maxiFLOW Heat Sinks
Advanced Thermal Solutions, Inc. — January 2010

Low height maxiFLOW heat sinks are designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions
- The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling
- Standard sink heights are as low as 9.5 mm
- The heat sinks are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins and minimizes weight
- Tests on maxiFLOW heat sinks using an airflow rate of just 100 linear feet per minute (lfm) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks
- Low profile maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP mounting hardware
- These assemblies meet Telcordia GR-63-Core, ETSI 300 019, and MIL-STD-810 shock and vibration testing standards
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