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Embedded Computing Design

MPAC 3250

Telesoft Technologies — June 2008

MPAC 3250

With STM-1/OC-3 in a low profile PCI Express (PCIe) form factor the MPAC 3250 PCIe STM-1/OC-3 telephony board provides a powerful signaling and media terminating solution

  • 155 Mbps STM-1/OC-3 interface
  • Other interfaces: Dual E1/T1 interfaces;GbE interface
  • Wide range of fixed and mobile network protocol stacks offered including ISUP, GSM MAP, CAMEL, WIN
  • Windows, Solaris andLinux drivers available

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