• Provides conductivity between a board's hot components and heat sinks at a moderately rugged level, effective in relatively benign venues such as a command and control center, for example
• Provides 2.0 W/mK thermal conductivity
• Easy to apply, voiding the need for adhesive coating
• Vended in 0.010 thickness increments ranging from 0.020" (0.50 mm) all the way to 0.200" (5.0 mm)
• Stable at -40 C to + 160 C and RoHS compliant, the gap filler provides electrical isolation and is certified to UL 94V0 for flammability
• The thermal pad's soft texture requires only minimal pressure when conforming to the board's design, thus thermal resistance and stress on mating parts are reduced or even eliminated

See also:

• Laird Technologies products
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