IIC testbed retrofits existing facilities for sensor-to-cloud connectivity

Needham, MA. The Consortium(IIC) has approved an IIC testbed on sensor-to- connectivity called the Smart Manufacturing Connectivity for Brownfield Sensors Testbed, which will enable integration of sensors with IT systems in existing facilities. The testbed, led by IIC member TE Connectivity, is being carried out with fellow IIC members SAP, ifm, and the OPC Foundation.

The Smart Manufacturing Connectivity for Brownfield Sensors Testbed will introduce retrofit automation hardware that makes use of existing physical connectivity; extract sensor data from the automation system; deliver the sensor data to SAP's IT platform through a secure OT/IT communication based on the IEC 62541 OPC Unified Architecture (OPC UA); and define and implement a common device model based on available open standards to allow for the integration of an IO-Link sensor with backend enterprise systems, enabling remote configuration of the sensor.

“Our testbeds are where new technologies, applications, products, services and processes - the innovation and opportunities of the Internet - can be initiated, thought through and rigorously tested to ascertain their usefulness and viability before coming to market,” said IIC Executive Director Dr. Richard Soley.

To learn more about the Smart Manufacturing Connectivity for Brownfield Sensors Testbed, visit http://www.iiconsortium.org/smart-connectivity.htm.

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