Xincomm Selects CEVA DSP Core for LTE Baseband Chipsets
Xincomm adopts high-performance CEVA-X DSP core for 4G TDD/FDD-LTE terminal processors
MOUNTAIN VIEW, Calif., March 21, 2011 – CEVA, Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Xincomm Communications [China] has licensed the CEVA-X DSP to power its next-generation TDD/FDD-LTE UE baseband SoC. The CEVA-X provides an energy-efficient, powerful and flexible DSP engine for Xincomm’s 4G multimode processor designs targeting high volume markets.
“We are pleased to be working with the world’s leading licensor of DSPs for our next-generation LTE baseband chipsets,” said Xiangguo Tang, CEO of Xincomm. “The CEVA-X DSP delivers the optimal balance of performance and programmability while lowering the overall cost of deployment for our LTE processors. This unique combination enables us to efficiently address mass market LTE chipset requirements targeting China and beyond.”
“A new era of 4G connectivity based on the LTE standard opens the door to a host of new companies like Xincomm to address this lucrative market,” said Eran Briman, vice president of marketing at CEVA. “Their teams previous experience in developing high-performance, low power connectivity chipsets will serve them well as they turn their focus to LTE terminals. Licensing our CEVA-X DSP lowers Xincomm’s overall cost of ownership for developing their LTE chipsets, while also providing a clear roadmap to LTE Advanced.”
CEVA's industry-leading DSP cores power many of the world's leading wireless semiconductors, enabling unrivalled power consumption, performance and cost efficiencies in 2G / 3G / 4G solutions. The Company’s wireless customer base includes Mindspeed, Broadcom, Intel, Samsung, Spreadtrum, ST-Ericsson, VIA Telecom and now Xincomm. Including 12 design wins for LTE, CEVA has more than 35 cellular baseband design wins to date, targeting a wide range of handset, mobile broadband and wireless infrastructure applications. In total, more than 1 billion CEVA-powered cellular baseband processors have shipped.
About Xincomm Communications
Xincomm Communications Co. Ltd. is a fabless communication chipset provider founded by industry veterans, including world-class academia, Silicon Valley experts, and high-tech elites in China. The founding team has extensive experience in developing high performance low power consumption solutions for WiFi, DSL and Mobile WiMAX MIMO chipsets. Recognizing the significant market potential of the next generation wireless communication technology, the company is currently focusing on the development of TDD/FDD-LTE dual mode UE baseband SoC. For more information, visit www.xincomm.com.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.