of charge, and which can be customised and branded for final customer use. Ports of various RTOSs are available such as FreeRTOS, Micrium µC/OS and µCLinux.

www.cortus.com/aps3r.html

(*CoreMark 1.0 : 1.208312 / GCC4.5.3 20120201 (Cortus Eval) -mmul -flto -O3 -funrollall-loops -finline-limit=500 -IC:/cortus-ide/toolchain/aps3/include -DPERFORMANCE_RUN=1 -Wl,–noinhibit-exec -Wl,–relax / STACK)

About Cortus S.A.:

Cortus S.A. is the cost/performance leader for 32 bit processor IP for embedded systems. Cortus cores are used in applications where one or more of small silicon footprint, low power consumption, good code density/small code memory size and high performance are important.

Cortus is the world leader in terms of DMIPS per square micrometre and DMIPS per microwatt.

www.cortus.com

The Minmax MSGWI06 Series is a compact 6 watt DC/DC converter in an SMD package with a footprint of .87” x .80” x .40” The product features remote on-off and an ultra wide 4:1 input. This series is EMC compliance to EN55022 Class A emissions and EN61000 immunity standards. With an ultra wide input range and international safety approvals, these worldwide marketable power modules are ideally suited for space critical applications in battery-powered equipment.

Single and dual outputs are available with efficiency ratings up to 83%. Comprehensive preventative circuitry includes a fully regulated input, operating temperature range of -40ºC to +80ºC and overload protection. The MSGW106 Series AC/DC power modules use high quality, 100% RoHS compliant materials and are manufactured to Minmax’s rigorous ISO-9001 quality control program to ensure high product reliability.

The MSGWI06 Series provide a cost effective solution for many space critical applications in commercial and industrial electronic equipment. The MSGWI06 pricing starts at $11.17 in OEM quantities, with availability from stock to 8 weeks ARO. Full specifications are available at www.minmaxpower.com or by contacting our technical group at tech@minmaxpower.com. For price and delivery questions, please contact us at sales@minmaxpower.com.

About Minmax Technology

For over 23 years, Minmax has provided leadership for power conversion products as a specialist in the design and manufacturing of low to middle power DC/DC converters & AC/DC power modules. The standard range of converters covers power outputs from 1 to 60 Watts with the most comprehensive product ranges. Products are carefully designed and are certified to the latest international safety, EMI, and environmental criteria.

Requests for modified standard and full custom solutions are welcomed and typically handled with little or no additional engineering costs. We guarantee competitive price points, ease of distribution channels, fast delivery and superior technical engineering support.

In addition to the Hudson, MA office, Minmax Power’s distributors, Component Distributors and Norvell Electronics, offer ease of on-line ordering for customer convenience.

Augmented reality is a rapidly developing technology. All the big technological companies around the world are continuously investing in research and development for this amazing technology. Though still in developing stage, augmented reality has been started to get implemented in various fields that includes:

1. Training – Where engineering students can be provided with information on how mechanical stuff works.

2. Medical – Where doctors can access patients data for diagnostics. Moreover, AR can also help visualise patient’s bones or internal organs, which can help during complicated surgery.

3. Museums – Where information can be tagged on various artefacts such as its history, origin, when, where and by whom it was found, etc.

4. Aviations – Where it can help pilots by providing various information like enemy position, maps, trajectories & co-ordinates, climate, as well as technical information regarding the jet itself and much more.

5. Automobiles – Where car manufacturers use augmented reality windscreen that not only provide navigational functionality but also displays dashboard meter information as well as traffic information.

Furthermore, augmented reality can also be used for information and entertainment purpose for a common man. Currently many companies have developed AR applications for various cell phone platforms that can be downloaded and used for entertainment & informative purpose. Some of the applications that are available in the market include Google Goggles, Layar, Google Sky Map, Wikitude, and much more.

Imaginar is one of such company that creates unique 3D graphic contents that can be implemented into an augmented reality environment application, which can work with iPhone or iPad. Established in 2007, they are a group of professional and talented computer graphic artists, joined together to offer quality services in 3D imaging and 3D animation for advertising, film, architectural and entertainment industries. Through their collective efforts they have provided some excellent CG services to the likes of Honda, Budweiser, Shell, Puma, Sony, Nike and many more.

For more information, please visit: www.imaginar.co.uk/CMS/Augmented-Reality.htm

San Diego, California

The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.

The conga-TFS enables multimedia advancements and an exceptional visual experience across applications.

“We expect AMD Embedded R-Series APUs to be a great addition to our computer-on-module family and will be ideally suited for the highest graphics applications requiring lower power consumption,” explained Gerhard Edi, CEO at congatec.

congatec currently integrates three processors of the AMD Embedded R-Series Platform, ranging from an AMD R-272F Dual-Core 2.7/3.2 GHz TDP 35W APU with AMD Radeon™ HD 7520G GPU up to the AMD R-464L Quad Core 2.3/3.2 GHz TDP 35W APU with AMD Radeon™ HD 7660G GPU. The conga-TFS uses the AMD A70M Controller Hub and provides a powerful compact 2-chip solution with up to 16 GB dual-channel 1600MHz DDR3 memory.

The integrated graphics core supports DirectX ® 11 and OpenGL 4.2 for fast 2D and 3D image display as well as OpenCL 1.1. The dedicated hardware Universal Video Decoder for seamless processing of DVD, Blu-ray, and SDTV/HDTV content supports H.264, VC-1, MPEG4 Part 2 and MPEG2 video streams. The choice of graphics interfaces includes VGA, 18/24bit single/dual channel LVDS as well as three DisplayPort 1.2, one HDMI 1.4 and two Single link DVI enabling the direct control of three independent displays.

Supports OpenCL for Optimal Graphics Performance

The parallel processing by OpenCL™ 1.1 allows programmers to preserve their expensive source code investment across multiple product generations. OpenCL is a powerful programming environment with which computing tasks can be distributed and processed in a variety of processor systems involving a number of hardware units. The special feature of OpenCL is that multiple parallel execution is possible in a single step (SIMD=Single Instruction Multiple Data), so that it can support the classic parallel computer architecture as well. This is of crucial importance, because not only graphic representations but also many analytical problems are very well-suited to parallel processing.

Seven PCI Express 2.0 x1 lanes, PCI Express 2.0 x8 link, four SuperSpeed USB 3.0 ports, four USB 2.0 ports, four SATA 6Gb/s ports, one Gigabit Ethernet interface and high definition audio round off the comprehensive range of features.

The congatec board controller provides an extensive embedded PC feature set. The independent x86 processor makes functions such as system monitoring or the I²C bus faster and more reliable, even if the system is in standby mode.

Pricing and Availability

The conga-TFS is available immediately. Pricing for evaluation units starts at less than $400.

About congatec Inc

congatec Inc., with its North American headquarters in San Diego, California, is a leading supplier of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec currently has 128 employees and entities in Germany, Taiwan, USA and the Czech Republic. More information is available on our website at www.congatec.us .

WIXOM, Mich., May 21, 2012 — On May 15, 2012, Acromag Inc., a market leader in defense and industrial electronics, acquired the assets of Xembedded, LLC. This purchase adds the products of Xembedded, LLC to Acromag’s portfolio, benefitting both groups by combining product lines. Customers will have the advantage of a complete product solution, ranging from embedded CPU products to I/O solutions.

“Xembedded products are known for high quality and technology. Their focus on VME, VPX, and COM Express platforms complements Acromag’s FPGA, PMC, XMC, and I/O technologies,” stated David Wolfe, President of Acromag. This move also extends production of the many legacy products that Xembedded, LLC is known for.

The new “Xembedded Group” will now join the Acromag “Embedded Solutions Group” and “Process Instrument Group.” By forming this new group, Acromag is able to provide uninterrupted service to former Xembedded, LLC customers. Along with the products, Acromag has hired all of the employees of Xembedded, LLC in order to maintain the expertise to design, manufacture, and support the many products in the “Xembedded Group” portfolio. The new Xembedded Group will also work to continue relationships with the many sales representatives and distributors that have sold Xembedded products for years.

Xembedded has developed embedded solutions for over three decades. Their processor and I/O VME boards are used in machine control, medical equipment, automotive, robots, scanning equipment, semi-conductor manufacturing, homeland security, military, industrial welders, power generation, and high-speed packaging applications. Xembedded hardware and software products have been installed in over 400,000 systems worldwide and in thousands of individual OEM applications.

Mr. Wolfe added, “Using the engineering resources of Acromag, I believe we can begin a new era for the Xembedded products with a combination of talent and people that are among the best in the industry.”

About Acromag

Acromag has designed and manufactured measurement and control products for more than 50 years. They are an international corporation with a world headquarters near Detroit, Michigan and a global network of sales representatives and distributors. Acromag offers a complete line of embedded I/O and industrial computer products for military, aerospace, manufacturing, transportation, utilities, and scientific research applications.

www.acromag.com

About Xembedded

Headquartered in Ann Arbor, Michigan USA, Xembedded’s products are sold and supported worldwide. Xembedded (Xycom) is the originator of the Intel based VME processor module and has been providing embedded solutions for over three decades. Their product line includes a broad variety of processors on VPX, VME, CompactPCI, and PMC platforms as well as I/O, storage, and mezzanine card carriers.

www.xembedded.com

PHOENIX, Ariz. – May 21, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high- performance silicon solutions for energy efficient electronics, announced today that CVRx, a market-leading developer of proprietary active implantable technology to treat high blood pressure, is using its technology and manufacturing services. CVRx recently launched the Barostim neo™ – the company’s second-generation implantable anti-hypertensive barostimulation device – in Europe.

ON Semiconductor’s extensive experience in designing and manufacturing analog, digital and mixed-signal semiconductor solutions for a wide range of medical applications helped CVRx achieve the required reliability and device performance during extensive pre-production testing. In addition, the use of ON Semiconductor design kits and intellectual property, as well as its layout and foundry services, compressed the development cycle.

The Barostim neo contains three ON Semiconductor devices. Two custom application-specific integrated circuits (ASICs) include a high-voltage analog C5 process device and a digital control ASIC manufactured using ON Semiconductor’s I3T process, which supports digital integration, combined with mixed analog and smart power high-voltage structures. Also housed within the compact Barostim neo is an ON Semiconductor 8 megabit medical memory ASSP. All three devices achieve low-power operation to support long operational life – a key requirement for implantable medical devices.

“Our selection of ON Semiconductor for the development of our latest implantable device for treating hypertension has had multiple benefits,” said Joe DuPay, vice president of Research & Development and Operations, CVRx, Inc. “By combining our own core expertise with ON Semiconductor’s knowledge, experience and product longevity support in the demanding medical semiconductor market, we shortened the product development cycle while setting the highest standards in very low-power, reliable design.”

About CVRx

CVRx, Inc. is a private company and is headquartered in Minneapolis. The company has developed the Barostim neo for the treatment of high blood pressure and heart failure. For more information, visit www.cvrx.com.

About ON Semiconductor

ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance silicon solutions for energy efficient electronics. The company’s broad portfolio of power and signal management, logic, discrete and custom devices helps customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit www.onsemi.com.

ROZNOV, Czech Republic – May 21, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has expanded its operations located in Roznov with the opening of a new 4,000 square meter state-of-the-art research and design (R&D) facility. The center, located on the company’s Roznov campus, is focused on the development of energy efficient power solutions for use in televisions, notebook computers, battery chargers, white goods, and LED lighting and wireless applications.

The Event

On May 22, the company will host an onsite grand opening ceremony at its new Roznov Design Center. The event will begin at 12:30 p.m. at 1. máje 2230, 756 61 Rožnov pod Radhoštěm. Company executives will be in attendance, with Keith Jackson, president and CEO of ON Semiconductor, presiding over the opening ceremony. The event is organized under patronage of Czech Prime Minister Petr Necas. Government officials from the Czech Republic and Czechinvest have been invited. Members of the media are welcome.

New Design Center Building

Minimizing the impact on the environment was an important consideration during the design and construction of the new Roznov design center building, which houses 1,000 square meters of high tech laboratories. The building was constructed with power efficient heating and cooling systems. Several innovative energy recuperation systems have also been incorporated, including the transfer of wasted heat for hot water preparation and to warm general office space with the building. High efficiency windows and effective internal insulation have also been installed to further decrease the building’s carbon footprint. The building was designed byTeen Engineering and architect Michael Malysa. The general contractor for construction was Skanska. Last week, the building was awarded “Honorable Mention” in the 2011 Building of the Year Contest for the Industrial Buildings category. The award was given by Czech Chamber of Architects under patronage of regional council president – Zlin region.

Commitment to Czech Republic

“ON Semiconductor’s new Roznov Design center and all our talented teams in Roznov and Brno play a key role within the company’s global network,” said Keith Jackson, president and CEO of ON Semiconductor. “The Roznov design team is charged with developing innovative technologies and products to improve energy usage within the myriad of electronics manufactured by our global customers. As such, the products being designed in the Czech Republic are helping to reduce energy consumption and improve overall CO2 emissions.”

Both ON Semiconductor and the Czech government have made important financial investments into the success of our employees here and the company’s R&D, manufacturing and business support operations located in Roznov and Brno. In recent years, ON Semiconductor has expanded its manufacturing capabilities and capacity at its Roznov fabs, built the new Roznov design center facility, and expanded its IT and new product design teams by more than 50 people.

“The ongoing cooperation and subsidy support we receive from the Czech government, Czechinvest and EU funds have been fundamental to our decision to continue to invest in and grow our operations in the Czech Republic,” said Keith Jackson, president and CEO for ON Semiconductor. “The government subsidies ON Semiconductor receives assist in the advanced training of our local teams and have enabled us to bring on some of the equipment necessary for the expansion of our research, design, laboratory and manufacturing operations here. We look forward to continuing to build upon our successful working partnerships with government leaders and our outstanding company teams in the Czech Republic.”

History in Czech Republic

ON Semiconductor’s operations in the Czech Republic date back to 1999 when the company spun off from Motorola and took on the facilities and employees in Roznov. In the years since then, the number of Roznov design center employees has expanded from 12 to more than 100 design engineers. The entire Roznov campus, which includes the design center, a 6-inch wafer manufacturing fab, a silicon wafer production facility and business operations support teams now employs a total of approximately 1,300 people. The design facility ON Semiconductor operates in Brno was acquired in 2008, employs almost 100 people, and is focused primarily on development of state-of-the-art analog and mixed-signal integrated circuits for automotive applications. The company is also active with area universities to support and connect electronics engineering education and students with the industry.

About ON Semiconductor

ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance, silicon solutions for energy efficient electronics. The company’s broad portfolio of power and signal management, logic, discrete and custom devices helps customers effectively solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit www.onsemi.com.

ACR Systems Inc., one of the world’s leading suppliers of data loggers, has been designing and building data loggers since 1986. ACR data loggers are self-powered, pocket-sized instruments that are designed to measure and record temperature, relative humidity, electric current, pressure, process signals, pulse frequency, power quality and more. Customers have found a remarkable variety of places to use ACR data loggers, from outer space to rose farms to museums and laboratories.

Located in Surrey, B.C. Canada, ACR Systems Inc. provides rugged, flexible and cost-effective data loggers for all types of environments and testing needs. Their goal is to maintain their position at the cutting edge of today’s technology and applications, where they will continue to provide the solutions to the data logging needs of customers.

Established in 2004, NorthTree Associates (Victoria, MN) is a North American distributor that specializes in providing design engineers, test engineers and production engineers the best protocol, bus analysis, and board-level testing and debugging tools available.

CodePorting C#2Java engine allows all C# developers to automatically convert C# constructs to Java code which you do not find in Java by using auto-generated code. There are properties in C# which provide flexible mechanism to read, write or compute the values of private fields. These properties are also called accessors but there are no such C# equivalent properties in Java. While translating code, CodePorting C#2Java engine intelligently generates Java code to provide same functionality as provided by accessors.

Following example shows migration of C# properties in java:

C# Code:

namespace CSharp2java.Tests.Convert.Properties

{

internal class Test151 : Test15

{

internal void Method()

{

base.Property = 1;

int i = base.Property;

base.Property += 20;

base.Property++;

–base.Property;

}

}

public class Test15

{

public int Property

{

get { return mProperty; }

set { mProperty = value; }

}

private int mProperty;

}

}

Java code generated by CodePorting:

package CSharp2java.Tests.Convert.Properties;

// ********* THIS FILE IS AUTO PORTED FORM C# USING CODEPORTING.COM *********

class Test151 extends Test15

{

void method()

{

super.setProperty(1);

int i = super.getProperty();

super.setProperty(super.getProperty() + 20);

super.setProperty(super.getProperty() + 1)/*Property++*/;

super.setProperty(super.getProperty() – 1)/*–Property*/;

}

}

{

public int getProperty() { return mProperty; }

public void setProperty(int value) { mProperty = value; }

private int mProperty;

}

The Above Java code replicates the functionality of C# Properties through CodePorting C#2Java Engine.

Newly added articles and documentation pages

- Convert C# Proprties to Java Online using CodePortingC#2Java App: codeporting.com/blog/csharp-to-java-conversion/[...]

- Automatically Convert C# Unsigned Integer Types to java using CodePorting Engine: codeporting.com/blog/csharp-to-java-conversion/[...]

- Automatically convert C# using statement to java using CodePorting Engine: codeporting.com/blog/csharp-to-java-conversion/[...]

- Download CodePorting C#2Java API Samples for Ruby & C# on GitHub & CodePlex: codeporting.com/blog/csharp-to-java-conversion/[...]

Overview: CodePorting C#2Java App

CodePorting helps you make your .NET applications cross platform compatible and allows migrating your .NET solutions, projects and files into Java in the cloud. Other than speed and accuracy of conversion; port your C# code directly either by uploading .cs files contained in a .zip file or import directly from popular version control repositories like GIT, Mercurial HG and SubVersion. You can also download a Microsoft Visual Studio plugin and convert C# code in the real time without leaving the development environment. You may also build your own customized code conversion applications using CodePorting APIs.

Read more about CodePorting

- Start converting C# Apps and source code to Java: https://apps.codeporting.com/

- CodePorting Homepage: codeporting.com/

- CodePorting C#2Java Homepage: codeporting.com/apps/csharp-2-java

- CodePorting Documentation: codeporting.com/wiki/dashboard.action

- Watch out CodePorting introductory video: www.youtube.com/watch?v=aVO2WfVj4Og

Contact Us

Suite 163, 79 Longueville Road

Lane Cove, NSW 2066, Australia

Web: codeporting.com/

Phone: +61 2 8901 3609

Email: support [@] codeporting [dot] com

Abingdon, United Kingdom, May 21 2012 – Isansys Lifecare Limited, the provider of complete real-time physiological patient data services and systems, today announces the introduction of its Patient Status Engine’ the first cloud-based patient digitization and analytic solution for monitoring and predicting the present and future clinical status of patients anytime, anywhere. The introduction of the Patient Status Engine provides the platform for Isansys’ “Vitals as a Service” solution, which is now offered for priority beta deployments in hospitals and other healthcare facilities.

The Patient Status Engine is a complete end-to-end system that integrates wireless body-worn sensors with a cloud-based HIPAA/HL7 compliant Electronic Health Record (EHR), to transform real-time and historical continuous vital sign data into clinical status indicators and prediction tools. With the availability of these new cloud-based indicators and tools, healthcare providers can be notified of any change in a patient’s health status as it happens or predict changes that may happen in the future. This can “more effectively and affordably than ever before” address issues of in-hospital patient safety and avoidable deteriorations and significantly reduce hospital admission times. The Patient Status Engine allows healthcare providers to continue 24/7 surveillance of patients even after they have been discharged from hospital. As a networked and cloud-based system, patients and clinicians may be located anywhere. A further benefit is that a quantified record of a patient’s physiological status is established that can be used for audit purposes or to determine the effectiveness and quality of care.

Last month, Isansys announced CE certification for its LifeTouch Patient Surveillance System, comprising the LifeTouch HRV011 intelligent body-worn wireless sensor and associated Patient Gateway “the world’s first cloud-ready medical device of its kind, and the first to be certified as a Class IIa medical device under the European Medical Device Directive (MDD). Today’s Patient Status Engine launch is the extension of the LifeTouch System into the clinical healthcare cloud. The LifeTouch HRV011 sensor performs a key patient digitization function within the Patient Status Engine, and together with other devices allows healthcare providers to collect five vital signs continuously, wirelessly and in real-time – Heart Rate (HR), Respiration Rate (RR), Blood Pressure (BP), Pulse Oximetry (SpO2), and Temperature (T). The system also analyses the ECG signals to provide the essential data for Heart Rate Variability (HRV) techniques and methods. Other sensors such as accelerometers, weight scales and blood glucose sensors can be easily added to the network.

The data from the body worn sensors is transmitted via a patient gateway and LAN or WAN to the cloud-based EHR, which offers a powerful transactional interface to allow multiple and simple configurability and connectivity of incoming and outgoing data. The vital sign data continuously updates the EHR to provide dynamic charting, and is aggregated in the EHR where “apps” run to provide interpreted data and other information to nurses and clinicians (and, eventually, to patients and monitored individuals themselves). A typical “app” is a predictive early warning scores (EWS) algorithm that can be proprietary to the customer or licensed from a third party.

The Patient Status Engine is completely scalable. It can either run in a closed cloud allowing a single hospital, regional healthcare organization or HMO to maintain control over patient data; or it can run in a secure large cloud, for instance as a managed service across a whole country. The aggregated and de-personalized data in the database quickly builds into highly valuable Big Data sets for metadata analytics.

The EHR platform is being provided by Tolven Corp., developers of a unique open source solution for secure healthcare and life science information. By using an open source model, the Tolven platform provides a low cost and very robust approach that challenges many current paradigms in healthcare IT that rely on proprietary and expensive software. The network architecture, integration with the Tolven platform and the secure server hosting has been achieved in collaboration with Fujitsu. Fujitsu’s plans for a managed healthcare data service comprising secure servers, the Tolven platform and end-to-end connectivity provide global scalability and security for the Isansys Patient Status Engine.

Commenting on the announcement, Isansys Lifecare CEO Keith Errey said “this is a clear demonstration of the power of collaboration, the advantages of the open source approach, and the benefits that can now be realised for patients and healthcare providers around the world. We are very pleased to be working with such great teams at Tolven and Fujitsu. Together, we can really change the game and vastly reduce the costs for healthcare payers by combining the open source Tolven platform, Fujitsu’s open, but highly secure, managed service model and our own low cost, technology-agnostic systems and services. With such outstanding supporting platform technologies, we are delighted to offer Isansys’ Vitals as a Service solution for beta deployment to visionary healthcare providers worldwide.”

Rebecca Weir, Isansys Director of Business Development added: “This is a great moment for us. The complete end-to-end system, our Patient Status Engine “demonstrates our commitment to providing the latest technologies and devices to our customers in ways that invert many of the current business models in healthcare, and allow us to offer the benefits of the Patient Status Engine “significantly improved outcomes for patients and cost reductions for healthcare providers” in a simple, affordable service model. We really believe that this will have a fundamental and permanent impact on the way healthcare is structured and practised in the future.”

Members of the media interested in scheduling a briefing with Isansys Lifecare, or arranging a one-to-one media briefing with Isansys at the Wireless Life Sciences Alliance Convergence Summit (May 23rd – 24th, San Diego, California), can do so by contacting Nicky Denovan at nicky [at]evokedset[dot]com.

About Isansys Lifecare Limited (www.isansys.com)

Isansys Lifecare is a new generation healthcare company that provides patient surveillance and monitoring services built on an innovative, low cost and scalable platform

We work with leading healthcare professionals, institutes and policy organizations operating in a wide range of healthcare settings, who want to employ new patient monitoring technologies and methods to improve patient outcomes and reduce costs.

Isansys’ “Vitals as a Service” clinical solution provides continuous real-time information for automated patient surveillance, for early warning scores and track and trigger indicators, and for predicting adverse events. Through its low cost and highly scalable architecture, the LifeTouch-based system offers the opportunity for continuous surveillance of all patients regardless of whether they are in hospital, other care facilities, or at home. For the first time, healthcare providers can not only cost-effectively improve patient safety and enhance clinical outcomes, but also massively reduce costs associated with avoidable patient deterioration, medical errors, readmissions to intensive care wards, and admissions (and readmissions) to hospital.

About Continuous Patient Physiological Monitoring

It is well documented that patients who deteriorate and require admission to critical care or who suffer cardiac arrest, or many other adverse conditions, have abnormalities that are detectable by physiological observations well in advance. Continuous (or nearly continuous) monitoring of multiple vital signs provides the fundamental input for improved patient outcomes and reduced overall costs. In the US alone, remote patient monitoring devices are forecast to reduce healthcare costs by nearly $200 billion during the next 25 years, if more widely used by patients with certain chronic diseases (Source: Center for Technology and Aging Report, May 2010).

About Fujitsu (www.fujitsu.com)

Fujitsu is a leading provider of IT-based business solutions for the global marketplace. With approximately 175,000 employees supporting customers in 70 countries, Fujitsu combines a worldwide corps of systems and services experts with highly reliable computing and communications products and advanced microelectronics to deliver added value to customers. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 4.6 trillion yen (US$47 billion) for the fiscal year ended March 31, 2009. For more information, please see: www.fujitsu.com.

About Tolven (www.tolvenhealth.com)

Tolven based applications are in use in multiple sites in Europe, North America and Asia. The applications incorporate workflow, healthcare information standards, rules, and terminology management, thereby driving the evolution of complete solutions for comprehensive healthcare data collection, secure data storage, and semantic re-use of that data. The Tolven Platform is able to enforce a spectrum of patient consent functionality that fulfills compliance with existing and evolving standards for security and privacy across the globe. The Tolven electronic health record application set has achieved “complete” certification, for both inpatient and physician office venues, from the Office of the National Coordinator for Health Information Technology of the United States Department of Health and Human Services (oncchpl.force.com/ehrcert).

Tolven’s architecture facilitates secure exchange of both identified and de-identified clinical information among all relevant stakeholders (patients, clinicians, providers, insurers, pharmacies and researchers). The incorporation of JBoss Rules allows clinical decision support and analytical activities such as quality assurance reporting, epidemiology and clinical research to occur with minimal effort. The adaptive nature of the Tolven Platform has proven to be essential for gaining acceptance in areas where information technology has traditionally been inflexible, expensive to customize and cumbersome.

May 17, 2012 – ADL Embedded Solutions Inc., a leading provider of customizable, high-performance embedded solutions for demanding thermal and rugged environments, today has announced the release of its Linux-based System Sensor Technology, ADLSST. The ADLSST, System Sensor Technology utility brings to the Linux environment the same type of CPU health monitor functions that have previously been readily available only in the Windows environment. ADLSST is an essential tool for designers and engineers that allows monitoring of all key CPU voltages and temperatures which are key to optimizing performance, while staying within the allowed CPU operating parameters. For customers doing their own thermal solution installation, a heatsink verification function is included to test for proper heatsink installation.

The ADLSST makes use of a proprietary BIOS API module which allows access to a variety of ADL Embedded Solutions board specific data including: board temperatures and voltages, serial number, firmware revision, BIOS revision, board history, UPS, and datalogging features which can help with documentation and technical support issues.

According to JC Ramirez, ADL Embedded Solutions Product Manager, “Our ADLSST utility is now functional with our ADLS15PC, ADLGS45PC, ADLD25PC, and ADLD2000PC platforms and will become a standard feature on all future platforms, thus reinforcing our continuing support for Linux for our embedded customers”.

For additional information about the ADLSST Software Utility and to download the utility for free, please visit www.adl-usa.com/products/accessories/datapage.p[...] or contact ADL Embedded Solutions at 858.490.0597 or email sales@adl-usa.com.

About ADL Embedded Solutions Inc.

ADL Embedded Solutions Inc. is a leading provider of customizable, high-performance embedded solutions for demanding thermal and rugged environments. ADL Embedded Solutions diverse portfolio of products range from SBCs based on the AMD Geode™ and Intel® Atom® processors through high-performance Intel® Core™ i7 Sandy Bridge built in PC/104 and 3.5” form factors, all of which can be delivered as part of a full system, or individual boards. Value-added services include ruggedization for high shock and vibration, extended temperature, and harsh environments, as well as CAD services including board modeling support and full enclosure design, build, and integration.

ADL Embedded Solutions serves customers in a variety of markets, including Medical, Transportation, Defense, Aerospace, Communication, Security, Process Control, and Science. For more information about ADL Embedded Solutions, visit its website at www.adl-usa.com or www.adl-europe.com.

MONTPELLIER, France – May 14, 2012 – Satin Technologies, the company that reinforces design flows with flexible and automated monitoring capabilities, will introduce a new product at DAC 2012 — SatinTech MS™. SatinTech MS is a software solution that allows companies to create an automated monitoring environment for existing design and delivery practices and to make this environment available to designers for immediate productivity gains.

With SatinTech MS, methodologists and project leads can quickly build multiple checklists to reflect existing design processes, and then designers can run these checklists at any design step, in association with their current log files and other design flow artifacts. As a result, raw design data are turned into actionable information, and smart design decisions can be made with fact-based accountability. Extracting and presenting information in real time helps engineers to monitor issues before they impact the bottom line. Fast, easy collaboration based on a common set of facts not only fosters team communication but also reduces error and enables faster time to market.

Until recently, design teams have had to address their monitoring needs with home-made, ad hoc systems, generally based on Excel checklists that engineers fill in at every design stage. Home-made scripts can, in some cases, facilitate checklist updating, but overall the process remains largely manual. SatinTech MS is dedicated commercial software, more flexible and easier to keep current than solutions built upon spreadsheets and home-made scripts.

SatinTech MS enables designers to focus on developing reliable products with better productivity and collaboration rather than on the limitations of a given monitoring system. SatinTech MS is comprised of two components – Checklist Editor and Dashboard Composer™. More than just a dashboard, SatinTech MS can support any customer methodology, any design flow and any delivery practice. Checklist Editor helps assemble checklists in minutes by gathering individual metrics and quality criteria for simultaneous assessment. If needed metrics do not exist, they can be created on the fly and made self-assessable, with defined verdict rules. Dashboard Composer applies one or more checklists to a design project. A simple click on the “compute” button ensures that the dashboard is up to date. Dashboards can be composed and inspected in different views. Decision support features allow users to focus on their own business, anticipate potential issues and take corrective actions when needed.

Satin Technologies will be demonstrating SatinTech MS in booth #2210 at DAC 2012 in the Moscone Center in San Francisco, California, from June 4th to 6th. For additional information, please see www.satin-tech.com/products.html

About Satin Technologies

Satin Technologies provides a design monitoring environment that moves all members of a design team beyond scripts and spreadsheets. SatinTech MS™ is a software solution that allows customers to create an automated monitoring environment for any target product (from IP to system) and any design and delivery practice. It’s child’s play to create multiple checklists as a reflection of existing quality processes, link these checklists to design data, and produce fact-based, automated dashboards upon demand by application of one or several checklists to any current project.

North Andover, Mass. – May 14, 2012 – WIN Enterprises announces the PL-60570, an affordable, compact desktop appliance with Intel® D2500HN, a mini-ITX SBC. The Intel® Desktop Board D2500HN optimizes the performance of the Intel® Atom™ processor D2500 and the Intel® NM10 Express Chipset. The appliance supports general computing, thin client applications, and delivers plenty of performance to support the rich Internet experience demanded by today’s business user.

The 1.86GHz processor features integrated Intel Graphics Media Accelerator 3600, enabling high definition video playback. Four channels of High Definition Audio and GbE LAN are also featured. A two-year lifecycle is provided by the device.

PL-60570 is the first in a new series of compact 2U networking appliances from WIN Enterprises called the WIN Gisele Series. These flexible networking platforms will feature the latest boards in an attractive chassis for OEMs wishing to go to market with a uniform appearing family line.

Features

• Latest generation Intel Atom D2500HN (1.86GHz) mini-ITX board

• Max memory size 4 GB

• VGA graphics output

• 8x USB 2.0, 2x SATA, 1x GbE, 1x PS2

• Ventilated 2U enclosure with attractive aluminum front panel

What: A composite of the 2012 DesignCon educational forums & workshops. This new DVD showcases tools, demos, videos, and presentations including:

· Design and Simulation

· Validation of a Model

· Debug, Validate and Characterize

· System Test

· Compliance Testing

· Compliance Standards Information

When: Available now

Where: www.agilent.com/find/HSD-Pinpoint

Additional

Information: www.agilent.com/find/HSD

This growth in the embedded Linux marketplace has created a complex multi-source software supply chain as developers combine in-house developed packages with packages easily found on sites managed by various associations or groups, as well as individuals who offer free code. Learning how to manage the open source development process has become crucial to organizations’ success and risk mitigation.

MontaVista and Black Duck Software will discuss how proper governance of open source can help realize the full benefits of the organization’s Linux-based embedded systems. Both companies will be available for a Q&A session immediately following the E-cast.

• Who: Joe Pearson, Director of Quality Assurance and Build, MontaVista and Phil Odence, Vice President of Business Development, Black Duck Software

• What: Industry experts from MontaVista and Black Duck Software present a live OpenSystems Media E-cast, “Manage the Code, Manage the Device: Open Source Governance in Linux”

• When: Thursday, May 10, 2012 at (2:00 p.m. EDT/11:00 a.m. PT)

• Where: To attend the E-cast, participants can register at ecast.opensystemsmedia.com/326

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media is also the leader in driving leads and awareness through social media and is the largest producer of lead-generation tools such as webcasts, whitepapers, product directories, Tech E-Briefs, TechChannels, and Techcasts. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: Embedded Computing Design; Military Embedded Systems; CompactPCI, AdvancedTCA, & MicroTCA Systems; DSP-FPGA.com; PC/104 and Small Form Factors; and VITA Technologies. For more information, visit www.opensystemsmedia.com.

NEW ORLEANS, May 8, 2012 — A national survey of wireless consumers shows they are extremely satisfied with service providers, strongly believe that wireless companies are providing users with a wide range of choices of wireless devices and service plans, and are surprisingly unaware of the average rate in taxes and fees they’re paying on their wireless bills. The annual Wireless Consumer Survey was conducted and released today by the consumer advocacy group, MyWireless.org, at International CTIA WIRELESS® in New Orleans, LA.

Among the survey’s specific findings are that 95% of American wireless users are either highly satisfied or satisfied with their wireless service provider. It also indicates that 85 percent of U.S. wireless consumers believe wireless companies are providing them with choices of wireless devices and service plans. While the survey reveals wide consensus on the value being provided by wireless companies, it indicates consumers are relatively in the dark when it comes to knowing what they’re paying local, state, and federal governments each month in taxes and fees. Nearly one-third of the respondents indicate they have no idea what they pay in monthly taxes and fees, and of those who provide an estimate of their monthly burden, about half believe it to be 9% or less. The national average is actually nearly 17 percent.

“It’s clear that Americans like what wireless means to their lives and believe that wireless companies are providing them with an outstanding deal. At the same time, they are unfortunately largely unaware they’re being gouged by shockingly high rates of taxes and fees for a service they use so much in their everyday lives,” said Amy McLean, Manager of Advocacy for MyWireless.org. “These results make us even more determined to educate consumers on the unfair tax and fee burden they’re bearing, and to help them stand up and tell their elected officials that enough is enough, and they should get tax relief much sooner than later.”

In addition to the lack of awareness of the average wireless tax and fee burden, more than 90% of those surveyed say they believe their wireless tax rate should be the same or less than the average general sales tax, which is approximately 7%. When asked about a five-year freeze on new state and local taxes and fees, 74% say they support it.

Results show that by more than a four-to-one ratio, respondents believe adding regulations would either make their service worse or make no difference, and by a ratio of 15 to one, think it would make their service more expensive.

Additional survey results and analysis are available at www.mywireless.org/media-center/data-center/.

McLaughlin & Associates and Penn Schoen Berland conducted this bipartisan national survey of 1,000 adult wireless phone users, who are likely voters. It was conducted between February 28 and March 1, 2012. Interviews were conducted by professional interviewers via telephone. Selection was at random within predetermined geographic units. These units were structured to statistically correlate with actual general election turnouts. The accuracy of the sample is within +/- 3.1% at a 95% confidence interval.

MyWireless.org® is a nonpartisan non-profit national advocacy organization, made up of wireless consumers, businesses and community leaders from around the country, supporting reasonable pro-consumer and pro-taxpayer wireless policies.

EVE, the leader in hardware/software co-verification, announced today that it has joined the MIPI Alliance as a MIPI Adopter.

The MIPI Alliance is a global, collaborative organization comprised of companies that span the mobile ecosystem committed to defining and promoting interface specifications for mobile devices. By joining the alliance, EVE will complement its family of fast ZeBu (Zero Bugs) emulation systems with a fast, robust synthesizable emulation verification components supporting MIPI standards.

“MIPI has emerged as the gold standard for mobile SoC device functions and interconnect,” remarks Luc Burgun, EVE’s president and chief executive officer. “We welcome an opportunity to participate in this industry standards setting group to better serve the design and verification community in need of MIPI standards.”

EVE provides accelerated system-on-chip (SoC) transaction-based accelerated verification for hardware and software developers who access ZeBu as a network resource. ZeBu is in use in production environments at leading semiconductor, communications, video and portable and stationary consumer product companies. It provides a library of off-the-shelf, synthesizable emulation virtual components. More than 30 are available to verify SoCs for wireless and wired communications, processors and consumer products, and provide co-emulation with virtual platform development environments for pre-silicon software development. EVE’s ZEMI-3 generates custom, synthesizable transactors for user custom protocols.

Typical projects achieve verification speeds that range from five to 30 MHz with ZeBu Blade II and ZeBu-Server. With Smart Debug, ZeBu provides 100% accessibility into the device under test and a hierarchical debug methodology to trace problems.

EVE will offer demonstrations of the ZeBu hardware-assisted verification family in Booth #1926 at the 49th Design Automation Conference (DAC) June 4- 6 at the Moscone Center in San Francisco.

About EVE

EVE is the worldwide leader in hardware/software co-verification solutions, offering fast transaction-based co-emulation and in-circuit emulation, with installations at five of the top six semiconductor companies. EVE products shorten the overall verification cycle of complex integrated circuits and electronic systems designs, and can be integrated with transaction-level ESL tools and software debuggers, target hardware systems, as well as Verilog, SystemVerilog and VHDL simulators. EVE is a member of OCP-IP and the MIPI Alliance, along with ARM, Mentor Graphics, Real Intent, Springsoft and Synopsys Partner programs. Its United States headquarters is located in San Jose, Calif. Corporate headquarters is in Wissous, France. Other offices are located in India, Japan, Korea, Taiwan and Tunisia. Visit EVE online at: www.eve-team.com.

Toronto, Canada and Paris, France — Sangoma Technologies Corporation (TSX VENTURE:STC), a leading provider of hardware and software components that enable or enhance IP communications systems for both voice and data, together with IT-LOGIQ, its France-based distribution partner, announced that Option Service, a provider of telecommunications services throughout France, has selected Sangoma’s NetBorder SS7 VoIP Gateway for interconnection with France Telecom’s SS7 network. Option Service operates over 1500 xDSL links used by businesses and enterprises for voice and data connectivity services.

“We are delighted that Option Service selected the Sangoma NetBorder SS7 VoIP Gateway for interconnection with the France Telecom network,” stated Xavier Paour, president of IT-LOGIQ. “We were confident that the reliability and ease of integration offered by the NetBorder solution will provide Option Service with cost-effective network signaling interconnections that are compatible with the French SPIROU SS7 protocol variant.”

Comprised of field-proven SS7 and SIP protocol stacks and control software, and award-winning digital PSTN interface boards, Sangoma’s NetBorder SS7 VoIP Gateways is one of a broad array of Sangoma products that address the need to interconnect disparate networks, technologies, protocols, and applications throughout the enterprise environment.

According to Philippe Laredo of Service Option, “While SPIROU compliance is an absolute requirement for connection to the France Telecom network, the ease with which we were able to integrate the Sangoma technology with our VoIP solutions truly set it apart, and sealed our selection.”

Service Option provides IP Telephony services to small businesses through large enterprises through service models that include on-premise IP-PBX deployments, gateway services to existing legacy PBX systems, and fully hosted services.

“Even as the business world moves steadily towards IP telephony, there is a real need to interface with the existing carrier infrastructure that relies heavily on SS7 for signaling, call routing and call control,” said Frederic Dickey, director of product management at Sangoma. “Sangoma’s flexible gateways facilitate carrier network connections with field-proven protocol and signaling technology that innovative service providers such as Service Option can quickly and easily integrate in value-added solutions for businesses.”

About Option Service

Headquartered in Genvry, France, Option Service is a telecom and datacom service provider operation a network of over 1500 links XDSL links and 130 optical fibers, providing data transport and IP telephony services for local authorities (town halls and Communities of Communes), hospitals and multi-site companies. This network makes use of the fiber infrastructure maintained by network operators including France Telecom, Completel, Sanef, and Téloise. Option Service independently provides voice, data, and video services over the network infrastructure.

A leader in delivering IP telephony services for more than 5 years, Option Service deploys best-in-class telephone sets and video-capable terminals with its Asterisk-based IP-PBX solutions. In addition to IP telephony equipment, Option Service engages with customers to consult, design, and implement voice and data networking solutions that scale to meet the needs of organizations of all sizes.

About IT-LOGIQ

IT-LOGIQ is a leading distributor of telecom and VoIP technology and systems in France. Focused on providing the expertise and consultancy necessary to satisfy the business needs of solution innovators and network infrastructure operators, IT-LOGIQ relies on the expertise of its professional staff of experts and a broad selection of products including network convergence, VoIP, signaling solutions, and high-density systems from leading manufacturers to deliver high-quality, flexible and reliable solutions.

IT-LOGIQ accompanies customers throughout projects from conception to deployment. It works closely with them to create solutions that are quick to market, deliver high-quality solutions that enable competitive service delivery and technology investment protection.

About Sangoma Technologies Corporation

Sangoma is a leading provider of hardware and software components that enable or en­hance IP Communications Systems for both telecom and datacom applications. Enterprises, SMBs and Carriers in over 150 countries rely on Sango­ma’s technology as part of their mission critical infrastructures. Through its worldwide network of Distribution Partners, Sangoma delivers the industry’s best engineered, highest quality products, some of which carry the industry’s first lifetime warranty. The product line in­cludes data and telecom boards for media and signal processing, as well as gateway appliances and software.

Founded in 1984, Sangoma Technologies Corporation is publicly traded on the TSX Venture Exchange (TSX VENTURE: STC). Additional information on Sangoma can be found at www.sangoma.com.

Nuremberg, 2012-05-03. CiA (CAN in Automation) has published the CiA 303 series of CANopen recommendations. Part 1 describes the pin-assignment for different connectors. In addition, this recommendation contains some hints for the CAN network cabling. Part 2 recommends the representation of SI units and prefixes, as they should be used in the CANopen device and application profiles. Part 3 proposes the CANopen LEDs indicating the status of the communication or detected errors. All three parts are free-of-charge downloadable (www.can-cia.org).

CANopen is one of the most used serial communication systems in quite different application fields. Originally developed for embedded machine control, it is also used in commercial vehicles, medical devices, lift control systems, rolling stock, building automation, and control systems for renewable energy.

For further information and technical articles please contact Ms. Cindy Weissmueller (pr@can-cia.org).

Eurocom Corporation (www.eurocom.com), a developer of long lifespan, fully upgradable notebooks is adding the newest AMD Radeon™ HD 7970M GPU to the 15.6” EUROCOM Racer 2.0 notebook. Eurocom will also offer the AMD Radeon™ HD 6990M GPUs separately to existing customers as an upgrade option.

The EUROCOM Racer 2.0 is a 15.6” small form factor Mobile Workstation utilizing the Intel Mobile HM 77 Express Chipset with support for the full line of 22nm Ivy Bridge Processors. Graphics support comes from AMD Radeon HD 7970M with support for overclocking for enhanced performance. The Racer 2.0 supports 32 GB of DDR3-1600 memory for unforeseen multitasking ability and performance in a 15.6” system.

“The addition of the AMD Radeon™ HD 7970M, the highest performing mobile solution from AMD, gives Eurocom customers a superior choice of video processor options to configure into their new Eurocom Racer 2.0 or upgrade into their existing system. This thing is a beast, our customers will love the graphics and overall performance of the Racer 2.0” said Mark Bialic, President of Eurocom.

AMD Radeon™ HD 7900M Series graphics processors are the most technologically advanced and feature-rich mobile GPUs AMD has ever created, enabling unsurpassed HD gaming and stereoscopic 3D entertainment. Eurocom has combined AMD technology in their mobile systems to offer a stellar entertainment powerhouse with massive computing power, delivering desktop graphics power to mobile gamers for the ultimate performance at home or on-the-go. Combined with a high quality Onkyo speaker system and THX TruStudio Pro, the Eurocom Racer 2.0 is a true notebook entertainment system.

EUROCOM Racer 2.0 will be bolstered by the introduction of the Intel Ivy Bridge processors and complete line of Intel 22nm processors. The Racer 2.0 will be one of the world’s first Ivy Bridge notebooks with Intel HM 77 chipset using the uFPGA988B socket. The EUROCOM Racer 2.0 is ideal for professionals and teams who frequently travel and need access to high performance computing.

The EUROCOM Racer 2.0 is built with an ultra heavy duty design for unintentional abuse while on the go. It is a fully upgradeable system with support for the best in mobile technology. The Racer 2.0 can be customized based on processor, memory, storage, display and wireless technology. Based on the HM 77 Express chipset from Intel the EUROCOM Racer 2.0 can support up to 32GB of DDR3-1600 memory from four sockets.

With support for an mSATA Intel SSD 310 Series drive, the storage capabilities and performance of the EUROCOM Racer 2.0 are second to none. Support for an mSATA drive greatly improves boot times, performance and battery life of the Racer 2.0. With no moving parts, Intel SSD mSATA drives offer high levels of performance and reliability in a small form factor system.

EUROCOM Racer 2.0 Specifications:

· 15.6-inch FHD 1920-by-1080 pixels; Matte (Non-Glare) or Glossy (Glare); LED Backlit Display

· Chipset: Intel HM77 Mobile Express Chipset

· Processor: up to Intel i7-3920XM Extreme Processor; supports both Sandy Bridge (32nm) and Ivy Bridge (22nm) Processors

· VGA Technology: AMD Radeon HD 7970M, NVIDIA GTX 660M (Kepler); GTX 675M, GTX 670M; Quadro 3000M, 4000M and 5010M; supports Optimus technology with NVIDIA graphics

· Storage: up to 3 drives; 1x HDD + mSATA + 2nd HDD via ODD bay

· Optical Drive: DVD-RW or BLu Ray-RW; BD-RW supports 100GB/120GB Blu Ray Discs

· Keyboard: Illuminated, backlit with user changeable 7-colours

· Webcam: 2M FHD 1920×1080; 30fps; with Samsung HD sensor

· Audio System: External 7.1CH audio output supported by headphone, microphone, S/PDIF and Line-in port; THX TruStudio Pro; two built-in ONKYO Speakers (2.2W) + Subwoofer (2.5W)

· Ports: DisplayPort 1.1a; HDMI out; DVI-I; eSATA; 2x USB 3.0; 3x USB 2.0; S/PDIF; Headphone; Mic; Line-in; Firewire-400; RJ45 (LAN)

AMD Radeon™ HD 7970M GPU Feature Summary:

· Process: 28nm

· 850 MHz Engine Clock

· 2GB GDDR5 Memory

· 1200 MHz Memory Clock (4.8 Gbps)

· 153.6 GB/s memory bandwidth

· 256-bit GDDR5 memory interface

· PCI Express 3.0 x16 bus interface

· 2176 GFLOPS Single Precision compute power

· 136 GFLOPS Double Precision compute power

· DirectX 11 graphics

· OpenGL 4.2 support

· Graphics Core Next (GCN) Architecture

o 9th generation programmable hardware tessellation unit

o 20 Compute Units (1280 Stream Processors)

o 80 Texture Units

o 128 Z/Stencil ROP Units

o 32 Color ROP Units

o 512KB L2 read/write cache

About Eurocom:

Eurocom is a leading developer of long lifespan, fully upgradable notebooks, high performance mobile workstations and mobile servers since 1989. The company has produced many firsts and continues to engineer VGA solutions that inspire and enable individuals and companies to reach great possibilities. Eurocom has been a leading innovator in the mobile computer industry since 1989. Eurocom is currently the only developer in the world offering a Server on the Go solution with RAID 01/5/10 support and up to 4 hard drives. For more information on Eurocom please visit (www.eurocom.com).