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Many modern applications in optical fibercom industry require more and more heat power to dissipate. Various High Power tunable lasers need a significant amount of heat to be dissipated for optimal performance and stable wavelength. Sometimes typical telecom TECs of 23, 29, 35 couples in de-facto standard Butterfly packages are not suitable for temperature stabilization in high power applications. Developers and manufacturers have to switch for larger and more powerful TECs, but such types require more space and don’t fit in standard Butterfly package. In this case the typical solution is using of HHL headers with integrated thermoelectric cooling, but such solution in most cases is significantly more expensive than Butterfly.
The alternative and more optimal way could be to develop thermoelectric coolers with increased cooling capacity, that will fit in standard Butterfly package. TEC Microsystems GmbH presents new 1MDL06 Series of Miniature Thermoelectric Coolers for telecom applications. All TECs have the same dimensions of cold ceramics as typical telecom TECs – 6.0×8.2, 6.0×10.2, 6.0×12.2mm – standard sizes for 23, 29 and 35 couples TECs. But the cooling capacity of TECs is increased for more than 40% if to compare with standard thermoelectric coolers.
Based on RMT Ltd High Density pellets placement technology thermoelectric coolers of 1MDL06 Series have about 40% more pellets (Bi-Te elements inside TEC) on the same size as regular TEC. Plus together with ultra-low profile pellets of 0.3mm height it increases cooling capacity of TEC up to 100% higher, if to compare with regular types. For instance, typical 23 couples TEC has about 5.2-5.6W of max cooling capacity, meanwhile it’s analog[
] from new 1MDL06 Series has max 12.6W of cooling capacity – more than twice higher.
The increased cooling capacity of TECs from 1MDL06 Series also is optimal for regular telecom applications. More powerful in terms of cooling capacity TEC has a significant operating reserve, which means less electrical power consumption at the same conditions as standard telecom TEC. For example, let’s compare standard 1ML06-023-05 TEC with 23 pellet couples and it’s direct analog from 1MDL06 Series – 1MDL06-035-05 – with 35 pellet couples. Both have the same size of cold ceramics – 6.0×10.2mm. In the same conditions of typical application (Tamb = 85C, Total Heatload 2W, required dT=55K, ambient is N2) they have the following power consumption:
- 1ML06-023-05: I=2.6A, U=2.7V, Q=UI=7.0 W
- 1MDL06-035-05: I=1.8A, U=3.0V, Q=UI=5.4 W
Thus, the applying of new 1MDL06 TECs may reduce power consumption in standard application more than 30%.
Also, the constructional advantage of 1MDL06 TECs is in front porch for wire and WB solutions. Each TEC of new 1MDL06 Series is compatible with applications, where Wire Bonding connection method is aapplied. 1MDL06 TECs are provided with Au pads for WB, but also can be equipped with various WB posts to simplify Wire Bonding.
1MDL06 TECs are available on thin 0.25mm ceramics and standard 0.5mm. Total TEC height may very from ultr-thin 0.9mm to 2.6mm depending of application geometry and performance requirements.
All TECs are assembled with high temperature lead-free Sn-Sb Solder 230 (Tmelt=230ºC), providing them RoHS compliant. TEC Microsystems GmbH provides various ceramics surface options – blank, metallized or Au plated ceramics, including customized Au patterns on cold side. The complete list of 1MDL06 thermoelectric coolers for telecom applications is available by the following link:
