Industrial

Registration Now Open: AI, Robotics, and Data Centers Take Center Stage at COMPUTEX 2025
April 10, 2025
Registration for COMPUTEX 2025 Keynote is now open. The exhibition will take place from May 20th to 23rd at the Taipei Nangang Exhibition Center Halls 1 and 2. A day before the show, on May 19th, the COMPUTEX Keynote will take place, highlighting NVIDIA, Qualcomm, Hon Hai Technology Group (Foxconn), MediaTek, and NXP introducing the next generation of industrial developments.
Automotive
Multimedia

DevTalk with Rich and Vin: Reverse Engineering
April 10, 2025
Just about everybody in the engineering space has reverse-engineered a product at some point. It might have been for professional reasons, like seeing how a competitor is attacking a problem or simply seeing how they engineered a product. Or it could have been for personal reasons, because the product stopped working, or simply because they wanted to.
Note: If you search for “Tear Down” on Embedded Computing Design, you can see the products we’ve reverse-engineered.
Then there are those people, like the folks at emproof, who get paid to reverse-engineer products, particularly on the software side. Tim Blazytko, the company’s Chief Scientist, Head of Engineering, and Co-Founder, joined us on this episode of DevTalk with Rich and Vin to share some of his experiences with reverse engineering.
Analog & Power
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The BMR316 Series from Flex Power Modules
March 27, 2025
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Samtec Halo Optical Transceivers to Pave Way for High Performance
March 26, 2025
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Flex Power Modules Unveiled Advanced AI-Optimized Power Solutions at embedded world 2025
March 17, 2025
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embedded world Product Showcase: AMD’s Spartan UltraScale+ FPGA
March 11, 2025
Healthcare
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Optimizing Connectivity for Smart Medical Tools
February 03, 2025
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Revolutionizing Health: MEMS Accelerometer Applications in Medical and Healthcare
January 28, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
January 09, 2025
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Wincomm’s Medical-Grade WMP-27T-PIS Series Recognized for Outstanding Design and Performance
November 18, 2024
Industrial
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Tackling Obsolescence: ByteSnap’s New Report Provides Roadmap to Resilience for Electronics-Heavy Industries
April 09, 2025
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Phoenix Contact’s MCS Housing System Enables Easy Mounting and Maintenance for PCB Installations
April 08, 2025
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Next-Gen Edge AI: DFI Introduces Rugged, Compact, and Medical-Focused AI Systems
April 07, 2025
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Cincoze Expands CRYSTAL Line with 15.6-Inch FHD Displays for Rugged HMI Applications
April 07, 2025
IoT
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onsemi’s Hyperlux ID: 3D Vision for Robotics, Manufacturing, and Security
April 01, 2025
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Syslogic Expands RML A4AGX Capabilities
March 31, 2025
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STMicroelectronics Unveils STM32U3 MCUs with Power-Saving Innovations for Smart IoT
March 25, 2025
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embedded world 2025: APLEX Highlighted AI-Driven Edge Computing and Industrial HMIs
March 17, 2025
Storage
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Alliance Memory Unveils Compact 32Mb SRAM for Consumer, Industrial, and Automotive Markets
April 03, 2025
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Memory-Retaining Transistors Mark a Leap Forward in Electronics Design
March 24, 2025
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Western Digital Powers the Future of Data with High-Capacity HDDs and RAID Systems
March 20, 2025
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The Road to embedded world: BIWIN’s Mini SSD Brings Lightning-Fast Speeds and Rugged Durability
February 25, 2025
Networking & 5G
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Embedded Executive: Yes, You Can Do This With Bluetooth | Blecon
March 26, 2025
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Bluetooth: New Specifications and New Capabilities
March 18, 2025
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Embedded Executive: The Evolution of a Wireless Standard, LoRa Alliance
February 05, 2025
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Satellite Connectivity for Vehicles: RN941Y Module Brings Reliable Communication to Remote Areas
January 10, 2025
Processing
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Embedded Executive: Chip Design Is Not Getting Easier | Siemens
April 02, 2025
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Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
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Lantronix and Teledyne FLIR Deliver Cutting-Edge AI Vision with Advanced Image Processing
March 26, 2025
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AMD Unveils 5th Gen AMD EPYC Embedded Processors for Networking, Storage, and Industrial Edge Markets
March 13, 2025
HPC/Datacenters
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CES 2025: DFI and DEEPX Pioneer Low-Power, High-Performance AI for Smart Cities
January 03, 2025
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Flex Power Modules’ Game-Changing Solutions for AI/ML Data Centers
December 06, 2024
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ADATA and Advantech Team Up to Power AI Workloads with Advanced HPC Servers
December 05, 2024
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Navitas Combines GaN and SiC Technologies for Industry-Leading 98% Efficient 8.5kW PSU
November 25, 2024