Live eConference to Cover Latest Issues in Electronics Thermal Management coolingZONE-15 Summit addresses thermal management of IoT

The 15th annual coolingZONE Thermal Management Summit for electronics thermal engineers take place October 20-22, 2015 in a globally-accessible, online summit covering thermal management, heat transfer and energy transport at all hardware levels from individual components to the Internet of Things.

A key focus of this year’s event is on cooling technologies for the Internet of Things (IoT). Speakers will address the full spectrum of cooling from wearables to data centers (The Cloud).

Across the three days of general presentations, engineers will gain a deeper understanding of electronics cooling across many thermal topics, including:

• Data Center Predictive Real Time Thermal Management, presented by Dr. Cliff Federspiel

• Computer Server Open Bath Immersion Cooling, presented by Phil Tuma

• The IceCool DARPA Project, presented by Dr. Mehdi Asheghi

• Liquid Cooling of 10Kw Racks, presented by Henry Coles

• Heat Pipes, presented by Dr. Rahul Mulinti

• Cooling Wearables and Handhelds with Flexible Thermal Ground Planes, presented by Dr. Y.C. Lee

coolingZONE-15 also offers two separate technical courses:

Thermosyphons: How to Properly Size, Choose and Deploy, by Vineet Barot, and Analytical Modeling in Thermal Management Design, by Dr. Kaveh Azar

The complete list of speakers and topics, plus the full schedule and registration tools for attending coolingZONE-2015 can be found on the coolingZONE website

The general coolingZONE-2015 three-day summit is US $165.75, which includes a 15% discount on the regular $195 price through October 5. Individual sessions during the general coolingZONE summit can be attended for $41.65 during the 15% discount period. The Thermosyphons and Analytical Modeling courses are each priced at $165.75 each through the discount period.

More information on coolingZONE-2015 can be found on the coolingZONE website, including online registration tools. Questions can be sent to


About coolingZONE

coolingZONE is a global community for people who need or provide solutions for today's electronics cooling problems. The primary objective of this community is to provide an effective communication platform for engineers and industry suppliers who are active in the field of thermal management. Its ultimate goal is to increase the productivity of thermal engineers in designing and implementing cost-effective solutions and help them reduce inefficiencies in their daily professional work.

Presented as a live webcast, coolingZONE-15 Thermal Management Summit is an engineering and technical conference for all professionals in thermal management, electronics cooling, heat transfer and energy transport. The lead sponsor of the coolingZONE summits, Advanced Thermal Solutions, Inc. (ATS) in its 26th year, is a leading-edge engineering/manufacturing company focused on the thermal management of electronics.