0.18 micron (Ám) CM

ON Semiconductor

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The ONC18 process is an ideal platform for developing low power and highly integrated digital and mixed-signal application-specific integrated circuit (ASIC) devices for automotive, industrial and medical applications


  • The ONC18-based solutions will be manufactured at ON Semiconductor's 8-inch wafer fabrication facility in Gresham, Oregon, so the process is also expected to prove attractive for designers of U.S. military applications seeking domestic production with ITAR-compliant partners
  • ONC18 will allow designers in the automotive, industrial, medical and military sectors to develop integrated, low-power digital and mixed-signal ASICs quickly and cost-effectively
  • The ?on-shore' nature of the fabrication will be particularly useful for US military customers, while planned developments for the process further underline ON Semiconductor's commitment to the custom foundry business
  • Suitable for ASICs requiring up to 10 M gates, the ONC18 process features between four and six levels of metal and allows designers to integrate 1.8 volts (V) core voltage with 1.8 V and 3.3 V input/output (I/O)
  • Components for mixed signal design include a variety of resistors and nominal [1.0 femtofarad per micron squared (fF/?m2)] and high value (2.0 fF/?m2) stackable metal-insulator-metal (MIM) capacitors
  • This base process supports an extensive and modular 0.18 micron BCD, and high voltage roadmap
  • ON Semiconductor's new process is supported with a design kit offering comprehensive core, I/O and memory libraries
  • Gate densities and power consumptions for high density core and mixed signal core cells are 124 K gates/mm2 and 46 microwatt per megahertz per gate (?W/MHz/gate) and 120 K gates/mm2 and 28 ?W/MHz/gate, respectively
  • Memory options include 1.1 M bit synchronous single port and 512K bit dual port SRAM and 1.1M bit high-density, low-leakage VIA-programmable ROM
  • Future development for the ONC18 platform will enable ON Semiconductor to launch enhanced mixed signal capabilities and options for higher voltage handling
  • The new process design methodology is compatible with common digital and analog/mixed signal CAD tools, including those from Cadence?, Synopsys? and Mentor Graphics?
  • ON Semiconductor specialty services, such as advanced die stitching and shuttle services for prototyping, are also available for ONC18-based designs
  • For more information, please contact Kirk Peterson at kirk.peterson@onsemi.com or visit http://www.onsemi.com

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