Vicor Announces Expansion of its BCM Series of DC-DC Converters in ChiP Format

New power modules are targeted for industrial, telecom, and lighting applications

Vicor\'s BCM in ChiP format
Vicor\'s BCM in ChiP format

Vicor Corporation today announced the expansion of its BCM series of DC-DC converters utilizing the Converter housed in Package (ChiP) power component format. The new BCM6123TD1E2663Txx is a high-density, high-efficiency, fixed ratio DC-DC converter module in a ChiP package, which operates from a 384 VDC nominal input and delivers an isolated and Safety Extra Low Voltage (SELV) 24V secondary output. It’s offered in a through-hole form factor measuring 61mm x 23mm x 7.26mm.

The introduction of the new BCM6123TD1E2663Txx expands Vicor’s family of high voltage bus converters to include K=1/8 (384 - 48VNOM), K=1/32 (384 - 12VNOM), and the new K=1/16 (384 - 24VNOM) modules. Targeting industrial, telecom, and lighting applications, Vicor’s family of high voltage bus converters enable system designers to create common bus voltages of 12V, 24V, and 48V directly from 384 VDC.

Based on the patented Sine-Amplitude Converter topology, high voltage BCM ChiPs are able to reach peak efficiencies of 98% and achieve power densities up to 2400W/in³. These modules can be paralleled into high power arrays and outputs can be put in series to achieve higher VOUT. In addition, the high voltage BCMs are offered with either analog or digital signal interface and all have an operating temperature range of -40˚ to 100˚C.

High voltage BCMs allow designers to reduce the amount of bulk capacitance needed at the load by utilizing the Sine-Amplitude Converter’s low AC impedance relative to the down-stream regulator, effectively ‘reflecting’ the capacitance across the module. With the new K=1/16 module, 500 µF of 24V point-of-load capacitance can be effectively provided by 2 µF on the module’s primary side.