Lee Chee Ee, FTDI Chip

• The search for a simpler, more cost-effective way to implement USB 3.0 functionality

  Gordon Lunn, FTDI Chip and Lee Chee Ee, FTDI Chip

  The USB 3.0 SuperSpeed standard presents an order of magnitude increase in data rates compared with USB 2.0, thereby giving engineers the ability they need to address far more data intensive application scenarios. However, a number of flashpoints are arising that could potentially slow the adoption of this next-generation interface by the engineering community. Figures [...]