A multi-chip-module (MCM module) is a specialized electronic package, where multiple integrated circuits are bundled in a single package that looks like a large integrated circuit. Dies are now placed horizontally alongside one another.


MCMs are quickly becoming the leading technology for applications where compact design is a prerequisite. A major advantage for MCMs is that they allow cheaper platforms for highly competitive markets, such as cellphones, handsets & portable computers. They also revolutionized the landscape of the microelectronics industry, by enabling design houses to focus on solutions and outsource all manufacturing aspects to specialized ODMs. This allowed them to explore more market opportunities with minimal risk and maximum exposure.


In this white paper, we will outline why embedded 3G MCM modules are a great alternative to discrete WWAN integration and, in addition to the obvious time savings, offer many other advantages. These advantages are quantified in a financial model, allowing you to make the trade-off between a discrete and a module solution for your design.