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RapidIO Trade Association Announces Fall 2006 Global Design Summits in North America, Japan, South Korea, China, and India

The RapidIO® Trade Association announced its Global Design Summits schedule for Fall 2006 spanning North America and Asia. Designed for engineers and engineering managers, these complimentary events will focus on Serial RapidIO technology, interoperability, applications and designs. Key members of the RapidIO eco-system are expected to lead the programs including Freescale Semiconductor, Integrated Device Technology (IDT), Jennic, Mercury Computer Systems, Inc., QNX Software Systems, Silicon Turnkey Express, Texas Instruments, and Tundra Semiconductor Corporation, among others.

June 19th, 2006

The RapidIO® Trade Association announced its Global Design Summits schedule for Fall 2006 spanning North America and Asia. Designed for engineers and engineering managers, these complimentary events will focus on Serial RapidIO technology, interoperability, applications and designs. Key members of the RapidIO eco-system are expected to lead the programs including Freescale Semiconductor, Integrated Device Technology (IDT), Jennic, Mercury Computer Systems, Inc., QNX Software Systems, Silicon Turnkey Express, Texas Instruments, and Tundra Semiconductor Corporation, among others.

Featuring: Serial RapidIO:

• Technology Introduction and Update

• Comparison vs. Ethernet and PCI Express

• Device and Interoperability Demonstrations

• Software Considerations

• Design Tips and Application Papers

Schedule:

August 17, 2006 – Boston, Mass.

September 12, 2006 – Tokyo, Japan

September 14, 2006 – Seoul, South Korea

October 24, 2006 – Shenzhen, China

November 14, 2006 – Bangalore, India

Schedule is subject to change. Additional details on locations and registration will be posted on www.RapidIO.org

Fee: Complimentary

Info: 1.512.305.0070 or www.rapidio.org

RapidIO Trade Association

The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. The growth of the RapidIO ecosystem in 2005 seeded deployment of RapidIO technology in next generation wireless infrastructure, edge networking and military systems. Over 2006, the deployment of RapidIO will be furthered through RapidIO Trade Association initiatives including interoperability, interworking, the next Generation PHY Release, and system-level application demonstrations. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.

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RapidIO® is a registered trademark of the RapidIO Trade Association. Product and company names mentioned may be trademarks and/or registered trademarks of their respective holders.

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