Industrial

FIT and Point2 Partner to Redefine Data Center Connectivity for AI-Driven Workloads
August 6, 2025
Point2 Technology and Foxconn Interconnect Technology (FIT) have signed a Memorandum of Understanding (MOU) to promote the standardization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. The agreement brings an innovative class of cable interconnects to support the growing need for higher-performance interconnects within hyperscale data centers.
Debug & Test

Teradyne Launches Advanced Tester for HBM2E, HBM3, and HBM4 Devices
August 6, 2025
Teradyne, Inc. announced the Magnum 7H, an innovative memory tester developed to withstand the hefty demands of testing high bandwidth memory (HBM) devices integrated with GPUs and accelerators in next-generation generative AI servers. It offers high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale.
Analog & Power
Multimedia

Timing is Everything: The Future of Precision Timing with SiTime
August 7, 2025
In this episode of Embedded Insiders, we’re joined by Piyush Sevalia, Executive Vice President of Marketing at SiTime, to discuss the evolving landscape of precision timing solutions and the shift from quartz to silicon-based MEMS.
Next, Ken is back with another edition of ICYMI, where he updates us on some of the top embedded news stories, and this week we’ve got news from Shelly Group, Emerson, and Cincoze.
But first, Ken and I share our opinions on today’s modern precision timing solutions.
Analog & Power
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Wanzl and Bicker Collaborate on SlidingDoor with Supercap-Based Emergency Power Supply
August 05, 2025
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Embedded Executive: Infineon Looks To Capture GaN Market
July 30, 2025
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Maximize Power Capability in Thermal Design—Part 1: The Basics
July 25, 2025
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Infineon XENSIV™ Magnetic 3D Sensor Enables High-Precision Position Detection
July 10, 2025
Automotive
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ASA Alliance Welcomes Mixel’s Groundbreaking ASA-ML v2.1 SerDes IP Offering
July 23, 2025
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Embedded Executive: Where To Place the Compute In a Car | NXP
July 23, 2025
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Expanding Digital Keys, Accelerating Automotive Storage, and AGI
July 10, 2025
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Embedded Executive: AI Drives Autonomous Buses | Mozee
July 09, 2025
Consumer
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Status Audio and Knowles Redefine Earbud Performance with Hybrid Driver Technology
July 15, 2025
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Application Highlight: Infineon Connects Smart Lighting Systems
July 07, 2025
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Active Cooling for Smart Glasses: xMEMS Integrates µCooling into Eyewear Frames
June 30, 2025
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HIDs Happily Ride the Coattails of Bluetooth® LE
June 23, 2025
Debug & Test
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Teradyne Launches Advanced Tester for HBM2E, HBM3, and HBM4 Devices
August 06, 2025
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GÖPEL electronic Introduces Versatile Battery Test Solution with CAN-BUS Integration and Real-Time Data Reporting
July 14, 2025
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Real-World Bluetooth® LE Testing
June 20, 2025
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Hardware in the Loop Testing for Embedded Systems Development
June 09, 2025
IoT
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Cincoze’s Fanless GM-1100 Accelerates AI Vision for AOI and Airport Security Applications
July 24, 2025
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Living Optics and AVerMedia Collaborate to Deliver Smarter Vision at the Edge
July 18, 2025
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BIOSTAR Debuts Rugged EdgeComp MS-1335U, Ideal for Self-Service Terminals and Smart City Systems
July 14, 2025
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Designing Resilient Edge Systems for the AI Era
July 08, 2025
Open Source
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Embedded Evolution: A New RISC-V CEO & AI-Powered Platforms
June 12, 2025
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Secure Hardware Automation Comes to GitLab CI
June 11, 2025
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SiFive and Red Hat Collaborate on Enterprise Linux for RISC-V
June 10, 2025
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LDRA Enhances Renesas Ecosystem with Seamless Functional Safety and Cybersecurity Verification
June 09, 2025
Software & OS
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Powering the Future: How CSMS is Revolutionizing EV Charging
July 21, 2025
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Harness Platform Flexibility for Rapid Development
June 25, 2025
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Accelerate Your Embedded Systems Career with Complimentary QNX Neutrino RTOS Training
June 10, 2025
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Book Release: Embedded Real-Time Operating System Design - RTOS.X: Theory, Analysis, Performance and Portability
June 09, 2025
HPC/Datacenters
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New Eagle Launches Edge AI Raptor HPC Platform with John Deere VPU
April 28, 2025
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Embedded Executive: You Can Have Lots of Power or Performance, But Not Both | Micron
April 16, 2025
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OSS Unveils Ultra-Dense 16-Way GPU Expansion System
March 19, 2025
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CES 2025: DFI and DEEPX Pioneer Low-Power, High-Performance AI for Smart Cities
January 03, 2025