Thermal Management Webinar Series Offered by Advanced Thermal Solutions

Advanced Thermal Solutions, Inc. (ATS) is presenting a year-long series of thermal management webinars for all engineers, designers and program managers with an interest in electronics cooling. The online tutorials will provide practical information on critical areas of thermal management to help optimize individual cooling solutions.

Norwood, MA, April 1, 2008 – Advanced Thermal Solutions, Inc. (ATS) is presenting a year-long series of thermal management webinars for all engineers, designers and program managers with an interest in electronics cooling. The online tutorials will provide practical information on critical areas of thermal management to help optimize individual cooling solutions.

Each of the approximately one-hour tutorials will include detailed visuals and real time narration by an ATS thermal management expert. Viewers will be able to key in questions during and after the presentation.

“ATS Thermal Management Webinar Series tutorials are an ideal forum for engineers, designers and program managers to advance their knowledge of electronics cooling,” said Kaveh Azar, president and CEO of Advanced Thermal Solutions, Inc., the sponsor of the online web seminar series. “Well suited for electrical, mechanical, photo¬nics or network server engineers or DSP designers, ATS online training programs will provide attendees with practical, focused, technical information enabling them to identify optimal solutions for electronics cooling.”

Each webinar in this series will focus on a different topic in the critical arena of electronics thermal management. Tutorial topics include:

• April 30, 2008 at 2:00 p.m. (ET): “Heat Sink Selection Made Easy” As heat dissipation needs for electronic devices grow rapidly, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods and how to solve design challenges thermally and mechanically; and how to make the right custom or off-the-shelf heat sink choice for your application and budget.

• May 28, 2008 at 2:00 p.m. (ET): “Temperature Measurement in Electronics Design” Attendees will learn the importance of temperature measurement in electronic systems, the instruments that are necessary and locations within a systems where testing should be conducted.

• June 25, 2008 at 2:00 p.m. (ET): “Fan Characterization for Thermal Management” Exponential increases in power dissipation are forcing engineers to rely more on fans as the solution to their thermal challenges. But fans are also common points of failure within a system. As the choice and use of fans become critical to system functionality, knowledge of fan characterization is essential. Participants will be provided with solid methodologies for characterizing fans and deploying them within a system.

• July 30, 2008 at 2:00 p.m. (ET): “Air Velocity Measurement in Electronics Design” Participants will learn about the importance of measuring air velocity in a system, the instruments necessary for obtaining useful measurements and where these velocities should be recorded.

• August 27, 2008 at 2:00 p.m. (ET): “Liquid Cooling for Electronics Thermal Management” The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? This webinar provides the best practices for implementing a liquid cooling system.

• September 24, 2008 at 2:00 p.m. (ET): “The Benefits of Thermal Interface Materials” To cool hotter components, engineers are turning to larger fans and heat sinks and added surface area. But these hardware changes add significant cost to the design. Alternatively, a cooling systems performance can be improved just by using a better interface material to lower thermal resistance at the interface of the case and the heat sink. Participants will learn to overcome thermal challenges by making simple and cost-effective changes in thermal interface materials.

• October 29, 2008 at 2:00 p.m. (ET): “Tips and Tricks for Using CFD for Heat Sink and System Modeling” Computational Fluid Dynamics (CFD) tools have become simulation workhorses, enabling design engineers to tackle electronics cooling challenges on-the-fly. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a systems components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.

More information about the ATS Thermal Management Webinar Series, including course descriptions, schedules and how-to registration instructions can be found on the Advanced Thermal Solutions website, www.qats.com, or by calling 1-781-769-2800.

About Advanced Thermal Solutions

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769- 2800.