Embedded Computing Design

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EC-5500-5GDE

Vecow Co., Ltd. — December 2011

EC-5500-5GDE

High Performance, Rugged, Extended Temperature, Fanless Embedded system with 5 GbE, Isolated DIO, SUMIT A,B, and Intel QM67 Express Chipset and choice of 2nd Generation Intel Core i3 / Core i5 / Core i7 mobile processor

  • 2nd Gen Intel® Core™ i7/i5/i3 Sandy Bridge Mobile Processor
  • Fanless, -20°C to 70°C Operation Temperature
  • 5 GbE LAN for Extend Internet Application
  • QM67 System Chipset
  • Isolated DIO, 8DI / 8DO
  • Rich I/O: 4 COM, 6 USB, 2 Mini-PCIe (1 with SIM card socket)
  • Support SUMIT A, B and 2 SO-DIMM DDR3, up to 16GB
  • Dual Display: DVI-D / HDMI and VGA
  • 2 SATA III (6Gbps) 2.5? HDD / SSD

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