Embedded Computing Design

Subscribe

Receive our complimentary magazine via U.S. Mail or E-mail.

Embedded Computing Design

Thermite 3

Quantum3D — August 2008

Thermite 3

Thermite 3.0 tactical visual computers

  • Modularity provides flexibility for tailoring CPU, graphics, video processing, networking, I/O, and storage
  • Power efficient Dynamic power control minimizes consumption and thermal dissipation
  • Designed for compliance to MIL-STD-810F, MIL-STD-461E, MIL-STD-1275B, MIL-STD-704F, and STANAG 1008 (contact factory for qualification status)
  • Media drives removable or integrated, shock-resistant, solid-state drives
  • Rotating media drive options for development
  • Performance 1.6 GHz Intel Core 2 Duo LV, with 2 GB or 4 GB system memory
  • Video capture Eidetix advanced PCI Express-based video capture and processing for real-time video capture
  • Combine state-of-the-art field-embedded computing with mobile graphics, conduction cooling, and support for open architecture operating systems

See also:

Go Back

Leave a Comment