Adeneo Embedded expands market reach of Windows Embedded Compact 2013 with new BSPs and Shell solutions
Adeneo Embedded expands market reach of Windows Embedded Compact 2013 with new BSPs and Shell solutions. Adeneo Embedded releases new Windows Embedded Compact 2013 BSPs for ARM-based MPUs and announces the upcoming release of the "Adeneo Embedded Shell 2013"
Ecully, France, June 13, 2013 – Adeneo Embedded, a Windows Embedded Gold Partner recipient of a “Windows Embedded Partner Excellence Award” from 2007 through 2012 releases Windows Embedded Compact 2013 reference board support packages (BSPs) targeting ARM® Cortex™-A-based embedded processors, including Freescale® Semiconductor i.MX 6 series, Sitara™ AM335x ARM processors from Texas Instruments Incorporated (TI) and Xilinx Zynq 7000-EP all programmable SoC. Adeneo Embedded also announces the upcoming release of the “Adeneo Embedded Shell 2013”, which provides a Modern UI and Cloud-connected shell solution to OEMs developing Windows Embedded Compact 2013 based devices.
The new BSPs for Windows Embedded Compact 2013 were developed by Adeneo Embedded working together with Microsoft. They are all available from the Adeneo Embedded website, including a free binary demo image for evaluation purposes and full source code access for development.
The Freescale i.MX6 series BSP for Windows Embedded Compact 2013 targets development boards built to Freescale SABRE Lite design . It was developed in close cooperation with Freescale and leverages the existing Windows Embedded Compact 7 BSP from Adeneo Embedded along with new features, such as USB RNDIS6 and Display optimizations. It provides a full production ready solution to customers developing high-end embedded devices with advanced graphical, multimedia and multi-core performance requirements. Find additional information at www.adeneo-embedded.com/Products/Board-Support-[...].
The TI Sitara AM335x ARM processor BSP for Windows Embedded Compact 2013 is a migration of the Adeneo Embedded Windows Embedded Compact 7 BSP for the AM335x Starter Kit, with additional documentation and validation, to provide a robust reference BSP fully suitable for industrial design needs. It provides the most suitable solution for industrial customers seeking optimized cost solution with ARM Cortex-A8 performances. Find more information at www.adeneo-embedded.com/Products/Board-Support-[...].
The Xilinx Zynq-7000 BSP for Windows Embedded Compact 2013 is built upon the already available Windows Embedded Compact 7 BSP developed by Adeneo Embedded in collaboration with Xilinx, and offers the advanced Windows Embedded Compact 2013 capabilities to an all programmable SoC combining high performance Cortex-A9 MPCore integrated with fully customizable programmable logic. See www.adeneo-embedded.com/Products/Board-Support-[...] for additional information.
The Adeneo Embedded Shell 2013 is an optimized shell for Windows Embedded Compact 2013 suitable for all type of scenarios. With a full native code based architecture, it can be used in very low end, highly constrained embedded devices as well as for most advanced graphical and multimedia type of embedded products. It also brings a new modern user interface to a range of embedded devices.
With “Cloud-Connected” device management and remote maintenance interfaces, it also allows deploying various device control scenarios from desktop or mobile devices through the cloud, providing a cornerstone for the integration of Windows Embedded Compact 2013 based devices in complete intelligent system solutions. Find more at www.adeneo-embedded.com/Windows-Embedded-Compac[...].
“As a Windows Embedded Gold partner for 10 years, continuously recognized with Windows Embedded Partner Excellence Awards for the past 6 years, Adeneo Embedded has a long standing legacy working together with Microsoft on Windows Embedded Compact, along with close working partnerships with leading Silicon Vendors of the Embedded market, bridging the gap between OS and Hardware. By releasing Windows Embedded Compact 2013 BSPs for the most advanced ARM-based processor architectures the same day Microsoft releases Windows Embedded Compact 2013, Adeneo Embedded further emphasizes our work together.”, said Yannick Chamming’s, CEO of Adeneo Embedded. “With the new Adeneo Embedded Shell 2013 for Windows Embedded Compact 2013, we advance our reach, providing a critical piece of the puzzle to help OEMs and Enterprise customers deploying successfully Intelligent System scenarios with Cloud-connected devices based on Windows Embedded Compact 2013”.
“Adeneo Embedded has a long history of providing top quality BSPs for the performance and customization of the Windows Embedded Compact platform and we are excited to work with them as we launch Windows Embedded 2013 to the ecosystem,” said Steven Bridgeland, senior product manager for Windows Embedded at Microsoft. “Tools like the Adeneo Embedded new BSPs and shell solutions enhance the Windows Embedded Compact 2013 platform experience as developers create industry-focused small-footprint devices as part of intelligent systems.”
Supporting quotes from Silicon Vendor partners
- “Freescale’s extensive collaboration with Adeneo Embedded as a Freescale Connect proven partner, has made them a compelling choice to support numerous i.MX 6 series customers worldwide. Our customers needing Window Embedded Compact software and engineering services can leverage the Adeneo Embedded expertise in operating systems and application skills in embedded system design and will receive exceptional straightforward enablement and as a result.”
Ken Obuszewski, Freescale’s Director of business development for i.MX products
- “Adeneo Embedded, a platinum member of the TI Design Network, has been an active collaborator with TI to support our Sitara AM335x ARM Cortex-A8 processors with Windows Embedded CE 2013. The support and commitment Adeneo has provided to the Sitara platform has enabled our customers to get to market quickly and easily.”
Tom Kelly, Director, Design Network, Texas Instruments
- “Customers are always looking to differentiate their solution, and Xilinx’s Zynq-7000 devices enable them to achieve the performance, power and Time-To-Market advantages in a wide range of applications in Industrial, Medical, Automotive, and Test and Measurement market segments. Xilinx Alliance Member Adeneo Embedded’s expertise in delivering a pre-built Windows Embedded Compact 7 BSP and customization via design services has added great value to Xilinx’s customers. The addition of Windows Embedded Compact 2013 BSP will further strengthen this offering, and let customers build smarter systems based on the Zynq-7000 devices.”
Mark Jensen, Director, Processing Platforms Group
About Adeneo Embedded
Adeneo Embedded provides system integration, design, support and training services to companies seeking world-class expertise in embedded solutions using high-performance architectures. For over 10 years, Adeneo Embedded has helped clients, in all stages of development; create profitable, feature-rich products that incorporate software and hardware solutions based on Windows Embedded, Windows Phone and Windows 8 operating systems. Close working partnerships with industry-leading silicon and software vendors allow Adeneo Embedded to apply its experience to a wide range of embedded solutions for the automotive, industrial, medical, multi-media, navigation, networking, mobile and wireless markets. Adeneo Embedded has a global sales and support network backed by engineering offices in North America and Europe.
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