• Can be mounted directly to hot electronics such as CCDs in high-precision imaging systems
• Provide up to 40 percent higher cooling capacity at cold temperatures
• Solid state
• Can be integrated into a final assembly in either of two common configurations: Air-Air (AA) or Direct Air (DA)
• AA uses convection cooling where heat is absorbed and dissipated by high-density heat exchangers and ducted outward via shrouds and fans
• DA uses conduction coolingthrough a cold plate and then air is moved across the cold plate similar to AA

See also:

• Laird Technologies products
• Restart Search

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