Thermal Load Board
Comtel Electronics GmbH — September 2007

Designed for analysis of cooling efficiency of AdvancedTCA chassis
- Front and RTM loads
- Managed over IPMB from the ShMC
- Front - Power dissipation up to 200 W
- RTM - Power dissipation up to 30 W
- Front power set in six zones to model the location of power-dissipating components on the board
- RTM power set in two zones
- Three temperature sensors on the front board
- One temperature sensors on the RTM
- Airflow measured at three points on the front board
- Airflow measured at single point on the RTM
- Setting zones power dissipation using IPMI Command
- Baffles set airflow impedance to 35% open (front) and 40% open (rear)
- Allows full NEBS ETSI thermal compliance testing without risk to expensive operational boards
- Provides interference free airflow measurements at every slot
- Provides for testing with boards of varying airflow impedance
- Provides for testing slots with different load powers
- Provides cooling analysis over six main and two RTM heat zones
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