ATP Reveals 3D NAND SSD product line at Embedded World 2017
|3D NAND SSD product line by ATP Electronics|
The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP’s in-house self-packaging technology.
Available form factors include 2.5”, mSATA, SlimSATA and M.2 in various capacities,
including intermediate densities such as 192GB, 384GB and 768GB.
The products will be showcased at ATP’s booth in Hall 1, Booth #1-655.
Benefits of 3D NAND compared to planar NAND
By stacking more layers vertically, greater capacities, such as 1TB, 1.5TB and 2TB, are made possible through 3D NAND.
Lower cost per bit
Compared to planar NAND, 3D NAND shows greater cost advantage as the capacity increases.
Increased longevity and supply flexibility through ATP's die packaging
Our high end manufacturing facility is capable of processing NAND wafer dies into ATP’s own SDP, DDP, QDP or ODP BGA packages. This significantly simplifies supply chain planning and results in higher flexibility and better lead times. At the same time, it allows us to offer better longevity for our products through extended wafer supply agreements with our manufacturers.
ATP is a leading manufacturer of high performance, high quality and durable NAND flash memory solutions as well as DRAM memory modules. With over twenty years of experience in the design, manufacturing and support of memory products, ATP continues to focus on mission critical applications such as industrial automation, telecom, medical and enterprise computing where high levels of technical support, performance consistency and wide operating temperature ranges are required. As a true manufacturer, ATP offers in house design, testing and product tuning. ATP also offers extensive supply chain support with controlled/fixed BOM’s and long product life cycles. For more information on ATP products please visit www.atpinc.com, or contact us at Info@atpinc.com.